20240030108. TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)

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TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

Organization Name

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor(s)

Jerome Teysseyre of Singapore (SG)

Oseob Jeon of Seoul (KR)

Chee Hiong Chew of Seremban (MY)

Seungwon Im of Bucheon (KR)

TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240030108 titled 'TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

Simplified Explanation

The abstract describes an electronic device assembly that includes a circuit with at least one semiconductor die, and a molded body that encapsulates the circuit. The molded body has a primary surface in a plane and a non-parallel side surface. The assembly also includes a slot in the primary surface of the molded body and a signal lead that extends out of the side surface. The signal lead is electrically connected to the circuit and has multiple bends, including one that is partially disposed in the slot.

  • The patent application describes an electronic device assembly with a unique molded body design.
  • The molded body has a primary surface and a non-parallel side surface, providing a distinctive shape.
  • The assembly includes a slot in the primary surface, allowing for additional functionality or connectivity.
  • A signal lead extends out of the side surface and is electrically coupled to the circuit.
  • The signal lead has multiple bends, including one that is partially located within the slot, enabling flexibility and efficient use of space.

Potential applications of this technology:

  • Consumer electronics: The assembly can be used in smartphones, tablets, or wearable devices, providing a compact and efficient design.
  • Automotive industry: The assembly can be utilized in vehicle electronics, allowing for space-saving and improved connectivity.
  • Industrial equipment: The technology can be applied in various industrial devices, enabling compact and reliable electronic assemblies.

Problems solved by this technology:

  • Space optimization: The unique design of the molded body and the placement of the signal lead in the slot allow for efficient use of space within the electronic device assembly.
  • Connectivity: The signal lead extending out of the side surface provides a convenient way to connect the circuit to external components or systems.

Benefits of this technology:

  • Compact design: The molded body and the arrangement of the circuit components result in a smaller overall size of the electronic device assembly.
  • Improved flexibility: The multiple bends in the signal lead, including the one in the slot, provide flexibility and adaptability to different device configurations.
  • Enhanced connectivity: The signal lead extending out of the side surface allows for easy connection to other components or systems, improving overall functionality.


Original Abstract Submitted

in a general aspect, an electronic device assembly includes a circuit including at least one semiconductor die, and a molded body encapsulating the circuit. the molded body has a primary surface arranged in a plane and a side surface that is non-parallel with the plane. the assembly also includes a slot defined in the primary surface of the molded body, and a signal lead extending out of the side surface of the molded body. the signal lead is electrically coupled with the circuit and has a plurality of bends that include a bend of that is at least partially disposed in the slot.

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