US Patent Application 18232978. SEMICONDUCTOR MODULE simplified abstract
Contents
SEMICONDUCTOR MODULE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Takuma Nishimura of Tokyo (JP)
Hidenori Ishibashi of Tokyo (JP)
Yutarou Yamaguchi of Tokyo (JP)
SEMICONDUCTOR MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18232978 titled 'SEMICONDUCTOR MODULE
Simplified Explanation
The patent application describes a semiconductor module that includes various components for signal transmission and heat dissipation.
- The module consists of a semiconductor element with signal and ground terminals on its front face.
- A transmission line body is present with a signal transmission portion and a ground portion.
- A signal connection terminal is electrically connected to the signal transmission portion, while ground connection terminals surround the signal connection terminal and are connected to the ground portion.
- These terminals form a pseudo coaxial line.
- A heat dissipation plate is in close contact with the back face of the semiconductor element.
- An interposer substrate is included, which has a semiconductor-element signal pad connected to the signal terminal of the semiconductor element using a conductive adhesive.
- The interposer substrate also has a transmission-line-body-2 signal pad connected to the signal connection terminal, and a ground portion connected to the ground connection terminals.
Original Abstract Submitted
A semiconductor module includes: a semiconductor element having, on a front face thereof, a signal terminal and a ground terminal; a transmission line body having a signal transmission portion and a ground portion; a signal connection terminal electrically connected to the signal transmission portion of the transmission line body; ground connection terminals arranged to surround the signal connection terminal and electrically connected to the ground portion of the transmission line body, the ground connection terminals and the signal connection terminal constituting a pseudo coaxial line; a heat dissipation plate having a front face in close contact with a back face of the semiconductor element; and an interposer substrate having a semiconductor-element signal pad electrically connected to the signal terminal of the semiconductor element by a conductive adhesive, a transmission-line-body-2 signal pad electrically connected to the signal connection terminal, and a ground portion electrically connected to the ground connection terminals.
