20240013979. STACKED CERAMIC CAPACITOR PACKAGE FOR ELECTRONIC DEVICE simplified abstract (AMOTECH CO., LTD.)
Contents
STACKED CERAMIC CAPACITOR PACKAGE FOR ELECTRONIC DEVICE
Organization Name
Inventor(s)
STACKED CERAMIC CAPACITOR PACKAGE FOR ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240013979 titled 'STACKED CERAMIC CAPACITOR PACKAGE FOR ELECTRONIC DEVICE
Simplified Explanation
The abstract describes a stacked ceramic capacitor package for an electronic device that prevents noise, vibration, and cracks caused by piezoelectric properties. The package includes stacked ceramic capacitors, a first terminal structure connected to one side of the capacitors, and a second terminal structure connected to the opposite side of the capacitors. The first terminal structure has a groove in the area that contacts the capacitors, with the horizontal length of the groove being 30% to 50% of the horizontal length of the capacitors.
- The patent describes a stacked ceramic capacitor package for electronic devices.
- The package includes stacked ceramic capacitors, a first terminal structure, and a second terminal structure.
- The first terminal structure is connected to one side of the stacked ceramic capacitors.
- The second terminal structure is connected to the opposite side of the stacked ceramic capacitors and faces the first terminal structure.
- The first terminal structure has a groove in the area that contacts the capacitors.
- The horizontal length of the groove is 30% to 50% of the horizontal length of the stacked ceramic capacitors.
Potential applications of this technology:
- Electronic devices that require stacked ceramic capacitors.
- Devices that are sensitive to noise, vibration, and cracks caused by piezoelectric properties.
Problems solved by this technology:
- Noise, vibration, and cracks caused by piezoelectric properties in stacked ceramic capacitor packages.
- Ensuring stable performance and reliability of electronic devices.
Benefits of this technology:
- Prevents noise, vibration, and cracks in electronic devices.
- Improves the performance and reliability of electronic devices.
- Provides a solution for the challenges posed by piezoelectric properties in stacked ceramic capacitors.
Original Abstract Submitted
provided is a stacked ceramic capacitor package, for an electronic device, preventing noise, vibration and cracks due to piezoelectric properties. the ceramic capacitor package for an electronic device comprises: stacked ceramic capacitors; a first terminal structure connected to a first side surface of the stacked ceramic capacitors; and a second terminal structure connected to a second side surface of the stacked ceramic capacitors and disposed so as to face the first terminal structure with the stacked ceramic capacitors therebetween. the first terminal structure has a first groove defined in an area coming into contact with the first side surface of the stacked ceramic capacitors. the horizontal length of the first groove is 30% to 50% of the horizontal length of the stacked ceramic capacitors.
