18344981. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sung Woo Park of Suwon-si (KR)
Hyun Jong Moon of Suwon-si (KR)
Kwang Jin Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18344981 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a die paddle, first and second leads spaced apart from the die paddle on opposite sides, a spacer on the die paddle, a semiconductor die on the spacer, a first wire connecting the semiconductor die to the first lead, and a mold film covering the components.
- Die paddle for mounting components
- Spaced apart first and second leads for connectivity
- Spacer to support semiconductor die
- First wire connecting semiconductor die to first lead
- Mold film for protection and insulation
Potential Applications
- Electronics manufacturing
- Semiconductor packaging industry
- Integrated circuit assembly
Problems Solved
- Efficient and reliable connection of semiconductor components
- Protection of delicate semiconductor die
- Space optimization in semiconductor packaging
Benefits
- Improved performance and reliability of semiconductor devices
- Enhanced durability and longevity of packaged components
- Streamlined manufacturing process for semiconductor packages
Original Abstract Submitted
A semiconductor package including a die paddle, a first lead spaced apart from the die paddle and on one side of the die paddle, a second lead spaced apart from the die paddle and on another side of the die paddle, a spacer on the die paddle, a semiconductor die on the spacer, a first wire configured to connect an upper surface of the semiconductor die to the first lead, and a mold film configured to cover the die paddle, the first lead, the second lead, the spacer, the semiconductor die, and the first wire, wherein a first width of the spacer is greater than a second width of the die paddle so that the spacer overlaps the first lead may be provided.
