20240087991.SEMICONDUCTOR PACKAGE simplified abstract (samsung electronics co., ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sung Woo Park of Suwon-si (KR)
Hyun Jong Moon of Suwon-si (KR)
Kwang Jin Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240087991 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a die paddle, leads on opposite sides of the die paddle, a spacer, a semiconductor die, wires connecting the die to the leads, and a mold film covering the components. The spacer is wider than the die paddle, allowing it to overlap with one of the leads.
- Die paddle: Platform for mounting semiconductor components.
- Leads: Connectors for external circuitry.
- Spacer: Component that supports the semiconductor die.
- Semiconductor die: Integrated circuit component.
- Wires: Connect the semiconductor die to the leads.
- Mold film: Protective covering for the components.
Potential Applications
The technology can be used in various electronic devices such as smartphones, computers, and automotive systems.
Problems Solved
The design helps in improving the reliability and performance of semiconductor packages by providing adequate support and protection to the components.
Benefits
- Enhanced reliability of semiconductor packages. - Improved performance of electronic devices. - Efficient heat dissipation due to the design.
Potential Commercial Applications
"Semiconductor Package with Overlapping Spacer for Enhanced Reliability and Performance" can find applications in the consumer electronics, automotive, and industrial sectors.
Possible Prior Art
Prior art may include existing semiconductor packaging designs with spacers and leads, but the specific configuration of the overlapping spacer may be a novel feature.
Unanswered Questions
How does the overlapping spacer affect the overall size of the semiconductor package?
The abstract does not provide information on whether the overlapping spacer increases the overall size of the package or if it allows for a more compact design.
What materials are used in the construction of the semiconductor package?
The abstract does not mention the specific materials used for the die paddle, spacer, leads, or mold film, which could impact the performance and durability of the package.
Original Abstract Submitted
a semiconductor package including a die paddle, a first lead spaced apart from the die paddle and on one side of the die paddle, a second lead spaced apart from the die paddle and on another side of the die paddle, a spacer on the die paddle, a semiconductor die on the spacer, a first wire configured to connect an upper surface of the semiconductor die to the first lead, and a mold film configured to cover the die paddle, the first lead, the second lead, the spacer, the semiconductor die, and the first wire, wherein a first width of the spacer is greater than a second width of the die paddle so that the spacer overlaps the first lead may be provided.
