18256150. SEMICONDUCTOR EQUIPMENT simplified abstract (Rohm Co., Ltd.)
Contents
- 1 SEMICONDUCTOR EQUIPMENT
SEMICONDUCTOR EQUIPMENT
Organization Name
Inventor(s)
Moe Yamaguchi of Kyoto-shi, Kyoto (JP)
Hiroaki Matsubara of Kyoto-shi, Kyoto (JP)
Yoshizo Osumi of Kyoto-shi, Kyoto (JP)
Tomohira Kikuchi of Kyoto-shi, Kyoto (JP)
Ryohei Umeno of Kyoto-shi, Kyoto (JP)
Taro Nishioka of Kyoto-shi, Kyoto (JP)
SEMICONDUCTOR EQUIPMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18256150 titled 'SEMICONDUCTOR EQUIPMENT
Simplified Explanation
The semiconductor device described in the abstract includes two die pads with semiconductor elements and an insulating element between them to relay signals while electrically insulating the elements. A wire is bonded to one of the semiconductor elements on the first die pad.
- First die pad with a first obverse surface facing in z direction
- Second die pad spaced from the first die pad with a second obverse surface facing in z direction
- First semiconductor element on the first obverse surface
- Second semiconductor element on the second obverse surface
- Insulating element between the semiconductor elements to relay signals and insulate electrically
- Wire bonded to the first semiconductor element
- First die pad includes a first bond portion and a first opening in y direction
Potential Applications
This technology could be applied in the manufacturing of advanced semiconductor devices for various electronic applications.
Problems Solved
This technology solves the problem of efficiently relaying signals between semiconductor elements while ensuring electrical insulation.
Benefits
The benefits of this technology include improved signal transmission, reduced risk of electrical interference, and enhanced overall performance of semiconductor devices.
Potential Commercial Applications
The potential commercial applications of this technology could be in the fields of telecommunications, consumer electronics, and automotive electronics.
Possible Prior Art
One possible prior art could be the use of insulating elements in semiconductor devices to relay signals while electrically insulating the semiconductor elements.
Unanswered Questions
How does this technology compare to existing methods of signal transmission in semiconductor devices?
This article does not provide a direct comparison to existing methods of signal transmission in semiconductor devices.
What are the specific electronic applications where this technology could have the most impact?
This article does not specify the specific electronic applications where this technology could have the most impact.
Original Abstract Submitted
A semiconductor device includes a first die pad with a first obverse surface facing in z direction, a second die pad spaced from the first die pad and including a second obverse surface facing in z direction, a first semiconductor element on the first obverse surface, a second semiconductor element on the second obverse surface, an insulating element on the first or second obverse surface and located between the first and second semiconductor elements in x direction to relay signals between the first and second semiconductor elements while electrically insulating these semiconductor elements, and a wire bonded to the first semiconductor element and the first obverse surface. The first die pad includes a first bond portion bonded to the wire, and a first opening located between the first bond portion and the first semiconductor element in y direction and including an opening end in the first obverse surface.
