Samsung Electronics Co., Ltd. patent applications on April 24th, 2025
Patent Applications by Samsung Electronics Co., Ltd. on April 24th, 2025
Samsung Electronics Co., Ltd.: 132 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (10), H10B12/00 (7), H10B80/00 (6), H01L23/528 (5), H01L25/065 (5) H10B12/50 (3), G06F3/013 (2), G06T5/50 (2), H01L24/05 (2), H01L23/481 (2)
With keywords such as: layer, device, image, based, semiconductor, substrate, including, configured, data, and channel in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Ivan France of Saratoga CA US for samsung electronics co., ltd., Forrest Tran of Milpitas CA US for samsung electronics co., ltd., Eunseo Cho of Mountain View CA US for samsung electronics co., ltd., Ziwen Jiang of Sunnyvale CA US for samsung electronics co., ltd.
IPC Code(s): A47L11/40, F04B43/12
CPC Code(s): A47L11/4088
Abstract: in one embodiment, an apparatus includes an actuator coupled to an end effector, the actuator configured to create relative rotation between the actuator and the end effector. the apparatus further includes one or more peristaltic-pump rollers coupled to the actuator. the end effector includes a liquid-storage chamber configured to store a liquid and a flexible tubing that includes: (1) an intake disposed within the liquid-storage chamber, (2) an outlet configured to dispense the liquid onto an outer surface of the end effector, and (3) a peristaltic section configured to compress against at least one of the one or more peristaltic-pump rollers as a result of the relative rotation between the actuator and the end effector.
Inventor(s): Heeseung CHOI of Suwon-si KR for samsung electronics co., ltd., Yongdae Ko of Suwon-si KR for samsung electronics co., ltd., Jinho Kim of Suwon-si KR for samsung electronics co., ltd., Sungman Park of Suwon-si KR for samsung electronics co., ltd., Hyungmin Son of Suwon-si KR for samsung electronics co., ltd., Jinho Choi of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): A47L11/40, A47L9/00, B08B13/00
CPC Code(s): A47L11/4091
Abstract: a robot cleaner station includes: a base; a pad cleaner provided in an upper surface of the base and configured to place and clean a mop pad; a pad moving device configured to move a used mop pad from the pad cleaner and place a cleaned mop pad on the pad cleaner; and one or more processors, where, by executing one or more instructions stored on at least one memory, the one or more processors are configured to: control the pad moving device to move the used mop pad to the pad cleaner, and control the pad cleaner to clean the used mop pad based on a robot cleaner obtaining the cleaned mop pad and moving away from the base.
20250127372. DISH WASHER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyuha LEE of Suwon-si KR for samsung electronics co., ltd., Jinhoon KIM of Suwon-si KR for samsung electronics co., ltd., Jaewon SIM of Suwon-si KR for samsung electronics co., ltd., Hongchul HYUN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): A47L15/42, A47L15/50
CPC Code(s): A47L15/4263
Abstract: a dishwasher including a tub forming a washing chamber, a door configured to open or close the tub, and a sealing member configured to seal a gap between the tub and the door. the sealing member includes a fixed body coupleable to the tub and a sealing body extending from the fixed body toward the door. the sealing body includes a contact portion configured to be in contact with the door, a support portion to connect the fixed body and the contact portion, and a bend portion to be bent toward the fixed body while the door is pressing the contact portion. the bend portion includes a bending end connected to the support portion.
Inventor(s): Hongji LEE of Suwon-si KR for samsung electronics co., ltd., Minkyung HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): A61B5/0205, A61B5/00, A61B5/024, A61B5/026, A61B5/11
CPC Code(s): A61B5/02055
Abstract: according to an embodiment, a wearable device includes multiple sensors and a processor. the processor is designed to: identify a user's heart rate using a heart rate sensor in contact with a first body part; determine if the heart rate is at or above a reference level; provide a guide to contact a body temperature sensor with a designated second body part if the heart rate is high; acquire body temperature data via the sensor after the guide is given; and output a notification based on the acquired body temperature data.
20250128215. GAS MIXER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Myeongjun GIL of Suwon-si KR for samsung electronics co., ltd., Sunghyup KIM of Suwon-si KR for samsung electronics co., ltd., Sebin CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): B01F25/314, B01F23/10, B01F25/31, B01F101/58
CPC Code(s): B01F25/31434
Abstract: a gas mixer may include a first gas channel, a first distribution channel, a second gas channel and a plurality of first connection channels. the first gas channel may be configured to supply a first gas into a reaction chamber. the first distribution channel may surround the first gas channel and is configured to uniformly distribute a second gas within the first distribution channel. the second gas channel may be configured to supply the second gas into the first distribution channel. the plurality of the first connection channels may be connected between the first distribution channel and the first gas channel. thus, the second gas may be uniformly distributed in the cylindrical first distribution channel. the second gas may then be supplied to the first gas channel through the first connection channels. the second gas may be mixed with the first gas to form a mixed gas. as a result, the mixed gas may be uniformly distributed in the reaction chamber.
Inventor(s): Hyunsoo CHA of Suwon-si KR for samsung electronics co., ltd., Seho SHIN of Suwon-si KR for samsung electronics co., ltd., Jaehwa LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): B60W40/114, B60W10/20, B60W50/00, B60W50/02, B60W50/14
CPC Code(s): B60W40/114
Abstract: a method of controlling a vehicle includes: receiving pieces of data related to steering of the vehicle; detecting, among the pieces of data, target pieces of data determined to satisfy predetermined conditions; based on the target pieces of data and an optimization model, obtaining optimized model parameters that minimize a cumulative error between a predicted yaw rate of a yaw rate model of the vehicle and a measured yaw rate of the vehicle; and updating the yaw rate model of the vehicle by using the optimized model parameters.
Inventor(s): Hyung Jun KIM of Suwon-si KR for samsung electronics co., ltd., Jiyoung JUNG of Suwon-si KR for samsung electronics co., ltd., Hyunbum KANG of Suwon-si KR for samsung electronics co., ltd., Gae Hwang LEE of Suwon-si KR for samsung electronics co., ltd., Bang Lin LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C08G61/12, H10K10/46
CPC Code(s): C08G61/126
Abstract: disclosed are a polymer including a first repeating unit represented by chemical formula 1 and a second repeating unit represented by chemical formula 2, a thin film transistor including the same, and an electronic device.
Inventor(s): Hyung Jun KIM of Suwon-si KR for samsung electronics co., ltd., Jiyoung JUNG of Suwon-si KR for samsung electronics co., ltd., Hyunbum KANG of Suwon-si KR for samsung electronics co., ltd., Gae Hwang LEE of Suwon-si KR for samsung electronics co., ltd., Bang Lin LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C08G61/12, H10K10/46
CPC Code(s): C08G61/126
Abstract:
Inventor(s): Hyung Jun KIM of Suwon-si KR for samsung electronics co., ltd., Jiyoung JUNG of Suwon-si KR for samsung electronics co., ltd., Hyunbum KANG of Suwon-si KR for samsung electronics co., ltd., Gae Hwang LEE of Suwon-si KR for samsung electronics co., ltd., Bang Lin LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C08G61/12, H10K10/46
CPC Code(s): C08G61/126
Abstract: in chemical formula 1 or 2, d, a, a, lto l, r, and rare the same as described in the detailed description.
