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Category:H01L23/495
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Pages in category "H01L23/495"
The following 78 pages are in this category, out of 78 total.
1
- 17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation)
- 17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)
- 17945835. VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT LOOP POWER PAD simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17957359. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 18104554. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18104554. SEMICONDUCTOR DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18134464. POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE SAME simplified abstract (Hyundai Motor Company)
- 18134464. POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE SAME simplified abstract (Kia Corporation)
- 18174610. LEAD FRAME AND SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18178973. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18188368. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18249473. METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS simplified abstract (Rohm Co., Ltd.)
- 18256150. SEMICONDUCTOR EQUIPMENT simplified abstract (Rohm Co., Ltd.)
- 18274747. Power Semiconductor Device simplified abstract (HITACHI ASTEMO, LTD.)
- 18334304. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18344981. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18390395. STANDALONE ISOLATION CAPACITOR simplified abstract (Texas Instruments Incorporated)
- 18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation)
- 18453713. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18453991. POWER SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18467779. METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD simplified abstract (NEXPERIA B.V.)
- 18467786. REDUCED STRESS CLIP FOR SEMICONDUCTOR DIE simplified abstract (NEXPERIA B.V.)
- 18495697. SEMICONDUCTOR DEVICE PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18508007. SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION simplified abstract (STMICROELECTRONICS S.R.L.)
- 18522271. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18527457. SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER THE IC simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18537324. INSULATION MODULE simplified abstract (Rohm Co., Ltd.)
- 18538483. SEMICONDUCTOR DEVICE simplified abstract (Rohm Co., Ltd.)
- 18538641. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Rohm Co., Ltd.)
- 18551569. SEMICONDUCTOR DEVICE AND INVERTER UNIT simplified abstract (Mitsubishi Electric Corporation)
2
- 20240013979. STACKED CERAMIC CAPACITOR PACKAGE FOR ELECTRONIC DEVICE simplified abstract (AMOTECH CO., LTD.)
- 20240014105. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 20240030108. TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- 20240038635. SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN simplified abstract (ROHM CO., LTD.)
- 20240047317. PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES simplified abstract (Littelfuse Semiconductor (Wuxi) Co., Ltd.)
- 20240055393. PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS simplified abstract (Invensas LLC)
- 20240087991.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 25th, 2024
- Blockchain patent applications on March 14th, 2024
- Blockchain patent applications on March 21st, 2024
D
H
I
- Intel corporation (20240112971). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract
- Intel Corporation patent applications on April 25th, 2024
- Intel Corporation patent applications on April 4th, 2024
K
M
- Micron Technology, Inc. patent applications on February 15th, 2024
- Micron Technology, Inc. patent applications on February 8th, 2024
- Mitsubishi electric corporation (20240136257). POWER SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi Electric Corporation patent applications on April 25th, 2024
- Murata Manufacturing Co., Ltd. patent applications on January 18th, 2024
S
T
U
- US Patent Application 17826764. LASER ABLATION FOR DIE SEPARATION TO REDUCE LASER SPLASH AND ELECTRONIC DEVICE simplified abstract
- US Patent Application 17828947. DIE ATTACH FILM DIE PAD ISOLATION FOR SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 18029105. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE simplified abstract
- US Patent Application 18196436. SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18248990. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR COMPONENT INCLUDING THE SAME simplified abstract
- US Patent Application 18324897. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18449360. SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE DESIGN METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
- US Patent Application 18450291. INTEGRATED MAGNETIC ASSEMBLY WITH CONDUCTIVE FIELD PLATES simplified abstract