17937474. PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract (Intel Corporation)
Contents
- 1 PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing solutions in terms of cost-effectiveness?
- 1.11 What are the environmental implications of using air gap structures in microelectronic assemblies?
- 1.12 Original Abstract Submitted
PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES
Organization Name
Inventor(s)
Kristof Kuwawi Darmawikarta of Chandler AZ (US)
Cemil S. Geyik of Gilbert AZ (US)
Tarek A. Ibrahim of Mesa AZ (US)
Wei-Lun Jen of Phoenix AZ (US)
Zhiguo Qian of Chandler AZ (US)
Dilan Seneviratne of Phoenix AZ (US)
PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17937474 titled 'PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES
Simplified Explanation
The abstract describes a microelectronic assembly with a package substrate containing organic dielectric material and conductive traces, as well as integrated circuit dies coupled to the substrate. The conductive traces include stripline traces or microstrips surrounded by air gap structures in the organic dielectric material.
- Package substrate with buildup layers of organic dielectric material and conductive traces
- Integrated circuit dies coupled to the package substrate
- Conductive traces include stripline traces or microstrips surrounded by air gap structures
- Air gap structures exposed on the first surface of the substrate
Potential Applications
The technology described in this patent application could be applied in the following areas:
- High-speed data processing
- Telecommunications equipment
- Automotive electronics
Problems Solved
This technology helps address the following issues:
- Signal interference
- Signal loss
- Heat dissipation
Benefits
The benefits of this technology include:
- Improved signal integrity
- Enhanced performance
- Reduced power consumption
Potential Commercial Applications
The technology could find commercial applications in:
- 5G infrastructure
- Autonomous vehicles
- Internet of Things (IoT) devices
Possible Prior Art
One possible prior art for this technology could be the use of air gap structures in microelectronic assemblies to improve signal integrity and reduce interference.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
Answer: The article does not provide information on the cost-effectiveness of this technology compared to existing solutions.
What are the environmental implications of using air gap structures in microelectronic assemblies?
Answer: The article does not address the environmental impact of incorporating air gap structures in microelectronic assemblies.
Original Abstract Submitted
Embodiments of a microelectronic assembly that includes: a package substrate, comprising buildup layers of an organic dielectric material and a plurality of layers of conductive traces in the organic dielectric material, the package substrate having a first surface and a second surface opposite the first surface; and a plurality of integrated circuit (IC) dies coupled to the package substrate on the first side. The plurality of layers of conductive traces comprises a pair of stripline traces or microstrips in one of the layers, the stripline traces or microstrips are surrounded by air gap structures in the organic dielectric material, and the air gap structures are exposed on the first surface.