Inventor(s): Yoonseok KO of Suwon-si KR for samsung electronics co., ltd., Jung Hoon LEE of Suwon-si KR for samsung electronics co., ltd., Sang Soo JEE of Suwon-si KR for samsung electronics co., ltd., Fedosya KALININA of Suwon-si KR for samsung electronics co., ltd., Hyune Jea LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C09G1/02, H01L21/321
CPC Code(s): C09G1/02
Abstract: a polishing slurry, and a method of manufacturing a semiconductor device using the polishing slurry are provided. the polishing slurry includes nano-abrasive particles having a mohs hardness greater than about 5, and soft particles having a mohs hardness lower than the mohs hardness of the nano-abrasive particles, and wherein the nano-abrasive particles and the soft particles have a same sign of zeta potentials as each other in the polishing slurry.
Inventor(s): Cheol HAM of Suwon-si KR for samsung electronics co., ltd., Byungjoon KANG of Suwon-si KR for samsung electronics co., ltd., Giho KO of Hwaseong-si KR for samsung electronics co., ltd., Sungmin KIM of Suwon-si KR for samsung electronics co., ltd., Mihyun PARK of Hwaseong-si KR for samsung electronics co., ltd., Insun PARK of Suwon-si KR for samsung electronics co., ltd., Jinhye BAE of Hwaseong-si KR for samsung electronics co., ltd., Kum Hee LEE of Suwon-si KR for samsung electronics co., ltd., Minhyung CHO of Hwaseong-si KR for samsung electronics co., ltd., Kyuyoung HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C09K13/06, H01L21/3213
CPC Code(s): C09K13/06
Abstract: provided are an etching composition, a method of etching a metal-containing film by using the same, and a method of manufacturing a semiconductor device by using the same. the etching composition may include an oxidizing agent, a buffer, and a selective etching inhibitor. the selective etching inhibitor may include a first compound represented by formula 1 and a second compound different from the first compound. the second compound may include a ring. the ring may be a pyrazole group, an imidazole group, a triazole group, or a tetrazole group, or the ring may be a pyrazole group, an imidazole group, or a triazole group, each condensed with a benzene group, a pyridine group, a pyrimidine group, a pyrazine group, a pyridazine group, or any combination thereof.
Inventor(s): Cheol HAM of Suwon-si KR for samsung electronics co., ltd., Byungjoon KANG of Suwon-si KR for samsung electronics co., ltd., Giho KO of Hwaseong-si KR for samsung electronics co., ltd., Sungmin KIM of Suwon-si KR for samsung electronics co., ltd., Mihyun PARK of Hwaseong-si KR for samsung electronics co., ltd., Insun PARK of Suwon-si KR for samsung electronics co., ltd., Jinhye BAE of Hwaseong-si KR for samsung electronics co., ltd., Kum Hee LEE of Suwon-si KR for samsung electronics co., ltd., Minhyung CHO of Hwaseong-si KR for samsung electronics co., ltd., Kyuyoung HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C09K13/06, H01L21/3213
CPC Code(s): C09K13/06
Abstract:
Inventor(s): Cheol HAM of Suwon-si KR for samsung electronics co., ltd., Byungjoon KANG of Suwon-si KR for samsung electronics co., ltd., Giho KO of Hwaseong-si KR for samsung electronics co., ltd., Sungmin KIM of Suwon-si KR for samsung electronics co., ltd., Mihyun PARK of Hwaseong-si KR for samsung electronics co., ltd., Insun PARK of Suwon-si KR for samsung electronics co., ltd., Jinhye BAE of Hwaseong-si KR for samsung electronics co., ltd., Kum Hee LEE of Suwon-si KR for samsung electronics co., ltd., Minhyung CHO of Hwaseong-si KR for samsung electronics co., ltd., Kyuyoung HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C09K13/06, H01L21/3213
CPC Code(s): C09K13/06
Abstract: a description of formula 1 is provided in the present specification.
Inventor(s): Yu Kyung Jung of Hwaseong-si KR for samsung electronics co., ltd., Jae-Young Kim of Suwon-si KR for samsung electronics co., ltd., Seung Hoon Song of Suwon-si KR for samsung electronics co., ltd., Woo Yong Shim of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): C12P1/04, B01D53/56, C12N1/20, C12N9/06, C12N15/70
CPC Code(s): C12P1/04
Abstract: a recombinant microorganism including a genetic modification that increases expression of a gene encoding a ferric enterobactin transporter-associated protein or a gene encoding a tonb-dependent transporter-associated protein, or a genetic modification that decreases expression of a fur gene encoding a ferric uptake regulator (fur) protein, wherein the recombinant microorganism removes greater amounts of nitric oxide from a sample comprising nitric oxide than a same microorganism without the genetic modification
Inventor(s): Sungmo LEE of Suwon-si KR for samsung electronics co., ltd., Junhyun PARK of Suwon-si KR for samsung electronics co., ltd., Sungjong KIM of Suwon-si KR for samsung electronics co., ltd., Seunghoon KIM of Suwon-si KR for samsung electronics co., ltd., Haneal LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): D06F33/48, D06F34/16, D06F103/26, D06F105/60
CPC Code(s): D06F33/48
Abstract: a washing machine is provided. the washing machine includes a cabinet having an inlet through which laundry is inserted, a plurality of legs disposed under the cabinet and configured to support the cabinet, a tub provided inside the cabinet, a drum rotatable in the tub, and a drum motor configured to provide power to rotate the drum, a vibration sensor configured to detect vibrations occurring in the cabinet along at least two axes, memory storing one or more computer programs, and one or more processors communicatively coupled to the memory and the vibration sensor, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the washing machine to determine a leg that is not seated on an installation surface based on a phase difference between a first signal and a second signal output from the vibration sensor.
Inventor(s): Jae Chul PARK of Suwon-si KR for samsung electronics co., ltd., Sanghun JEON of Seoul KR for samsung electronics co., ltd.
IPC Code(s): G01J5/20, H10N15/10
CPC Code(s): G01J5/20
Abstract: a microbolometer and a method of manufacturing the same are provided. the microbolometer may include a substrate, an absorption layer configured to absorb incoming light in a specific wavelength range and including an absorption body configured to float from the substrate and electrically isolated by a channel; a resistance layer provided between the substrate and the absorption body of the absorption layer and having a resistance value that changes based on temperature variations caused by thermal energy absorbed through the absorption layer; and a resistance reduction layer provided between the absorption layer and the resistance layer to reduce interface resistance and divided by a channel correspond to the channel of the absorption layer.
20250130268. SEMICONDUCTOR TEST APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chunghyun KIM of Suwon-si KR for samsung electronics co., ltd., Changsuk OH of Seongnam-si KR for samsung electronics co., ltd., Kiyoung JEON of Seongnam-si KR for samsung electronics co., ltd., Jaewon YOO of Suwon-si KR for samsung electronics co., ltd., Myoungsuk JANG of Suwon-si KR for samsung electronics co., ltd., Kwanghwa LEE of Seongnam-si KR for samsung electronics co., ltd., Seokjae HONG of Seongnam-si KR for samsung electronics co., ltd.
IPC Code(s): G01R31/26, H01L21/66
CPC Code(s): G01R31/2601
Abstract: a semiconductor test apparatus includes a base plate, side supporters provided as three or more on a lower surface of the base plate, an elastic cylinder and a side stopper provided on a lower surface of each of the side supporters, a center stopper provided laterally apart from the side supporters on the lower surface of the base plate, a stopper foot provided at one end of the center stopper, a foot supporter provided at one end of the stopper foot, a top plate disposed under the base plate to contact the elastic cylinder and the side stopper, the top plate including a center hole in a center portion thereof, and a substrate cover provided under the top plate, wherein the center stopper and the side stopper are selectively locked.
