17808221. ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Anil Yuksel of Austin TX (US)

Jose A. Hejase of Pflugerville TX (US)

Junyan Tang of Austin TX (US)

Pavel Roy Paladhi of Pflugerville TX (US)

Joshua Myers of Austin TX (US)

ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT - A simplified explanation of the abstract

This abstract first appeared for US patent application 17808221 titled 'ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT

Simplified Explanation

The abstract describes a multi-chip package structure that includes two IC chips and a fluid conduit. The structure is designed to remove heat generated by the IC chips. The fluid conduit is thermally coupled to both IC chips and allows for the transmission of electromagnetic signals between them.

  • The multi-chip package structure includes two IC chips and a fluid conduit.
  • The fluid conduit is thermally coupled to both IC chips.
  • The structure is designed to remove heat generated by the IC chips.
  • A first monopole feed is connected between the first IC chip and one end of the fluid conduit.
  • A second monopole feed is connected between the second IC chip and the other end of the fluid conduit.
  • The first monopole feed transmits electromagnetic signals through the fluid conduit to the second monopole feed, and vice versa.

Potential Applications

  • This technology can be applied in various electronic devices that require efficient heat dissipation, such as computers, servers, and mobile devices.
  • It can be used in high-performance computing systems where multiple IC chips generate significant heat.
  • The multi-chip package structure can be utilized in telecommunications equipment to improve thermal management.

Problems Solved

  • The multi-chip package structure solves the problem of heat accumulation in IC chips by providing an efficient heat removal mechanism.
  • It addresses the challenge of maintaining optimal operating temperatures in electronic devices with multiple IC chips.
  • The technology solves the issue of electromagnetic signal transmission between IC chips in a thermally coupled system.

Benefits

  • The structure allows for effective heat dissipation, preventing overheating and potential damage to IC chips.
  • It enables efficient thermal management in electronic devices, improving their overall performance and reliability.
  • The transmission of electromagnetic signals through the fluid conduit enhances communication and data transfer between IC chips.


Original Abstract Submitted

A multi-chip package structure is provided. The multi-chip package structure includes a first IC chip and a second IC chip, and a fluid conduit thermally coupled to the first IC chip and the second IC chip. The multi-chip package structure is configured to remove heat generated by at least one of the first IC chip and the second IC chip. The fluid conduit has a first end and a second end opposite to the first end. The multi-chip package structure also includes a first monopole feed connected between the first IC chip and the first end of the fluid conduit, and a second monopole feed connected between the second IC chip and the second end of the fluid conduit. The first monopole feed is configured to transmit an electromagnetic signal through the fluid conduit toward the second monopole feed and vice versa.

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