18516974. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
PACKAGE STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Kai-Chiang Wu of Hsinchu City (TW)
Yen-Ping Wang of Changhua County (TW)
PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18516974 titled 'PACKAGE STRUCTURE
Simplified Explanation
The abstract describes a package structure comprising a semiconductor package, a stacked patch antenna structure, and conductive connectors connecting the two components with an air cavity in between.
- The package structure includes a semiconductor package with a die.
- A stacked patch antenna structure is placed on the semiconductor package, separated by an air cavity.
- Multiple conductive connectors are positioned in the air cavity to link the semiconductor package and the stacked patch antenna structure.
Potential Applications
- Wireless communication devices
- IoT devices
- RFID technology
Problems Solved
- Integration of antenna structures with semiconductor packages
- Efficient signal transmission between components
- Space-saving design
Benefits
- Improved signal quality
- Compact package design
- Enhanced performance in wireless communication devices
Original Abstract Submitted
Provided is a package structure and a method of forming the same. The package structure includes a semiconductor package, a stacked patch antenna structure, and a plurality of conductive connectors. The semiconductor package includes a die. The stacked patch antenna structure is disposed on the semiconductor package, and separated from the semiconductor package by an air cavity. The plurality of conductive connectors is disposed in the air cavity between the semiconductor package and the stacked patch antenna structure to connect the semiconductor package and the stacked patch antenna structure.
