Hyundai motor company (20240123835). POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE SAME simplified abstract
Contents
- 1 POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing power module designs in terms of efficiency and performance?
- 1.11 What are the specific semiconductor chips used in the switching portions, and how do they contribute to the overall functionality of the power module?
- 1.12 Original Abstract Submitted
POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE SAME
Organization Name
Inventor(s)
POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240123835 titled 'POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE SAME
Simplified Explanation
The power module for a vehicle described in the abstract includes a circuit board with multiple switching portions and semiconductor chips, a lead frame, and a signal lead.
- The circuit board is provided with a first metallic layer.
- The first switching portion is located on the center of the circuit board and includes several semiconductor chips.
- The second switching portion is positioned outside the first switching portion on the circuit board and also contains multiple semiconductor chips.
- The third switching portion is placed on the outside of the first switching portion on the circuit board.
- A lead frame is located on one side of the circuit board.
- A signal lead is situated on the other side of the circuit board.
Potential Applications
The technology described in this patent application could be applied in electric vehicles, hybrid vehicles, and other automotive systems that require power modules for efficient operation.
Problems Solved
This technology solves the problem of efficiently managing power distribution within a vehicle, ensuring optimal performance and reliability of the power module.
Benefits
The benefits of this technology include improved power management, increased efficiency, and enhanced overall performance of the vehicle's power system.
Potential Commercial Applications
The potential commercial applications of this technology include automotive manufacturers, suppliers of power modules for vehicles, and companies involved in the development of electric and hybrid vehicle systems.
Possible Prior Art
One possible prior art for this technology could be similar power module designs used in electric vehicles or other electronic systems that require efficient power distribution.
Unanswered Questions
How does this technology compare to existing power module designs in terms of efficiency and performance?
The article does not provide a direct comparison between this technology and existing power module designs, leaving the reader to wonder about the specific advantages and disadvantages of this innovation.
What are the specific semiconductor chips used in the switching portions, and how do they contribute to the overall functionality of the power module?
The article does not delve into the details of the semiconductor chips used in the switching portions, leaving the reader curious about their specific roles and capabilities within the power module.
Original Abstract Submitted
a power module for a vehicle includes: a circuit board provided with a first metallic layer; a first switching portion disposed on a center portion of the circuit board, and including a plurality of semiconductor chips; a second switching portion disposed on the outside the first switching portion on the circuit board and including a plurality of semiconductor chips; a third switching portion disposed on the outside the first switching portion on the circuit board; a lead frame disposed on one side of the circuit board; and a signal lead disposed on the other side of the circuit board.
