Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS

Organization Name

intel corporation

Inventor(s)

Debendra Mallik of Chandler AZ (US)

Je-Young Chang of Tempe AZ (US)

Ram Viswanath of Phoenix AZ (US)

Elah Bozorg-grayeli of Chandler AZ (US)

Ahmad Al Mohammad of Portland OR (US)

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240136244 titled 'IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS

Simplified Explanation

The patent application describes a method of assembling thermal heat spreaders and/or an IC die with solderable thermal structures using a solder array thermal interconnects. The heat spreader and IC die have metallized surfaces suitable for bonding to a solder alloy, which acts as a thermal interface material between the two components. The IC die may also have a metallized back-side surface for bonding to a thermal interconnect comprising a solder alloy. The metallization on the IC die and heat spreader includes solderable structures, allowing for a secure bond. Additionally, the technology can accommodate multiple IC die with different thicknesses in a multi-chip package by adjusting the z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.

• Thermal heat spreaders and IC die can be assembled together using solder array thermal interconnects.
• Metallized surfaces on the heat spreader and IC die allow for bonding to a solder alloy.
• Solderable structures on the IC die and heat spreader ensure a secure bond.
• The technology can accommodate multiple IC die with different thicknesses in a multi-chip package.

Potential Applications

This technology can be applied in the manufacturing of electronic devices, such as computers, smartphones, and other gadgets that require efficient thermal management.

Problems Solved

This technology solves the problem of heat dissipation in electronic devices by providing a reliable and efficient thermal interface between the IC die and the heat spreader.

Benefits

The benefits of this technology include improved thermal performance, increased reliability, and enhanced overall functionality of electronic devices.

Potential Commercial Applications

Potential commercial applications of this technology include the electronics industry, specifically in the production of high-performance computing devices and mobile devices.

Possible Prior Art

One possible prior art for this technology could be the use of thermal interface materials in electronic devices to improve heat dissipation and thermal management.

How does this technology compare to traditional methods of thermal management in electronic devices?

This article does not provide a direct comparison between this technology and traditional methods of thermal management in electronic devices.

What are the potential limitations or challenges of implementing this technology in mass production?

This article does not address the potential limitations or challenges of implementing this technology in mass production.

Original Abstract Submitted

thermal heat spreaders and/or an ic die with solderable thermal structures may be assembled together with a solder array thermal interconnects. a thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an ic die. an ic die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. metallization on the ic die and/or heat spreader may comprise a plurality of solderable structures. a multi-chip package may include multiple ic die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the ic die or heat spreader.