Kabushiki kaisha toshiba (20240096762). SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kyo Tanabiki of Himeji Hyogo (JP)
Yoshihiro Higashikawa of Tokyo (JP)
Hajime Takagi of Nonoichi Ishikawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096762 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a technology involving multiple chips on lead frames, each with source electrodes and terminals connected by conductors.
- First chip on a lead frame with source electrode and terminal in opposite directions
- Second chip on a different lead frame with source electrode and terminal in opposite directions
- Conductors connecting source electrodes and terminals on each chip
Potential Applications
This technology could be used in integrated circuits, power electronics, and semiconductor devices.
Problems Solved
This technology allows for efficient and reliable connections between source electrodes and terminals on multiple chips.
Benefits
The technology enables improved performance and functionality of electronic devices by ensuring proper connections between components.
Potential Commercial Applications
The technology could be applied in the manufacturing of various electronic devices, such as smartphones, computers, and automotive systems.
Possible Prior Art
One possible prior art could be the use of wire bonding or flip chip technology to connect components in electronic devices.
Unanswered Questions
How does this technology compare to existing methods of connecting components in electronic devices?
This technology offers a more efficient and reliable way to connect source electrodes and terminals on multiple chips, but further comparison with existing methods would provide a clearer understanding of its advantages.
Are there any limitations or drawbacks to using this technology in electronic devices?
While the patent application highlights the benefits of this technology, it would be important to explore any potential limitations or drawbacks that may arise in practical applications.
Original Abstract Submitted
a first chip on a first lead frame includes a first source electrode on a surface opposite to the first lead frame. a first source terminal is located in a first direction from the first lead frame. a first gate terminal is located in a second direction from the first source terminal. a first conductor contacts the first source electrode and the first source terminal via conductors. a second chip on a second lead frame includes a second source electrode on a surface opposite to the second lead frame. a second gate terminal is located in a second direction from the first gate terminal. a second source terminal is located in the second direction from the second gate terminal. a second conductor contacts the second source electrode and the second source terminal via conductors.