Inventor(s): Lianjun Li of McKinney TX US for samsung electronics co., ltd., Han Wang of Allen TX US for samsung electronics co., ltd., Hao Chen of Allen TX US for samsung electronics co., ltd., Wei Sun of Allen TX US for samsung electronics co., ltd., Satvir S. Bhatia of Sunnyvale CA US for samsung electronics co., ltd., Andrea M. Small of San Francisco CA US for samsung electronics co., ltd., Russell Douglas Ford of Campbell CA US for samsung electronics co., ltd.
IPC Code(s): G01S13/56, H04W84/12
CPC Code(s): G01S13/56
Abstract: methods and systems for user presence detection using wireless technology. a computer-implemented method includes receiving one or more data signals from at least one wifi-node-to-access-point (ap) link or at least one wifi-node-to-node link, performing a signal pre-processing process on the one or more data signals to generate one or more pre-processed data signals, performing the signal pre-processing process including performing a uniform sampling process, a power normalization process, an anomaly sample removal process, and a filtering process, extracting one or more features using the one or more pre-processed data signals, and using the one or more features to determine whether a user is present in the home and identify a specific room in which the user is located.
Inventor(s): Moonjoon KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G02B13/00, G02B9/34
CPC Code(s): G02B13/004
Abstract: an embodiment of the disclosure may provide an electronic device. the electronic device may comprise a lens assembly. the lens assembly may comprise a lens group comprising a first lens, a second lens, a third lens, and a fourth lens sequentially arranged along an optical axis o-i in a direction from an object side to an image side, an aperture, and an image sensor comprising an imaging surface (img) on which an image (i) is formed. the first lens may have positive refractive power, the second lens may have negative refractive power, the third lens may have a convex shape toward the image side, and the fourth lens may have negative refractive power. various other embodiments are possible.
20250130533. WEARABLE ELECTRONIC DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hansol KIM of Suwon-si KR for samsung electronics co., ltd., Heeyoung YUN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G04G17/06, G04G17/04, G06F1/16, H05K1/02
CPC Code(s): G04G17/06
Abstract: a wearable electronic device includes a frame forming a side wall of the wearable electronic device; a printed circuit board within the frame and including a ground portion; and a connecting member, wherein at least a portion of the connecting member extends along the side wall, wherein the connecting member includes: an extension portion extending along the side wall; a first portion extending from a first end of the extension portion and connected to the printed circuit board; a second portion extending from a second end of the extension portion and connected to a conductive region of the printed circuit board; and a conductive trace extending from the first portion to the second portion through the extension portion, the conductive trace is connected to the ground portion through the conductive region of the printed circuit board, and the printed circuit board includes a conductive pattern extending from the conductive region.
Inventor(s): Karthikeyan SUBRAMANI of Bangalore IN for samsung electronics co., ltd., Gokul GOVINDARAJ of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G16Y40/10, G16Y40/30
CPC Code(s): G06F3/011
Abstract: a method for managing one or more internet of things (iot) devices in a metaverse environment is provided. the method includes detecting that a user is engaged in the metaverse environment, monitoring, upon detecting that the user is engaged in the metaverse environment, an operating state of each of the one or more iot devices in a real-world environment, determining at least one iot device from the one or more iot devices requiring user's attention based on the monitored operating state of each of the one or more iot, and generating, within the metaverse environment, an interactable avatar of the determined at least one iot device requiring user's attention, wherein the interactable avatar is a representative of an operating state of the at least one iot device.
Inventor(s): Byungseok SOH of Suwon-si KR for samsung electronics co., ltd., Seungki CHO of Suwon-si KR for samsung electronics co., ltd., Yongseok JANG of Suwon-si KR for samsung electronics co., ltd., Kibum SEONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G06F3/0482, G06F3/04842
CPC Code(s): G06F3/013
Abstract: an electronic apparatus including a mirror display; a sensor; and at least one processor configured to identify a user command for selecting an area of the mirror display, acquire user gaze information through the sensor, identify an object in a predetermined space and reflected in the selected area of the mirror display based on the acquired user gaze information, identify a graphic user interface (gui) to be displayed on the mirror display based on information on the identified object, identify a position on the mirror display to display the identified gui based on the user gaze information, and control the mirror display to display the identified gui on the identified position.
Inventor(s): Jinmo KANG of Suwon-si KR for samsung electronics co., ltd., Sungoh KIM of Suwon-si KR for samsung electronics co., ltd., Jihyun KIM of Suwon-si KR for samsung electronics co., ltd., Hyungsok YEO of Suwon-si KR for samsung electronics co., ltd., Donghyun YEOM of Suwon-si KR for samsung electronics co., ltd., Gunhee LEE of Suwon-si KR for samsung electronics co., ltd., Sanghun LEE of Suwon-si KR for samsung electronics co., ltd., Bokun CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G06T7/73, H04N23/71
CPC Code(s): G06F3/013
Abstract: an electronic device includes a sensor and a processor. the processor identifies whether a characteristic value measured from the sensor while acquiring a first image including a user's eye satisfies a designated condition. when the characteristic value satisfies the designated condition, the processor identifies a pupil position in the first image using a first scheme of extracting a feature point, based on matching with a designated pattern, acquires a second image including the user's eye, and identifies an amount of change in the second image with reference to the first image. when the amount of change in the second image is greater than or equal to a designated level, the processor calculates accuracy of the first scheme, and according to the calculated accuracy, identifies a pupil position in the second image using the first scheme, or a second scheme of extracting a feature point based on a trained network.
20250130671. TOUCH SCREEN DRIVING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): San-Ho Byun of Suwon-si KR for samsung electronics co., ltd., Junchul Park of Suwon-si KR for samsung electronics co., ltd., Taegyun Song of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/041, G06F3/044, G09G3/20
CPC Code(s): G06F3/04184
Abstract: a touch sensor controller according to some implementations includes a reference signal generator generating a reference signal based on an input image signal and a receiver connected to a touch electrode, receiving a sensing signal from the touch electrode, and generating an output signal based on difference between the reference signal and the sensing signal.
Inventor(s): Joseph KIM of Suwon-si KR for samsung electronics co., ltd., Juyeoung KIM of Suwon-si KR for samsung electronics co., ltd., Hyungmin LEE of Suwon-si KR for samsung electronics co., ltd., Hanchul JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/0481, G06F1/16
CPC Code(s): G06F3/0481
Abstract: an electronic device is provided. the electronic device includes a housing, at least one light emitter, which is disposed in an area of the housing, configured to emit at least one of a first color light or a second color light, memory, comprising one or more storage media, storing instructions, and one or more processors communicatively coupled to the at least one light emitter and the memory, wherein the instructions, when executed by one or more processors individually or collectively, cause the electronic device to detect that an event occurs in relation to a first application or a second application installed in the electronic device, control, if the detected event is related to the first application, at least one light emitter to emit the first color light, based on at least one color related to a first icon of the first application, and control, if the detected event is related to the second application, at least one light emitter to emit the second color light, based on at least one color related to a second icon of the second application.
