17844802. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
YONGJIN Seol of Seongnam-si (KR)
SEONHYANG You of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17844802 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The patent application describes a semiconductor package that includes a package substrate, a semiconductor chip, a mold layer, an antenna pattern, and a connection terminal.
- The package substrate is the base of the semiconductor package.
- The semiconductor chip is placed on the package substrate.
- The mold layer covers the semiconductor chip and has a trench on one side.
- The trench extends from the top surface to the bottom surface of the mold layer.
- An antenna pattern is formed on the mold layer.
- A connection terminal fills the trench and connects the antenna pattern to the package substrate.
Potential applications of this technology:
- Wireless communication devices
- Internet of Things (IoT) devices
- Mobile phones and tablets
- RFID tags
Problems solved by this technology:
- Integration of an antenna into a semiconductor package
- Efficient use of space within the package
- Improved signal transmission and reception
Benefits of this technology:
- Compact design
- Enhanced performance of wireless communication
- Cost-effective manufacturing process
Original Abstract Submitted
A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, a mold layer on the package substrate to cover the semiconductor chip, the mold layer having a first side surface and a first trench disposed at the first side surface, and the first trench extending from a top surface of the mold layer toward a bottom surface of the mold layer, an antenna pattern on the mold layer, and a first connection terminal filling the first trench. The antenna pattern is electrically connected to the package substrate through the first connection terminal.
