20240047317. PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES simplified abstract (Littelfuse Semiconductor (Wuxi) Co., Ltd.)
Contents
PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES
Organization Name
Littelfuse Semiconductor (Wuxi) Co., Ltd.
Inventor(s)
PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240047317 titled 'PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES
Simplified Explanation
The abstract of this patent application describes a package structure that includes a lead frame with a pedestal and a lead, a chip layer, and a clip with a pedestal and a lead connector. The first lead frame has a recessed area with a die pad, and the chip layer is in abutment with the first lead frame's perimeter ridge. The clip has a second recessed area defined by a perimeter ridge, which is in abutment with the first main side of the chip layer.
- The package structure includes a lead frame with a pedestal and a lead, providing a structure for mounting electronic components.
- A chip layer is included, which is in contact with the first lead frame's perimeter ridge, allowing for secure attachment and electrical connection.
- The clip has a second pedestal and a lead connector, providing additional support and connectivity.
- The second pedestal of the clip has a recessed area defined by a perimeter ridge, allowing for the placement of electronic components.
- The second perimeter ridge of the clip is in abutment with the first main side of the chip layer, ensuring proper alignment and connection.
Potential applications of this technology:
- Electronics packaging: This package structure can be used in various electronic devices, such as smartphones, computers, and automotive electronics, to provide a secure and reliable connection for electronic components.
- Semiconductor industry: The package structure can be utilized in the semiconductor industry for the packaging of integrated circuits and other semiconductor devices.
Problems solved by this technology:
- Secure mounting: The package structure provides a secure mounting platform for electronic components, preventing movement or detachment during operation.
- Electrical connectivity: The design ensures proper electrical connectivity between the components, minimizing signal loss or interference.
- Alignment and positioning: The abutment of the chip layer and the clip's perimeter ridge ensures accurate alignment and positioning of the components, improving overall performance and reliability.
Benefits of this technology:
- Enhanced reliability: The package structure offers a robust and stable platform for electronic components, reducing the risk of failure or damage.
- Improved electrical performance: The secure connection and proper alignment contribute to improved electrical performance, ensuring efficient signal transmission.
- Simplified assembly process: The design of the package structure simplifies the assembly process, reducing manufacturing time and costs.
Original Abstract Submitted
provided herein are package structures including a first lead frame having a first pedestal and a first lead extending from the first pedestal. a first perimeter ridge defines a first recessed area in a first main side of the first pedestal, wherein a die pad is positioned within the first recessed area. the package structure may further include a chip layer having a first main side opposite a second main side, wherein the second main side is in abutment with the first perimeter ridge of the pedestal of the first lead frame. the package structure may further include a clip including a second pedestal and a lead connector extending from the second pedestal, wherein a second perimeter ridge defines a second recessed area in a second main side of the second pedestal, and wherein the second perimeter ridge is in abutment with the first main side of the chip layer.