Inventor(s): Gyeongtae PARK of Suwon-si, Gyeonggi-do KR for samsung electronics co., ltd., Junghyeob LEE of Suwon-si, Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): G06F3/04817, G06F3/0482, G06F3/0488, H04M1/02, H04M1/72448, H04M1/72469
CPC Code(s): G06F3/04817
Abstract: an embodiment of the present disclosure provides an electronic device having a rollable display capable of supporting a wallpaper and a wallpaper setting, and a method therefor. according to an embodiment, the electronic device may support, by a processor, wallpaper displaying according to a change in an expansion or contraction state of the rollable display and a wallpaper setting for same. according to an embodiment, the processor may operate to configure a first image area corresponding to first wallpaper displayed in a first display area and display a first preview image corresponding to the configured first image area. according to an embodiment, the processor may operate to configure a second image area corresponding to second wallpaper displayed in a second display area and display a second preview image corresponding to the configured second image area.
Inventor(s): Daeyoung HYUN of Suwon-si KR for samsung electronics co., ltd., Sungtae KIM of Suwon-si KR for samsung electronics co., ltd., Jihun MUN of Suwon-si KR for samsung electronics co., ltd., Jiyoon PARK of Suwon-si KR for samsung electronics co., ltd., Nagyeom YOO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/04845, G06F3/0482, G06F3/0488, G06T15/50
CPC Code(s): G06F3/04845
Abstract: an electronic device disclosed herein may perform operations of: displaying a first image, receiving a gesture input to the first image, identifying a shape of the gesture input and a position on the first image of the gesture input, identifying, based on the gesture input, space information of the first image, determining, based on the space information, lighting information corresponding to the shape and position, and generating a second image by applying, based on the space information, the lighting information to the first image.
Inventor(s): Sunjung Lee of Suwon-si KR for samsung electronics co., ltd., Yoonah Paik of Suwon-si KR for samsung electronics co., ltd., Sanghoon Cha of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F9/30
CPC Code(s): G06F9/3001
Abstract: a memory device includes a first scalar register file storing a first input fragment, a second scalar register file storing a second input fragment, an arithmetic logic unit (alu), and a control circuit. the control circuit is configured to perform, using the alu, a first operation between the first input fragment and a first weight fragment based on a first operation command received from a host, and to perform, using the alu, a second operation between the second input fragment and a second weight fragment based on a second operation command received from the host.
Inventor(s): Seonghyeog Choi of Suwon-si KR for samsung electronics co., ltd., Jiho Kim of Suwon-si KR for samsung electronics co., ltd., Changkyu Seol of Suwon-si KR for samsung electronics co., ltd., Yuseok Song of Suwon-si KR for samsung electronics co., ltd., Daewook Kim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F11/10
CPC Code(s): G06F11/1044
Abstract: a memory system includes a semiconductor memory device and a memory controller to control the semiconductor memory device. the semiconductor memory device includes a memory cell array that is divided into a plurality of sub array blocks arranged in a first direction and a second direction. the memory controller includes an error correction code (ecc) engine. the ecc engine, in a write operation, generates a parity data by performing an ecc encoding on a user data including a plurality of sub data units, generates a main data by interleaving the sub data units based on mapping information such that two sub data units to be stored in one row of a target sub array block are included in one symbol. the mapping information indicates a mapping relationship between the plurality of sub data units and rows of the target sub array block storing the plurality of sub data units.
Inventor(s): Nima ELYASI of San Jose CA US for samsung electronics co., ltd., Changho CHOI of San Jose CA US for samsung electronics co., ltd.
IPC Code(s): G06F11/30, G06F3/06, G06F11/07
CPC Code(s): G06F11/3034
Abstract: a storage device is disclosed. a first storage media may store data. the first storage media may be of a first storage type and may be organized into at least two blocks. a second storage media may also store data. the second storage media may be of a second storage type different from the first type, and may also be organized into at least two blocks. a controller may manage reading data from and writing data to the first storage media and the second storage media. metadata storage may store device-based log data for errors in the storage device. the drive-based log data may include a first log data for the first storage media and a second log data for the second storage media. an identification circuit may identify a suspect block in the at least two blocks in the first storage media and the second storage media, responsive to the device-based log data.
Inventor(s): Kyungjune CHO of Suwon-si KR for samsung electronics co., ltd., Donggil KANG of Suwon-si KR for samsung electronics co., ltd., Minsik OH of Suwon-si KR for samsung electronics co., ltd., Yoon soo KIM of Suwon-si KR for samsung electronics co., ltd., Jongmin KIM of Suwon-si KR for samsung electronics co., ltd., Kyungsik UM of Suwon-si KR for samsung electronics co., ltd., MyungGwan JEONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F12/0862
CPC Code(s): G06F12/0862
Abstract: disclosed is a storage device. the storage device includes: a memory device; a buffer memory configured to store partial data among data stored in the memory device; and a memory controller configured to determine prefetch logical addresses expected to be received sequentially after sequential logical addresses are received from a host, to read prefetch data corresponding to the prefetch logical addresses from the memory device to store the prefetch data as a prefetch group of in the buffer memory, and to release the prefetch group from the buffer memory in response to a logical address discontinuous with the logical addresses being received from the host.
Inventor(s): Yoechan SONG of Suwon-si KR for samsung electronics co., ltd., Dukhyun KIM of Suwon-si KR for samsung electronics co., ltd., Sangheon KIM of Suwon-si KR for samsung electronics co., ltd., Junsung KIM of Suwon-si KR for samsung electronics co., ltd., Dongil SON of Suwon-si KR for samsung electronics co., ltd., Yeunwook LIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F21/62
CPC Code(s): G06F21/6254
Abstract: various embodiments of the disclosure provide an electronic device, a method, and a recording medium configured to provide data sharing based on artificial intelligence (ai). the electronic device according to an embodiment may analyze shared data selected based on an input requesting to shared data of the electronic device. the electronic device may, based on the shared data including the personal information, generate hint information related to the personal information so that information corresponding to the personal information may be inferred by an external electronic device. the electronic device may replace the personal information with the hint information in the shared data and share the shared data including the hint information.
Inventor(s): Lianjun Li of McKinney TX US for samsung electronics co., ltd., Hao Chen of Allen TX US for samsung electronics co., ltd., Han Wang of Allen TX US for samsung electronics co., ltd., Wei Sun of Allen TX US for samsung electronics co., ltd., Satvir S. Bhatia of Sunnyvale CA US for samsung electronics co., ltd., Andrea M. Small of San Francisco CA US for samsung electronics co., ltd., Russell Douglas Ford of Campbell CA US for samsung electronics co., ltd.
IPC Code(s): G06F40/40, G06F16/9535, G06F40/30
CPC Code(s): G06F40/40
Abstract: a method includes obtaining personal activity data of a user generated by one or more sensing devices in proximity to the user. the method also includes receiving a user query from the user via a user interface. the method further includes using a large language model (llm) based digital assistant to generate one or more user-specific suggestions or actions based on the personal activity data and the user query, the digital assistant comprising a hierarchical multi-llm-agent structure that includes one or more pre-trained llms.
