US Patent Application 18196436. SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kengo Ohmori of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18196436 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a semiconductor device with a switching element and various components.
- The device includes a switching element with three electrodes formed on its surface.
- There are leads that connect the electrodes to external components.
- Bonding layers are used to bond the leads and electrodes together.
- A sealing resin covers the device and has a surface facing the same direction as the element surface.
- The leads have exposed terminal portions at the resin surface.
Original Abstract Submitted
A semiconductor device includes a switching element including an element obverse surface, leads, bonding layers, and a sealing resin. The switching element includes a first electrode, a second electrode, and a third electrode each formed at the element obverse surface. The leads include a first lead, a second lead, and a third lead. The bonding layers include a first bonding layer bonding the first lead and the first electrode, a second bonding layer bonding the second lead and the second electrode, and a third bonding layer bonding the third lead and the third electrode. The sealing resin includes a resin first surface facing in the same direction as the element obverse surface. The first lead, the second lead and the third lead include a first terminal portion, a second terminal portion and a third terminal portion, respectively, which are exposed at the resin first surface.
