Texas instruments incorporated (20240113050). SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to traditional antenna integration methods?
- 1.11 What are the potential challenges in implementing this technology on a large scale?
- 1.12 Original Abstract Submitted
SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS
Organization Name
texas instruments incorporated
Inventor(s)
Juan Herbsommer of Allen TX (US)
Rajen Manicon Murugan of Dallas TX (US)
SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113050 titled 'SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS
Simplified Explanation
The semiconductor package described in the abstract includes a semiconductor die, a conductive member, and a multi-layer package substrate with horizontal metal layers, vertical members, and a mold compound. The structure formed by the metal layers and vertical members includes a conductive strip, a transition member, a waveguide, and a horn antenna.
- The semiconductor package includes a semiconductor die, a conductive member, and a multi-layer package substrate.
- The multi-layer package substrate consists of horizontal metal layers, vertical members, and a mold compound.
- The structure formed by the metal layers and vertical members includes a conductive strip, a transition member, a waveguide, and a horn antenna.
Potential Applications
This technology could be applied in:
- Wireless communication devices
- Radar systems
- Satellite communication systems
Problems Solved
This technology helps in:
- Improving signal transmission
- Enhancing antenna performance
- Reducing interference
Benefits
The benefits of this technology include:
- Higher data transmission rates
- Improved signal quality
- Enhanced communication range
Potential Commercial Applications
This technology could be commercially used in:
- Mobile phones
- Satellite communication devices
- Radar systems
Possible Prior Art
One possible prior art for this technology could be:
- Existing semiconductor packaging techniques
- Antenna integration methods
Unanswered Questions
How does this technology compare to traditional antenna integration methods?
This article does not provide a direct comparison between this technology and traditional antenna integration methods. Further research or analysis would be needed to determine the specific advantages or disadvantages of this approach.
What are the potential challenges in implementing this technology on a large scale?
The article does not address the potential challenges in implementing this technology on a large scale. Factors such as cost, scalability, and compatibility with existing systems could pose challenges that need to be explored further.
Original Abstract Submitted
in some examples, a semiconductor package includes a semiconductor die; a conductive member coupled to the semiconductor die; and a multi-layer package substrate. the multi-layer package substrate includes a first horizontal metal layer to provide a ground connection; a second horizontal metal layer above the first horizontal metal layer; vertical members coupling to the first and second horizontal metal layers; and a mold compound covering the first and second horizontal metal layers and the vertical members. the first horizontal metal layer, the second horizontal metal layer, and the vertical members together form a structure including a conductive strip coupled to the conductive member, a transition member coupled to the conductive strip, a waveguide coupled to the transition member, and a horn antenna coupled to the waveguide.
