17945835. VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT LOOP POWER PAD simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
- 1 VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT LOOP POWER PAD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT LOOP POWER PAD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT LOOP POWER PAD
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Dok Won Lee of Mountain View CA (US)
Sreenivasan Koduri of Dallas TX (US)
VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT LOOP POWER PAD - A simplified explanation of the abstract
This abstract first appeared for US patent application 17945835 titled 'VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT LOOP POWER PAD
Simplified Explanation
The electronic device described in the patent application includes a metal heat slug, a semiconductor die, and a package structure. The metal heat slug has three portions, with the second portion spaced apart from the first portion and connected by the third portion. The semiconductor die is attached to the third portion of the metal heat slug to measure a current, and the package structure encloses the semiconductor die and the third portion of the metal heat slug while exposing the sides of the first and second portions.
- Metal heat slug with three portions
- Semiconductor die attached to measure current
- Package structure enclosing components
Potential Applications
The technology described in this patent application could be applied in various electronic devices that require efficient heat dissipation, such as computers, smartphones, and LED lighting systems.
Problems Solved
This technology solves the problem of overheating in electronic devices by providing an effective heat dissipation solution through the metal heat slug and semiconductor die configuration.
Benefits
The benefits of this technology include improved thermal management, increased device performance and reliability, and potentially longer lifespan of electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology could be in the consumer electronics industry, specifically in the manufacturing of high-performance devices that require efficient heat dissipation capabilities.
Possible Prior Art
One possible prior art for this technology could be similar heat dissipation solutions used in electronic devices, such as heat sinks and thermal pads.
Unanswered Questions
How does this technology compare to traditional heat dissipation methods?
This article does not provide a direct comparison between this technology and traditional heat dissipation methods.
What are the specific materials used in the metal heat slug and semiconductor die?
The article does not specify the exact materials used in the metal heat slug and semiconductor die.
Original Abstract Submitted
An electronic device includes a metal heat slug, a semiconductor die, and a package structure. The metal heat slug has a first portion, a second portion, and a third portion, the second portion is spaced apart from the first portion, and the third portion connects the first and second portions. The semiconductor die is attached to the third portion of the metal heat slug to measure a current of the third portion of the metal heat slug, and the package structure encloses the semiconductor die and the third portion of the metal heat slug and exposes sides of the first and second portions of the metal heat slug.
