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Category:H01L21/3105
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This category has the following 84 subcategories, out of 84 total.
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Pages in category "H01L21/3105"
The following 174 pages are in this category, out of 174 total.
1
- 17460097. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17547669. DOPANT-FREE INHIBITOR FOR AREA SELECTIVE DEPOSITIONS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17685738. FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH DIELECTRIC ISOLATION STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17809414. SUPERSTRATE INCLUDING A BODY AND LAYERS AND METHODS OF FORMING AND USING THE SAME simplified abstract (CANON KABUSHIKI KAISHA)
- 17836579. CAPACITOR STRUCTURE AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 17940403. CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18090400. ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABILITY FOR INTEGRATED CIRCUITS simplified abstract (Intel Corporation)
- 18137339. LAYER DEPOSITION METHOD AND LAYER DEPOSITION APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18145625. III-N DEVICE WITH PLANARIZED TOPOLOGICAL STRUCTURE simplified abstract (Texas Instruments Incorporated)
- 18219259. Surface Profile Control Of Passivation Layers In Integrated Circuit Chips (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18294839. POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD (Resonac Corporation)
- 18294859. POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD simplified abstract (Resonac Corporation)
- 18294889. POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP AND POLISHING METHOD simplified abstract (Resonac Corporation)
- 18296503. MULTI LEVEL CONTACT ETCH simplified abstract (Tokyo Electron Limited)
- 18347634. METHOD OF PREVENTING PATTERN COLLAPSE (Tokyo Electron Limited)
- 18347683. DIELECTRIC DENSIFICATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18351591. INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORMED IN A CONDUCTIVE ROUTING REGION simplified abstract (Microchip Technology Incorporated)
- 18369148. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (NANYA TECHNOLOGY CORPORATION)
- 18432694. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18433867. SEMICONDUCTOR DEVICE HAVING CUT GATE DIELECTRIC simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18436499. DEFORMABLE SUBSTRATE CHUCK simplified abstract (Applied Materials, Inc.)
- 18439271. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18444356. SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTOR FINS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18469410. SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18471294. METHOD OF MANUFACTURING MEMORY DEVICE (MACRONIX International Co., Ltd.)
- 18483657. FIELD EFFECT TRANSISTOR WITH ALIGNMENT MARK AND RELATED METHODS (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18496966. NEGATIVE-TONE ORGANIC DIELECTRIC WITH FINE METAL PILLAR RESOLUTION (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18502640. INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURING THE SAME (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513545. METHODS FOR WAFER BONDING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18514010. ANTI-OXIDATION LAYER TO PREVENT DIELECTRIC LOSS FROM PLANARIZATION PROCESS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18581043. Methods of Reducing Gate Spacer Loss During Semiconductor Manufacturing simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18581162. CONTACT FORMATION METHOD AND RELATED STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18587506. METHOD FOR FORMING DIFFERENT TYPES OF DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18590634. CONTACTS FOR SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18601433. VIA CONNECTION TO A PARTIALLY FILLED TRENCH simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18602665. VIA FOR SEMICONDUCTOR DEVICE CONNECTION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18610982. METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18614985. FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18633312. PLANARIZATION APPARATUS, PLANARIZATION METHOD, AND PRODUCT MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18637874. SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN MULTI-LAYER STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18648069. METHODS OF REDUCING CAPACITANCE IN FIELD-EFFECT TRANSISTORS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18664595. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18669981. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (Samsung Electronics Co., Ltd.)
- 18701384. SYSTEM AND METHOD FOR CARBON PLUG FORMATION (LAM RESEARCH CORPORATION)
- 18731590. BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18734886. PLANARIZATION PROCESS, PLANARIZATION SYSTEM, AND METHOD OF MANUFACTURING AN ARTICLE simplified abstract (CANON KABUSHIKI KAISHA)
- 18802472. PLANARIZATION METHOD AND METHOD OF MANUFACTURING ARTICLE (CANON KABUSHIKI KAISHA)
- 18814597. POLISHING PAD AND PROCESS FOR PREPARING THE SAME (SK enpulse Co., Ltd.)
- 18882756. POLISHING PAD AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME (SK enpulse Co., Ltd.)