Inventor(s): Yechung CHUNG of Suwon-si KR for samsung electronics co., ltd., Woonbae KIM of Suwon-si KR for samsung electronics co., ltd., Youngjun YOON of Suwon-si KR for samsung electronics co., ltd., Soyoung LIM of Suwon-si KR for samsung electronics co., ltd., Jaehyun LIM of Suwon-si KR for samsung electronics co., ltd., Inho CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06K19/07, G06K19/077, G06V40/13
CPC Code(s): G06K19/0718
Abstract: a fingerprint sensor package carrier includes: a film member including through-holes formed in sides of the film member; and a plurality of fingerprint sensor packages arranged on the film member, wherein each of the plurality of fingerprint sensor packages includes a substrate and a controller chip disposed on the substrate, wherein the substrate of each of the plurality of fingerprint sensor packages includes a plurality of first sensing patterns and a plurality of second sensing patterns, wherein the plurality of first sensing patterns are spaced apart from each other in a first direction and extend in a second direction intersecting the first direction, and the plurality of second sensing patterns are spaced apart from each other in the second direction and extend in the first direction, and wherein the film member has adhesiveness, such that the plurality of fingerprint sensor packages are configured to be detached from the film member.
Inventor(s): Yangxu ZHOU of Xi'an CN for samsung electronics co., ltd., Fei DONG of Xi'an CN for samsung electronics co., ltd., Zhonggang CHEN of Xi'an CN for samsung electronics co., ltd., Kun XUE of Xi'an CN for samsung electronics co., ltd.
IPC Code(s): G06N3/045, G06F12/02
CPC Code(s): G06N3/045
Abstract: a method for implementing a deep learning recommendation model (dlrm) is provided. the method includes: querying, by a host, an embedding vector corresponding to an input sparse feature of the dlrm from a first embedding table stored in cxl memory; performing, by the host, a computation for an embedding layer using the embedding vector based on the embedding vector being found in the first embedding table; querying, by a smartssd, the embedding vector from a second embedding table stored in the smartssd and performing the computation for the embedding layer using the embedding vector found in the second embedding table, based on the embedding vector not being found in the first embedding table; and obtaining, by the host, a recommendation result based on a computation result of the embedding layer and a computation result of a bottom multilayer perceptron (mlp) for an input dense feature of the dlrm.
Inventor(s): Shailesh CHAUDHARI of San Diego CA US for samsung electronics co., ltd., Hyukjoon KWON of San Diego CA US for samsung electronics co., ltd.
IPC Code(s): G06N3/0895
CPC Code(s): G06N3/0895
Abstract: a system and a method are disclosed for selecting a detector using an nn for each re in a communication system. a method includes receiving, by the electronic device, at an inference time, a signal from a transmitting device; extracting features from the received signal; inputting the extracted features to an nn, which is trained, at least in part, with a normalization function; and selecting, for each re, a detector from a set of detectors based on non-normalized outputs of the nn.
Inventor(s): Sangyoon LEE of Suwon-si KR for samsung electronics co., ltd., Satoshi NAGAYAMA of Tokyo JP for samsung electronics co., ltd., Woo-Shik KIM of Suwon-si S KR for samsung electronics co., ltd., Heejin CHOI of Suwon-si S KR for samsung electronics co., ltd., Jaesung LEE of Seoul KR for samsung electronics co., ltd.
IPC Code(s): G06T5/50, G06T7/13, G06T7/30, G06T7/90, G06V10/56, G06V10/60, H04N23/11
CPC Code(s): G06T5/50
Abstract: an image acquisition device includes a first image sensor having a first spatial resolution and configured to acquire a first image based on a first wavelength band, a second image sensor having a second spatial resolution lower than the first spatial resolution and configured to acquire a second image based on a second wavelength band wider than the first wavelength band, and a processor configured to register the first image and the second image by using a relative position information between the first image sensor and the second image sensor; generate a third image, of which a color component is determined by replacing a color component of the first image with a color component of the second image; and generate a fourth image, of which a color component is determined by synthesizing the color component of the first image and the color component of the third image through alpha blending.
Inventor(s): Soongeun Jang of Suwon-si KR for samsung electronics co., ltd., Changick Kim of Daejeon KR for samsung electronics co., ltd., Woo-Shik Kim of Suwon-si KR for samsung electronics co., ltd., Hongkyu Park of Suwon-si KR for samsung electronics co., ltd., Sangyun Lee of Suwon-si KR for samsung electronics co., ltd., Sangyoon Lee of Suwon-si KR for samsung electronics co., ltd., Junho Lee of Suwon-si KR for samsung electronics co., ltd., Minbeom Kim of Daejeon KR for samsung electronics co., ltd., Yooseung Wang of Daejeon KR for samsung electronics co., ltd., Jaehyuk Jang of Daejeon KR for samsung electronics co., ltd., Seungjun Jeong of Daejeon KR for samsung electronics co., ltd.
IPC Code(s): G06T5/50, G06T3/4015, G06T3/4053, G06T7/11, G06V10/44, G06V10/60, H04N1/60
CPC Code(s): G06T5/50
Abstract: an image processing device includes an image sensor including a unit block including a plurality of pixels arranged adjacent to each other, wherein a plurality of nano-posts are arranged on the unit block, and a processor that processes an input image acquired through the image sensor.
Inventor(s): Hyunseung LEE of Suwon-si KR for samsung electronics co., ltd., Donghyun Kim of Suwon-si KR for samsung electronics co., ltd., Kyuha Choi of Suwon-si KR for samsung electronics co., ltd., Youngsu Moon of Suwon-si KR for samsung electronics co., ltd., Younghoon Jeong of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T5/60, G06T5/50, G06T5/70, G06T7/00, G06V10/82, G06V20/40
CPC Code(s): G06T5/60
Abstract: provided are an image processing device and an operating method of the same. the image processing device includes a memory storing one or more instructions, and at least one processor processing circuitry, and memory storing one or more instructions that, when executed by the at least one processor individually or collectively, cause the image processing device to obtain a neural network model corresponding to a quality of an input image and viewing information related to the input image. the at least one processor is configured to generate training data, based on the quality of the input image and the viewing information. the at least one processor is configured to train the neural network model by using the training data. the at least one processor is configured to obtain an image quality processed output image from the input image, based on the trained neural network model.
Inventor(s): Junho RIM of Suwon-si KR for samsung electronics co., ltd., Jaewook SHIN of Suwon-si KR for samsung electronics co., ltd., Haedong YEO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T7/12, G06T7/13, G06T7/50, G06V10/44, G06V10/56, G06V10/74
CPC Code(s): G06T7/12
Abstract: provided is a method and device for performing video enhancement. the method includes: identifying a first image from among a plurality of images included in a first video, wherein the first image includes an anomaly; obtaining guide information corresponding to the anomaly from among a plurality of types of guide information; obtaining a second image to replace the first image based on the guide information; and obtaining a second video in which the anomaly has been removed by using the second image.
Inventor(s): Sanghun LEE of Suwon-si KR for samsung electronics co., ltd., Sungoh KIM of Suwon-si KR for samsung electronics co., ltd., Jihyun KIM of Suwon-si KR for samsung electronics co., ltd., Valeriy PRUSHINSKIY of Suwon-si KR for samsung electronics co., ltd., Donghyun YEOM of Suwon-si KR for samsung electronics co., ltd., Dasom LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T11/00, G06F3/01, G06V10/764, G06V20/20, G06V20/50
CPC Code(s): G06T11/00
Abstract: a wearable electronic device is provided. the wearable electronic device includes a camera, a display, a microphone, a sensor, memory storing one or more computer programs, and one or more processors communicatively coupled with the camera, the display, the microphone, the sensor, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the wearable electronic device to determine an environment level indicating a degree of danger of a surrounding environment for a user of the wearable electronic device based on an image obtained through the camera, determine whether to use the sensor, the camera, and the microphone depending on the determined environment level, obtain obstacle information and an estimated impulse between an obstacle and the user based on data input through at least one determined to be used among the sensor, the camera, or the microphone, determine a user interface (ui) level for displaying danger of collision between the obstacle and the user based on the environment level, the obstacle information, and the estimated impulse, generate a graphic entity indicating a direction and a danger degree of the obstacle depending on the ui level, and display an obstacle-related ui including the graphic entity on the display.
