18551569. SEMICONDUCTOR DEVICE AND INVERTER UNIT simplified abstract (Mitsubishi Electric Corporation)
Contents
- 1 SEMICONDUCTOR DEVICE AND INVERTER UNIT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND INVERTER UNIT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND INVERTER UNIT
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Nobuyoshi Kimoto of Fukuoka (JP)
SEMICONDUCTOR DEVICE AND INVERTER UNIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18551569 titled 'SEMICONDUCTOR DEVICE AND INVERTER UNIT
Simplified Explanation
The semiconductor chip is mounted on the heat spreader, with a frame bonded to the chip's upper surface. Mold resin seals the heat spreader, chip, and frame, with a recess on the mold resin's upper surface. A heat dissipation plate is attached to the recess via a thermally conductive material, insulated from the chip and frame by the mold resin. The heat dissipation plate is a flat plate with opposite upper and lower surfaces.
- Semiconductor chip mounted on heat spreader
- Frame bonded to chip's upper surface
- Mold resin seals components with recess on its surface
- Heat dissipation plate attached to recess with thermally conductive material
- Plate insulated from chip and frame by mold resin
Potential Applications
This technology could be applied in:
- Electronic devices
- Computer systems
- Automotive electronics
Problems Solved
This technology helps in:
- Improving heat dissipation
- Enhancing performance and reliability of electronic components
Benefits
The benefits of this technology include:
- Efficient heat dissipation
- Increased lifespan of electronic devices
- Improved overall performance
Potential Commercial Applications
This technology could be used in:
- Consumer electronics
- Industrial machinery
- Telecommunications equipment
Possible Prior Art
One possible prior art for this technology could be:
- Heat dissipation solutions for electronic devices
Unanswered Questions
How does this technology compare to traditional heat dissipation methods?
This technology offers improved heat dissipation compared to traditional methods by using a heat dissipation plate externally attached to the mold resin.
What materials are used in the construction of the heat dissipation plate?
The heat dissipation plate is made of a material with higher thermal conductivity than the mold resin, ensuring efficient heat transfer.
Original Abstract Submitted
A semiconductor chip () is mounted on the heat spreader (). A frame () is bonded to an upper surface of the semiconductor chip (). Mold resin () seals the heat spreader (), the semiconductor chip () and the frame () and has a recess () provided on an upper surface of the mold resin (). A heat dissipation plate () is externally attached to the recess () via a thermally conductive material () having thermal conductivity higher than that of the mold resin (). The heat dissipation plate () is insulated from the semiconductor chip () and the frame () by the mold resin (). The heat dissipation plate () is a flat plate having an upper surface and a lower surface which are opposite to each other and flat.
