Mitsubishi electric corporation (20240136257). POWER SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 POWER SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the staggered arrangement of terminals on the front surface of the second mold package affect the overall performance of the power semiconductor device?
- 1.11 What materials are used in the construction of the conductor plate, insulator, and mold packages in the power semiconductor device?
- 1.12 Original Abstract Submitted
POWER SEMICONDUCTOR DEVICE
Organization Name
mitsubishi electric corporation
Inventor(s)
Keitaro Ichikawa of Tokyo (JP)
POWER SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136257 titled 'POWER SEMICONDUCTOR DEVICE
Simplified Explanation
The power semiconductor device described in the abstract consists of a conductor plate, an insulator, a lead frame, a first mold package with semiconductor elements, and a second mold package. The lead frame has terminals protruding from one side of the first mold package, which are arranged in a staggered pattern on the front surface of the second mold package.
- Conductor plate, insulator, lead frame, first mold package, and second mold package are the components of the power semiconductor device.
- The lead frame has terminals that are arranged in a staggered pattern on the front surface of the second mold package.
Potential Applications
This technology can be used in various power electronic devices such as inverters, converters, and motor drives.
Problems Solved
This technology helps in improving the thermal performance and reliability of power semiconductor devices by providing efficient heat dissipation and protection from external elements.
Benefits
The power semiconductor device offers enhanced thermal management, increased durability, and improved electrical performance, leading to higher efficiency and longer lifespan.
Potential Commercial Applications
This technology can be applied in industries such as automotive, renewable energy, industrial automation, and consumer electronics for power control and conversion applications.
Possible Prior Art
One possible prior art could be the use of lead frames and mold packages in power semiconductor devices to provide structural support and protection to the semiconductor elements.
Unanswered Questions
How does the staggered arrangement of terminals on the front surface of the second mold package affect the overall performance of the power semiconductor device?
The staggered arrangement of terminals may impact the electrical connectivity and thermal characteristics of the device, but the specific details of this effect are not addressed in the abstract.
What materials are used in the construction of the conductor plate, insulator, and mold packages in the power semiconductor device?
The abstract does not provide information on the specific materials used in the construction of the various components of the power semiconductor device.
Original Abstract Submitted
a power semiconductor device according to the present disclosure includes, in the following order, a conductor plate, an insulator, a lead frame, a first mold package including a plurality of semiconductor elements provided on the lead frame inside thereof, and resin-sealed such that a main surface of the conductor plate opposite to a side on which the insulator is provided is exposed, and a second mold package in which the first mold package is resin-sealed such that the main surface is exposed, in which the lead frame has a plurality of terminals protruding from one side surface of the first mold package, the plurality of terminals are projecting from a front surface of the second mold package opposite to the conductor plate, and the plurality of terminals are alternately arranged to form a staggered pattern closer to one side of the front surface in plan view.
