20240038635. SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240038635 titled 'SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN
Simplified Explanation
The semiconductor device described in the patent application includes a semiconductor chip and multiple leads. Each lead has a lead body portion with a mounting portion where the semiconductor chip is bonded, and a lead connecting portion for external connection that projects downward from the lower surface of the lead body portion. The device also includes a first sealing resin that seals a space defined by each lead body portion and lead connecting portion below the upper surface of each lead body portion, and a second sealing resin that seals the semiconductor chip above the upper surface of each lead body portion.
- The semiconductor device includes a semiconductor chip and multiple leads for external connection.
- Each lead has a lead body portion with a mounting portion for bonding the semiconductor chip.
- The leads have a lead connecting portion that projects downward for external connection.
- The first sealing resin seals the space below the upper surface of each lead body portion.
- The second sealing resin seals the semiconductor chip above the upper surface of each lead body portion.
Potential Applications:
- Integrated circuits
- Microprocessors
- Memory devices
- Power devices
Problems Solved:
- Protects the semiconductor chip from external elements and moisture
- Ensures proper electrical connections between the semiconductor chip and external devices
- Provides structural support to the semiconductor chip and leads
Benefits:
- Improved reliability and durability of the semiconductor device
- Enhanced protection against environmental factors
- Facilitates efficient electrical connections
- Enables miniaturization of semiconductor devices
Original Abstract Submitted
a semiconductor device includes a semiconductor chip, a plurality of leads that each includes a lead body portion which has a mounting portion which includes an upper surface whereon a semiconductor chip is bonded, and a lead connecting portion for external connection which projects downward from a lower surface of the lead body portion, a first sealing resin that seals a space that is defined by each lead body portion and each lead connecting portion of the plurality of leads in a region below the upper surface of each lead body portion of the plurality of leads, and a second sealing resin that seals the semiconductor chip in a region above the upper surface of each lead body portion of the plurality of leads.