Inventor(s): Jihun MUN of Suwon-si KR for samsung electronics co., ltd., Sungtae KIM of Suwon-si KR for samsung electronics co., ltd., Jiyoon PARK of Suwon-si KR for samsung electronics co., ltd., Nagyeom YOO of Suwon-si KR for samsung electronics co., ltd., Daeyoung HYUN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T11/60, G06T7/50, G06T11/20
CPC Code(s): G06T11/60
Abstract: electronic devices, methods, and storage mediums for editing images are provided. an image editing method comprises receiving a first user input for a first image. the method comprises determining whether the first user input indicates an instruction to add a first object. the method comprises, when the first user input indicates an instruction to add the first object, generating a first preliminary object image for the first object. the method comprises displaying a second image including the first object, the second image being generated based on the first preliminary object image and being associated with the first image. the method comprises, when a second user input indicates an instruction related to the first object is received for the second image, displaying a third image in which at least one of a size or a location of the first object is changed according to the second user input.
Inventor(s): Jeongmin KIM of Suwon-si KR for samsung electronics co., ltd., Daehee PARK of Suwon-si KR for samsung electronics co., ltd., Jinki JUNG of Suwon-si KR for samsung electronics co., ltd., Saeimi CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G06F40/30
CPC Code(s): G06T19/00
Abstract: the present disclosure provides an electronic device and a control method therefor. the electronic device according to an embodiment of the present disclosure includes: memory for storing a plurality of images; and at least one processor, comprising processing circuitry, individually and/or collectively, configured to: generate a content to be displayed in a virtual space of metaverse using the plurality of images, select a plurality of images corresponding to a user location from among the plurality of images; obtain an object keyword included in each of the selected plurality of images; determine an object to be reflected onto the virtual space of the metaverse based on a frequency of the object keyword obtained through each of the selected plurality of images; and generate an object content corresponding to the determined object.
Inventor(s): Junho CHO of Suwon-si KR for samsung electronics co., ltd., Moonsub BYEON of Suwon-si KR for samsung electronics co., ltd., Dongwook LEE of Suwon-si KR for samsung electronics co., ltd., Dae Ung JO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06V10/94, G06V10/764, G06V10/774, G06V10/82, G06V20/58, G06V20/70
CPC Code(s): G06V10/95
Abstract: provided are an object detection method and apparatus for an autonomous vehicle. a method of controlling a vehicle includes: detecting a surrounding environment using pieces of data on a driving environment of the vehicle and generating an indication of the surrounding environment; determining, among trained visual prompts received via a network from a server, a target visual prompt corresponding to the pieces of data; generating a merged image by combining a driving image of the autonomous vehicle with the target visual prompt using a predetermined operation; and performing object detection by inputting the merged image into a neural network model of the vehicle, the neural network model configured to infer objects from images inputted thereto.
Inventor(s): Jaeseok CHOI of Suwon-si KR for samsung electronics co., ltd., Dongwook LEE of Suwon-si KR for samsung electronics co., ltd., ByeongJu LEE of Suwon-si KR for samsung electronics co., ltd., Younghwa JUNG of Suwon-si KR for samsung electronics co., ltd., Young Rae CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06V20/58, G06V10/77
CPC Code(s): G06V20/58
Abstract: a processor-implemented method with object recognition includes obtaining sensor data comprising points representing a surrounding environment of a sensor, detecting, from the sensor data, a shaded region in which the points are not generated due to occlusion by a surrounding object, generating feature data using the shaded region, and performing object recognition for the surrounding environment of the sensor based on the feature data.
Inventor(s): Hanhui LI of Xi'an CN for samsung electronics co., ltd., ChunMiao JIANG of Xi'an CN for samsung electronics co., ltd., Xiaochun YAN of Xi'an CN for samsung electronics co., ltd., Huaiwen BAI of Xi'an CN for samsung electronics co., ltd., Jiangbo CHEN of Xi'an CN for samsung electronics co., ltd., Wenyan ZHENG of Xi'an CN for samsung electronics co., ltd., Yanjun CHEN of Xi'an CN for samsung electronics co., ltd.
IPC Code(s): G06V40/12, G06V10/26, G06V10/77
CPC Code(s): G06V40/1347
Abstract: a fingerprint segmentation method and device is provided. the fingerprint segmentation method may include dividing a fingerprint image into a plurality of sub-images, pooling each sub-image to acquire a feature map of the fingerprint image, and segmenting the feature map based on a region growing algorithm to acquire a fingerprint region in the fingerprint image.
Inventor(s): Saurav GAJBHIYE of Noida (U.P.) IN for samsung electronics co., ltd., Prashant SRIVASTAVA of Noida (U.P.) IN for samsung electronics co., ltd.
IPC Code(s): G06V40/20, G06T7/13, G06T7/20, G06V10/25, G06V10/40
CPC Code(s): G06V40/20
Abstract: a method for identifying a gesture associated with a target object may include receiving an image associated with the target object; identifying a region of interest (roi) within the image associated with the target object; determining one or more feature vectors associated with the target object based on the roi; generating a traversal path estimate based on the image and the roi, the traversal path estimate being indicative of a region of movement of the target object; determining, based on the one or more feature vectors and the traversal path estimate, whether the gesture associated with the target object is one of a false gesture or a real gesture; and triggering a response based on the gesture being determined to be a false gesture or a real gesture.
Inventor(s): Taeksu KWON of Suwon-si KR for samsung electronics co., ltd., Insuk Kim of Suwon-si KR for samsung electronics co., ltd., Jeeyeon Eom of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G09G3/3225
CPC Code(s): G09G3/3225
Abstract: a display driving circuit includes an operational amplifier configured to, in a first phase of a test period, charge a source line of a display panel based on a first voltage received through a first input terminal, and in a second phase of the test period, output a comparison result signal by comparing a second voltage received through the first input terminal with a source line voltage received through a second input terminal; a discharge circuit configured to discharge the source line in the second phase; switches configured to, in the first phase, connect an output terminal of the operational amplifier to the source line, and in the second phase, connect the discharge circuit to the source line and the second input terminal of the operational amplifier; and a control logic configured to control a bias current of the operational amplifier based on the comparison result signal.
20250132133. GRID FOR SEMICONDUCTOR PROCESS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jisoo Im of Suwon-si KR for samsung electronics co., ltd., Dongwan Kim of Suwon-si KR for samsung electronics co., ltd., Minsung Kim of Suwon-si KR for samsung electronics co., ltd., Siyoung Koh of Suwon-si KR for samsung electronics co., ltd., Younseon Wang of Suwon-si KR for samsung electronics co., ltd., Junho Im of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01J37/08
CPC Code(s): H01J37/32422
Abstract: a substrate processing apparatus comprises a process chamber, a stage in the process chamber, the stage supporting a substrate, and a grid in the process chamber and upwardly spaced apart from the stage. the grid includes a dielectric plate having a central axis that extends in a first direction, a first electrode plate embedded in the dielectric plate, a second electrode plate downwardly spaced apart from the first electrode plate and embedded in the dielectric plate, and a third electrode plate downwardly spaced apart from the second electrode plate and embedded in the dielectric plate.