- 18886036. METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE USING NITROGEN-CONTAINING PATTERN (NANYA TECHNOLOGY CORPORATION)
- 18890313. POLISHING SLURRY, METHOD FOR MANUFACTURING A DISPLAY DEVICE USING THE SAME AND DISPLAY DEVICE (Samsung Display Co., LTD.)
- 18906944. METHODS OF FORMING MEMORY STRUCTURES FOR THREE-DIMENSIONAL NONVOLATILE MEMORY (IMEC VZW)
- 18914918. ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY (MICRON TECHNOLOGY, INC.)
- 18943622. CHUCK ASSEMBLY, PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE (CANON KABUSHIKI KAISHA)
- 18973300. Photoresist and Method (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18974295. SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD SEALING THE AIR GAP (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18979080. NANOSTRUCTURE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18982447. METHOD OF FORMING PATTERNS (SAMSUNG SDI CO., LTD.)
- 18989948. SILICA PARTICLES, PRODUCTION METHOD THEREFOR, SILICA SOL, POLISHING COMPOSITION, POLISHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR WAFER, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE (Mitsubishi Chemical Corporation)
- 18991919. Semiconductor Structure Cutting Process and Structures Formed Thereby (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18999567. DEEP TRENCH INTERSECTIONS (TEXAS INSTRUMENTS INCORPORATED)
- 18999881. SLURRY, SCREENING METHOD, AND POLISHING METHOD (RESONAC CORPORATION)
- 19011229. Assemblies Having Conductive Structures Along Pillars of Semiconductor Material, and Methods of Forming Integrated Circuitry (Micron Technology, Inc.)
A
C
- Canon kabushiki kaisha (20240321586). PLANARIZATION PROCESS, PLANARIZATION SYSTEM, AND METHOD OF MANUFACTURING AN ARTICLE simplified abstract
- Canon kabushiki kaisha (20240347344). PLANARIZATION APPARATUS, PLANARIZATION METHOD, AND PRODUCT MANUFACTURING METHOD simplified abstract
- Canon kabushiki kaisha (20240429060). PLANARIZATION SYSTEM, PLANARIZING METHOD, AND METHOD OF MANUFACTURING AN ARTICLE
- Canon kabushiki kaisha (20250069892). PLANARIZATION METHOD AND METHOD OF MANUFACTURING ARTICLE
- Canon kabushiki kaisha (20250069938). CHUCK ASSEMBLY, PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE
- CANON KABUSHIKI KAISHA patent applications on December 26th, 2024
- CANON KABUSHIKI KAISHA patent applications on February 27th, 2025
- CANON KABUSHIKI KAISHA patent applications on October 17th, 2024
- CANON KABUSHIKI KAISHA patent applications on September 26th, 2024
I
- Intel corporation (20240222089). ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABILITY FOR INTEGRATED CIRCUITS simplified abstract
- Intel corporation (20240413016). TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Intel Corporation patent applications on December 12th, 2024
- Intel Corporation patent applications on July 4th, 2024
- International business machines corporation (20250140609). NEGATIVE-TONE ORGANIC DIELECTRIC WITH FINE METAL PILLAR RESOLUTION
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 1st, 2025
M
- Micron technology, inc. (20240186267). SEMICONDUCTOR DEVICES COMPRISING STEPS simplified abstract
- Micron technology, inc. (20250133786). ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY
- Micron technology, inc. (20250142875). Assemblies Having Conductive Structures Along Pillars of Semiconductor Material, and Methods of Forming Integrated Circuitry
- MICRON TECHNOLOGY, INC. patent applications on April 24th, 2025
- Micron Technology, Inc. patent applications on June 6th, 2024
- Micron Technology, Inc. patent applications on May 1st, 2025
S
- Samsung display co., ltd. (20250015098). POLISHING SLURRY, METHOD FOR MANUFACTURING A DISPLAY DEVICE USING THE SAME AND DISPLAY DEVICE
- Samsung Display Co., LTD. patent applications on January 9th, 2025
- Samsung electronics co., ltd. (20240318038). METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240420961). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Samsung electronics co., ltd. (20240429039). METHOD OF DEPOSITING FILM
- Samsung electronics co., ltd. (20240429057). METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS ON A BONDING LAYER AND SEMICONDUCTOR DEVICES FORMED BY THE SAME
- Samsung electronics co., ltd. (20250022799). SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Samsung electronics co., ltd. (20250132198). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Samsung Electronics Co., Ltd. patent applications on April 24th, 2025
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 16th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- Samsung sdi co., ltd. (20250115691). METHOD OF FORMING PATTERNS
- SAMSUNG SDI CO., LTD. patent applications on April 10th, 2025
