18495697. SEMICONDUCTOR DEVICE PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR DEVICE PACKAGE
Organization Name
Inventor(s)
Younghwan Park of Seongnam-si (KR)
Jaejoon Oh of Seongnam-si (KR)
SEMICONDUCTOR DEVICE PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18495697 titled 'SEMICONDUCTOR DEVICE PACKAGE
Simplified Explanation
The semiconductor device package described in the abstract includes a lead frame, a semiconductor device with multiple pads, clips connected to the pads, and a molding that seals the components together.
- The semiconductor device package consists of a lead frame, a semiconductor device, and clips connected to the pads.
- The semiconductor device has a gate pad, a drain pad, and a source pad exposed on one face.
- Clips, such as a gate clip, a drain clip, and a source clip, are connected to the respective pads.
- The source clip is connected to the lead frame.
- A molding seals the lead frame, semiconductor device, and clips together.
- Potential Applications
- This technology can be used in various electronic devices such as smartphones, tablets, and computers.
- It can be applied in power management systems, voltage regulators, and other semiconductor devices.
- Problems Solved
- Provides a secure and efficient way to connect the semiconductor device to the lead frame.
- Ensures proper functioning and reliability of the semiconductor device package.
- Benefits
- Improved electrical connectivity and stability.
- Enhanced durability and protection for the semiconductor device.
- Simplified manufacturing process for semiconductor device packages.
Original Abstract Submitted
A semiconductor device package includes a lead frame, a semiconductor device including a first face connected to the lead frame, a second face that faces the first face, a gate pad, a drain pad, and a source pad, the gate pad exposed on the second face of the semiconductor, the drain pad exposed on the second face of the second face, and the source pad exposed on the second face, a gate clip connected to the gate pad, a drain clip connected to the drain pad, a source clip connected to the source pad, the source clip connected to the lead frame, and a molding that seals the lead frame, the semiconductor device, the source clip, the drain clip, and the gate clip.