Inventor(s): Taeil Cho of Suwon-si KR for samsung electronics co., ltd., Kyungsun Kim of Suwon-si KR for samsung electronics co., ltd., Juho Kim of Suwon-si KR for samsung electronics co., ltd., Changgil Son of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/67, H01L21/683
CPC Code(s): H01J37/3244
Abstract: a gas supply assembly includes: a heat control plate including a heater and a cooler; a gas distribution plate below the heat control plate and including a process gas distribution passage with process gas delivered therethrough and a heat regulating gas distribution passage with heat regulating gas delivered therethrough; a heat transfer pad below the gas distribution plate and including a dielectric material pad including an electrode therein; and a showerhead including a spraying nozzle in communication with the process gas distribution passage and discharging the process gas. the heat transfer pad further includes a process gas movement channel in communication with the process gas distribution passage of the gas distribution plate and a heat regulating gas movement channel in communication with the heat regulating gas distribution passage of the gas distribution plate.
Inventor(s): Hyun Seok Kim of Suwon-si KR for samsung electronics co., ltd., Mukyeong Kim of Suwon-si KR for samsung electronics co., ltd., Sejin Park of Suwon-si KR for samsung electronics co., ltd., Iljeong Heo of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01J37/32, C25B1/04, C25B15/08
CPC Code(s): H01J37/32844
Abstract: a scrubber includes a plasma treatment system, a hydrogen supply system, and a wet treatment system. the plasma treatment system performs a plasma treatment in which a process gas and a hydrogen gas are reacted using plasma. the hydrogen supply system supplies the hydrogen gas to the plasma treatment system. the wet treatment system performs a wet treatment in which a by-product generated by the plasma treatment is wet-treated.
20250132173. SUBSTRATE CLEANING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Heegeun Kim of Suwon-si KR for samsung electronics co., ltd., Donghoon Kwon of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/67
CPC Code(s): H01L21/67046
Abstract: an example substrate cleaning apparatus includes a roll brush that cleans a surface of a substrate. the roll brush includes a drive shaft with a predetermined length and a plurality of brush members positioned around an outside circumference of the drive shaft. one of the plurality of the brush members is provided with a rotation speed lower than the others.
Inventor(s): Jonghwa Kim of Suwon-si KR for samsung electronics co., ltd., Daeho Min of Suwon-si KR for samsung electronics co., ltd., Yunha Kim of Suwon-si KR for samsung electronics co., ltd., Kwanghyun Cho of Suwon-si KR for samsung electronics co., ltd., Kyeongbin Lim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/683, H01L21/67
CPC Code(s): H01L21/6833
Abstract: a cooling system for semiconductor equipment includes a chamber, an electrostatic chuck in the chamber, a coolant pipe housing in at least one of the chamber and the electrostatic chuck, the coolant pipe housing having an internal space, a coolant pipe at least partially in the internal space of the coolant pipe housing, and a flow controller configured to control a flow velocity of the coolant flowing along the coolant pipe so that the flow velocity periodically reaches a highest speed and a lowest speed.
Inventor(s): Yunho KANG of Suwon-si KR for samsung electronics co., ltd., Minsik KIM of Suwon-si KR for samsung electronics co., ltd., Yeonuk KIM of Suwon-si KR for samsung electronics co., ltd., Seran OH of Suwon-si KR for samsung electronics co., ltd., Byounghoon LEE of Suwon-si KR for samsung electronics co., ltd., Jangeun LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/768, H01L21/3105
CPC Code(s): H01L21/76831
Abstract: a method of manufacturing a semiconductor device, the method includes forming interconnection lines buried in a first interlayer insulating layer, the interconnection lines having exposed upper surfaces, selectively forming a preliminary low dielectric constant layer including a polymer containing silicon (si) or an oligomer containing silicon (si) on an upper surface of the first interlayer insulating layer, forming a low dielectric constant layer by performing ultraviolet (uv) and ozone (o) treatments on the preliminary low dielectric constant layer, forming an etch stop layer on the low dielectric constant layer, forming a second interlayer insulating layer on the etch stop layer, and forming a via connected to at least one of the interconnection lines by removing a portion of the second interlayer insulating layer and depositing a conductive material. the via has a shape bent along an upper surface and a side surface of the low dielectric constant layer.
Inventor(s): Seokkyu Lee of Suwon-si KR for samsung electronics co., ltd., Wonbin Shin of Suwon-si KR for samsung electronics co., ltd., Kiseok Kim of Suwon-si KR for samsung electronics co., ltd., Jihye Shim of Suwon-si KR for samsung electronics co., ltd., Jeonggi Jin of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/768
CPC Code(s): H01L21/76879
Abstract: a method of manufacturing a semiconductor package with a semiconductor chip including an active surface and an inactive surface opposite to the active surface is presented. the method includes attaching, to the active surface, a film structure including an insulating layer and a first seed layer contacting the insulating layer. a via hole is formed by penetrating the insulating layer and the first seed layer followed by a descumming the insulating layer and the first seed layer in which the via hole is formed. a second seed layer is formed on the insulating layer and on the first seed layer on which the descum process was performed. a photoresist pattern on the second seed layer enables forming a conductive via by filling both a space defined by the via hole with a conductive material and by filling a space defined by the photoresist pattern with the conductive material.
Inventor(s): Song Yi BAEK of Suwon-si KR for samsung electronics co., ltd., Geumbi MUN of Suwon-si KR for samsung electronics co., ltd., Junga LEE of Suwon-si KR for samsung electronics co., ltd., Okran KIM of Suwon-si KR for samsung electronics co., ltd., Seyoung HWANG of Suwon-si KR for samsung electronics co., ltd., Kyoungchul SHIN of Suwon-si KR for samsung electronics co., ltd., Sungsoo YANG of Suwon-si KR for samsung electronics co., ltd., Daekwang WOO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/768, H01L21/311, H01L21/3213
CPC Code(s): H01L21/76885
Abstract: a method for manufacturing a semiconductor device. the method may include forming an insulating interlayer on a substrate, forming tungsten patterns inside and on the insulating interlayer, forming an insulation pattern on the insulating interlayer to fill a space between the tungsten patterns, and the insulation pattern having a lowest point of an upper surface lower than an upper surface of each of the tungsten patterns, forming a preliminary tungsten oxide layer on the upper surface of each of the tungsten patterns, performing a first surface plasma treatment on the preliminary tungsten oxide layer to remove at least a portion of the preliminary tungsten oxide layer to form a tungsten oxide layer and a protective layer on the tungsten oxide layer, and forming an etch stop layer on the protective layer and the insulation pattern.
