17850187. SEMICONDUCTOR DEVICE WITH MULTIPLE DIES simplified abstract (Texas Instruments Incorporated)

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SEMICONDUCTOR DEVICE WITH MULTIPLE DIES

Organization Name

Texas Instruments Incorporated

Inventor(s)

YIQI Tang of Allen TX (US)

RAJEN MANICON Murugan of Dallas TX (US)

SEMICONDUCTOR DEVICE WITH MULTIPLE DIES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17850187 titled 'SEMICONDUCTOR DEVICE WITH MULTIPLE DIES

Simplified Explanation

The abstract describes a semiconductor device that includes a multi-layer package substrate. The substrate has multiple layers patterned to provide pads and vias for connecting ports of two different dies. The substrate also includes traces and a ground plane for coupling the ports of the first die to the ports of the second die.

  • The semiconductor device includes a multi-layer package substrate.
  • The substrate has multiple layers patterned to provide pads for the ports of the first and second dies.
  • The substrate also has vias that connect the pads for the ports of the first die to the pads for the ports of the second die.
  • The substrate includes traces on a third layer that couple the vias connected to the ports of the first die to the vias connected to the ports of the second die.
  • The traces on the third layer have a specific width.
  • The substrate also includes a fourth layer and a ground plane underlying the fourth layer.

Potential Applications

  • This technology can be used in various semiconductor devices, such as integrated circuits and microprocessors.
  • It can be applied in electronic devices like smartphones, tablets, and computers.
  • It can be used in automotive electronics, aerospace systems, and industrial equipment.

Problems Solved

  • The multi-layer package substrate solves the problem of connecting ports of different dies in a semiconductor device.
  • It provides a reliable and efficient way to couple the first die to the second die.
  • The use of vias and traces ensures proper signal transmission between the dies.

Benefits

  • The multi-layer package substrate allows for compact and space-efficient designs.
  • It provides a high level of integration and connectivity between different dies.
  • The technology enables faster and more efficient data transfer between the dies.
  • It improves the overall performance and reliability of the semiconductor device.


Original Abstract Submitted

A semiconductor device includes a first die having ports and a second die having ports. The semiconductor device includes a multi-layer package substrate. The multi-layer package substrate includes a first layer patterned to include pads for the ports of the first die and the second die and a second layer patterned to provide vias between the pads for the ports of the first die and pads for the ports of the second die and a third layer of the multi-layer package substrate. The third layer is patterned to provide traces that couple the vias coupled to ports of the first die to vias coupled to ports of the second die to couple the first die to the second die, the traces of the third layer having a width. The multi-layer package substrate also includes a fourth layer underlying the third layer and a ground plane underlying the fourth layer.

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