18467779. METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD simplified abstract (NEXPERIA B.V.)
Contents
- 1 METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD
Organization Name
Inventor(s)
Chi Ho Leung of Hong Kong (HK)
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18467779 titled 'METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD
Simplified Explanation
The disclosure provides a method for manufacturing a semiconductor package assembly, which results in a semiconductor package assembly with a more even distributed stress concentrations, reduced solder crack occurrences and limited solder filler joint connections.
- The method involves optimizing the distribution of stress concentrations in the semiconductor package assembly.
- The method aims to reduce occurrences of solder cracks within the assembly.
- The method limits the number of solder filler joint connections to improve the overall quality of the semiconductor package assembly.
Potential Applications
The technology could be applied in the manufacturing of various semiconductor devices such as microprocessors, memory chips, and integrated circuits.
Problems Solved
1. Uneven stress concentrations in semiconductor package assemblies. 2. Solder crack occurrences within semiconductor package assemblies. 3. Excessive solder filler joint connections in semiconductor package assemblies.
Benefits
1. Improved reliability and durability of semiconductor package assemblies. 2. Enhanced performance of semiconductor devices. 3. Cost-effective manufacturing process for semiconductor package assemblies.
Potential Commercial Applications
Optimizing stress distribution in semiconductor package assemblies for improved performance and reliability.
Possible Prior Art
There may be existing methods or technologies in the semiconductor industry that address stress concentrations and solder crack occurrences in package assemblies, but specific prior art is not known at this time.
Unanswered Questions
== How does this method compare to traditional semiconductor package assembly techniques? This article does not provide a direct comparison to traditional methods, leaving the reader to wonder about the specific advantages of this new approach.
== Are there any limitations to the proposed method for manufacturing semiconductor package assemblies? The article does not mention any potential drawbacks or limitations of the disclosed method, leaving room for further exploration of its feasibility and practicality in real-world applications.
Original Abstract Submitted
The disclosure provides a method for manufacturing a semiconductor package assembly, which results in a semiconductor package assembly with a more even distributed stress concentrations, reduced solder crack occurrences and limited solder filler joint connections.