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- Taiwan semiconductor manufacturing co., ltd. (20240186148). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240190701). METHODS FOR WAFER BONDING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194480). Methods of Reducing Gate Spacer Loss During Semiconductor Manufacturing simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194520). CONTACT FORMATION METHOD AND RELATED STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194675). SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTOR FINS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250020). VIA FOR SEMICONDUCTOR DEVICE CONNECTION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250143). CONTACTS FOR SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240251539). METHOD FOR FORMING DIFFERENT TYPES OF DEVICES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240429312). HIGH-K ISOLATION OF FIN STRUCTURES
- Taiwan semiconductor manufacturing co., ltd. (20250096155). SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Taiwan semiconductor manufacturing co., ltd. (20250102916). Photoresist and Method
- Taiwan semiconductor manufacturing co., ltd. (20250105054). SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD SEALING THE AIR GAP
- Taiwan semiconductor manufacturing co., ltd. (20250112049). NANOSTRUCTURE AND MANUFACTURING METHOD THEREOF
- Taiwan semiconductor manufacturing co., ltd. (20250118679). FIELD EFFECT TRANSISTOR WITH ALIGNMENT MARK AND RELATED METHODS
- Taiwan semiconductor manufacturing co., ltd. (20250126883). Semiconductor Structure Cutting Process and Structures Formed Thereby
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 10th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 17th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 3rd, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on December 26th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 20th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 27th, 2025
- Taiwan semiconductor manufacturing company, ltd. (20240105454). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240105460). Hard Mask Removal Method simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178300). SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240213034). VIA CONNECTION TO A PARTIALLY FILLED TRENCH simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240213097). SEMICONDUCTOR DEVICE HAVING CUT GATE DIELECTRIC simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240234213). FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266166). DIELECTRIC DENSIFICATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266439). SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN MULTI-LAYER STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297225). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297236). METHODS OF REDUCING CAPACITANCE IN FIELD-EFFECT TRANSISTORS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321746). BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTOR DEVICES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379374). SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379430). INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379452). Dielectric Fins With Different Dielectric Constants and Sizes in Different Regions of a Semiconductor Device simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379540). INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240413221). INTEGRATED CIRCUIT DEVICE WITH IMPROVED RELIABILITY
- Taiwan semiconductor manufacturing company, ltd. (20250006500). SEMICONDUCTOR DEVICE AND METHOD
- Taiwan semiconductor manufacturing company, ltd. (20250006505). SEMICONDUCTOR STRUCTURE INCLUDING DEVICES WITH DIFFERENT CHANNEL LENGTHS, AND METHOD FOR MANUFACTURING THE SAME
- Taiwan semiconductor manufacturing company, ltd. (20250014943). Surface Profile Control Of Passivation Layers In Integrated Circuit Chips
- Taiwan semiconductor manufacturing company, ltd. (20250149436). INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURING THE SAME
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on December 12th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on January 2nd, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 9th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 27th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 6th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 30th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 8th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 5th, 2024
- Tokyo electron limited (20240339328). MULTI LEVEL CONTACT ETCH simplified abstract
- Tokyo Electron Limited patent applications on October 10th, 2024
U
- US Patent Application 18358609. Method of Forming a Semiconductor Device by Driving Hydrogen into a Dielectric Layer from Another Dielectric Layer simplified abstract
- US Patent Application 18359747. REPLACEMENT GATE PROCESS FOR SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 18360012. INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT simplified abstract
- US Patent Application 18361743. CUT METAL GATE PROCESS FOR REDUCING TRANSISTOR SPACING simplified abstract
- US Patent Application 18363881. FUSI GATED DEVICE FORMATION simplified abstract
- US Patent Application 18364614. METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARIZATION simplified abstract
- US Patent Application 18446416. AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING LAYER PLANARIZATION simplified abstract
- US Patent Application 18447618. Method of Gap Filling for Semiconductor Device simplified abstract