17742862. SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Juyoun Choi of Hwaseong-si (KR)

Eunjung Lee of Yongin-si (KR)

Junho Lee of Suwon-si (KR)

Seungsoo Ha of Seongnam-si (KR)

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17742862 titled 'SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME

Simplified Explanation

The abstract describes a semiconductor package that includes a pair of differential signal wiring lines, a lower equal potential plate, an upper equal potential plate, and a wiring insulating layer.

• The semiconductor package includes a pair of differential signal wiring lines that are parallel and spaced apart from each other.
• There is a lower equal potential plate in a lower wiring layer under the signal wiring layer.
• An upper equal potential plate is present in an upper wiring layer above the signal wiring layer.
• A wiring insulating layer fills the spaces between the signal wiring layer, lower wiring layer, and upper wiring layer.
• At least one of the lower equal potential plate and the upper equal potential plate includes an impedance opening that overlaps the pair of differential signal wiring lines in a vertical direction and is filled by the wiring insulating layer.

Potential applications of this technology:

• This semiconductor package can be used in various electronic devices such as smartphones, tablets, laptops, and other computing devices.
• It can be utilized in high-speed data transmission systems, such as in telecommunications and networking equipment.

Problems solved by this technology:

• The semiconductor package helps in reducing signal interference and crosstalk between the differential signal wiring lines.
• It provides improved signal integrity and reliability in high-speed data transmission.

Benefits of this technology:

• The design of the semiconductor package helps in minimizing signal degradation and distortion.
• It enhances the overall performance and efficiency of electronic devices.
• The reduced signal interference leads to better data transmission quality and faster communication speeds.

Original Abstract Submitted

Provided is a semiconductor package including a pair of differential signal wiring lines including a first differential signal wiring line and a second differential signal wiring line, extending parallel to and spaced apart from each other, a lower equal potential plate in a lower wiring layer under the signal wiring layer, an upper equal potential plate in an upper wiring layer above the signal wiring layer, and a wiring insulating layer adjacent to the pair of differential signal wiring lines, the lower equal potential plate, and the upper equal potential plate, the wiring insulating layer filling spaces between the signal wiring layer, the lower wiring layer, and the upper wiring layer, at least one of the lower equal potential plate and the upper equal potential plate including an impedance opening overlapping the pair of differential signal wiring lines in a vertical direction and is filled by the wiring insulating layer.