18104554. SEMICONDUCTOR DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)

SEMICONDUCTOR DEVICE

Organization Name

TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

Inventor(s)

Kyo Tanabiki of Himeji Hyogo (JP)

Yoshihiro Higashikawa of Tokyo (JP)

Hajime Takagi of Nonoichi Ishikawa (JP)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18104554 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

The abstract describes a patent application for a semiconductor chip structure involving multiple chips on separate lead frames, each with source electrodes and terminals connected by conductors.

• The innovation involves a semiconductor chip structure with multiple chips on separate lead frames.
• Each chip has a source electrode on one surface and source and gate terminals in specific directions.
• Conductors connect the source electrode to the source terminal, and the gate terminal to the source terminal on each chip.

Potential Applications

This technology could be applied in the manufacturing of integrated circuits, power electronics, and semiconductor devices.

Problems Solved

This innovation helps in improving the efficiency and performance of semiconductor chips by optimizing the layout and connectivity of the source and gate terminals.

Benefits

The benefits of this technology include enhanced functionality, increased reliability, and improved electrical performance of semiconductor chips.

Potential Commercial Applications

The semiconductor chip structure could find applications in various industries such as consumer electronics, automotive, telecommunications, and industrial automation.

Possible Prior Art

One possible prior art could be the use of lead frames in semiconductor packaging and assembly processes to connect various components within a chip structure.

How does this technology impact the overall size of the semiconductor chip structure?

The abstract does not provide information on whether this innovation affects the size of the semiconductor chip structure. Further details on the size optimization would be beneficial for understanding the practical implications of this technology.

What materials are used for the conductors in this semiconductor chip structure?

The abstract does not specify the materials used for the conductors connecting the source electrode and terminals. Knowing the materials could provide insights into the durability and conductivity of the chip structure.

Original Abstract Submitted

A first chip on a first lead frame includes a first source electrode on a surface opposite to the first lead frame. A first source terminal is located in a first direction from the first lead frame. A first gate terminal is located in a second direction from the first source terminal. A first conductor contacts the first source electrode and the first source terminal via conductors. A second chip on a second lead frame includes a second source electrode on a surface opposite to the second lead frame. A second gate terminal is located in a second direction from the first gate terminal. A second source terminal is located in the second direction from the second gate terminal. A second conductor contacts the second source electrode and the second source terminal via conductors.