US Patent Application 18029105. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE simplified abstract
Contents
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
Organization Name
Inventor(s)
Bungo Tanaka of Kyoto-shi, Kyoto (JP)
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18029105 titled 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
Simplified Explanation
The patent application describes a semiconductor device that includes a semiconductor chip with a principal surface.
- The semiconductor chip has a first conductive layer connected to a first potential and a second conductive layer connected to a second potential higher than the first potential.
- An insulating layer is formed between the first and second conductive layers.
- A first pad is formed in a region separated from the second conductive layer in a plan view and is electrically connected to the first conductive layer.
Original Abstract Submitted
A semiconductor device includes a semiconductor chip that has a principal surface, a first conductive layer that is formed on the principal surface of the semiconductor chip and connected to a first potential, a second conductive layer that opposes the first conductive layer of the principal surface in a normal direction and is connected to a second potential higher than the first potential, an insulating layer that is formed between the first conductive layer and the second conductive layer, and a first pad that is formed in a region separated from a region that opposes the second conductive layer in a first direction in a plan view when the semiconductor chip is viewed in the normal direction and that is electrically connected to the first conductive layer.