20250132218. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): KYUNG DON MUN of Suwon-si KR for samsung electronics co., ltd., WOOYOUNG KIM of Suwon-si KR for samsung electronics co., ltd., YEONHO JANG of Suwon-si KR for samsung electronics co., ltd., HYEONJEONG HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/367, H01L23/00, H01L23/31, H01L23/373, H01L25/00, H01L25/18
CPC Code(s): H01L23/367
Abstract: a semiconductor package includes: a first substrate; a first semiconductor chip; a second semiconductor chip being spaced apart, in a first direction, from the first substrate, the first direction being parallel to a top surface of the first substrate; at least one thermal radiation structure on the first substrate and between the first semiconductor chip and the second semiconductor chip; and a third semiconductor chip on the first semiconductor chip, the second semiconductor chip, and the at least one thermal radiation structure, wherein the at least one thermal radiation structure includes: a thermal radiation post; and a thermal conductive pattern on the thermal radiation post, wherein a bottom surface of the third semiconductor chip is in contact with the thermal conductive pattern, and wherein the top surface of the first substrate is in contact with the thermal radiation post.
Inventor(s): Seogwoo Hong of Suwon-si KR for samsung electronics co., ltd., Sungchan Kang of Suwon-si KR for samsung electronics co., ltd., Dongkyun Kim of Suwon-si KR for samsung electronics co., ltd., Daehyuk Son of Hwaseong-si KR for samsung electronics co., ltd., Hotaik Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/473, H10B80/00
CPC Code(s): H01L23/473
Abstract: a semiconductor device includes a semiconductor chip including a heat transfer surface and a semiconductor integrated circuit, a plurality of porous microstructures each including a plurality of internal pores, external capillary channels between the plurality of porous microstructures, and internal capillary channels in the plurality of porous microstructures, where each of the plurality of porous microstructures are configured to generate a capillary force causing a flow of coolant that exchanges heat with the heat transfer surface of the semiconductor chip.
20250132227. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hansung RYU of Suwon-si KR for samsung electronics co., ltd., Jongbeom PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L23/00, H01L23/522
CPC Code(s): H01L23/481
Abstract: a semiconductor package may include a first semiconductor chip and a second semiconductor chip below the first semiconductor chip. the first semiconductor chip may include a first semiconductor substrate, a first semiconductor device and a first interconnection layer on a bottom surface of the first semiconductor substrate, a first via penetrating the first semiconductor substrate and electrically connected to the first interconnection layer, and a first pad on a bottom surface of the first interconnection layer. the second semiconductor chip may include a second semiconductor substrate, a second via penetrating the second semiconductor substrate, and a second pad on a top surface of the second semiconductor substrate and electrically connected to the second via. the first and second vias may be shifted from each other in a horizontal direction, and the first via may be horizontally spaced apart from the first pad, when viewed in a plan view.
Inventor(s): Juik Lee of Suwon-si KR for samsung electronics co., ltd., Nara Lee of Suwon-si KR for samsung electronics co., ltd., Jong-Min Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L23/00, H01L23/528, H01L25/18
CPC Code(s): H01L23/481
Abstract: a semiconductor chip and a semiconductor package are provided. the semiconductor chip includes a substrate, a first interlayer insulating layer, a porous insulating layer, and a second interlayer insulating layer stacked on the substrate, lower pads on the second interlayer insulating layer and having a first thickness in a vertical direction, third and fourth interlayer insulating layers stacked on the lower pads and the second interlayer insulating layer, an upper pad on the fourth interlayer insulating layer and having a second thickness in the vertical direction greater than the first thickness, and via structures in the fourth interlayer insulating layer and the third interlayer insulating layer and electrically connecting the lower pads and the upper pad. each of the via structures includes a first via in the third interlayer insulating layer and a second via in the fourth interlayer insulating layer and overlapping the first via in the vertical direction.
Inventor(s): Yukyung Park of Hwaseong-si KR for samsung electronics co., ltd., Ungcheon Kim of Cheonan-si KR for samsung electronics co., ltd., Sungwoo Park of Seongnam-si KR for samsung electronics co., ltd., Seungkwan Ryu of Seongnam-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48, H01L23/538, H01L23/544, H01L25/18
CPC Code(s): H01L23/49827
Abstract: provided is an interposer for a semiconductor package, the interposer including an interposer substrate comprising a first main surface and a second main surface opposite to the first main surface, a first through-electrode structure and a second through-electrode structure each passing through the interposer substrate and protruding from the first main surface, a connection terminal structure contacting both the first through-electrode structure and the second through-electrode structure, and a photosensitive polymer layer arranged between the connection terminal structure and the interposer substrate, and between the first through-electrode structure and the second through-electrode structure.
20250132243. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungmin Baek of Suwon-si KR for samsung electronics co., ltd., Seungwan Kim of Suwon-si KR for samsung electronics co., ltd., Joohyung Lee of Suwon-si KR for samsung electronics co., ltd., Hyunwook Choi of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31
CPC Code(s): H01L23/49894
Abstract: a semiconductor package includes a lower redistribution structure including a lower redistribution layer; an interconnection structure disposed on the lower redistribution structure, having internal side surfaces defining a through-portion, external side surfaces, and corner surfaces defining recess portions between adjacent external side surfaces, and including a fiber layer having first fiber ends adjacent to at least a portion of the corner surfaces, an insulating resin layer in which the fiber layer is embedded, and an interconnection layer disposed on at least one surface of the insulating resin layer and electrically connected to the lower redistribution layer; a semiconductor chip disposed in the through-portion of the interconnection structure and including connection pads electrically connected to the lower redistribution layer; an encapsulant disposed in the through-portion and the recess portions of the interconnection structure; an upper redistribution structure disposed on the encapsulant and including an upper redistribution layer electrically connected to the lower redistribution layer; and connection bumps disposed below the lower redistribution structure and electrically connected to the lower redistribution layer.
Inventor(s): Muryeong KUK of Suwon-si KR for samsung electronics co., ltd., Dosun LEE of Suwon-si KR for samsung electronics co., ltd., Seongheum CHOI of Suwon-si KR for samsung electronics co., ltd., Hongkeun PARK of Suwon-si KR for samsung electronics co., ltd., Giwoong SHIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/522, H01L23/528, H01L23/532
CPC Code(s): H01L23/5228
Abstract: an interconnection structure may include a first insulating interlayer on a substrate, a first metal pattern on the substrate and passing through the first insulating interlayer, a seed metal layer pattern surrounding a portion of a sidewall of the first metal pattern and a bottom of the first metal pattern, and a second metal pattern. the second metal pattern may directly contact an uppermost surface of the seed metal layer pattern, the upper sidewall of the first metal pattern, and the upper surface of the first metal pattern. an upper sidewall and an upper surface of the first metal pattern may be exposed by the seed metal layer pattern. the second metal pattern may fill at least a recess between the first insulating interlayer and the first metal pattern.
20250132253. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taejin PARK of Suwon-si KR for samsung electronics co., ltd., Hyeonkyu LEE of Suwon-si KR for samsung electronics co., ltd., Sungsoo YIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H10B12/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor memory device includes a conductive line extending in a first direction, first and second channel regions connected to the conductive line, contact plugs apart from the conductive line in a vertical direction with the first and second channel regions therebetween, a back gate electrode extending in a second direction perpendicular to the first direction between the first and second channel regions, and a back gate dielectric film covering surfaces of the back gate electrode, wherein the back gate dielectric film includes a vertical extension portion arranged between the back gate electrode and each of the first and second channel regions to cover sidewalls of the back gate electrode, and a horizontal extension portion connected integrally to the vertical extension portion and covering the back gate electrode at one position selected from a first position facing the conductive line and a second position facing the contact plugs.
Inventor(s): JINTAE KIM of Clifton Park NY US for samsung electronics co., ltd., PANJAE PARK of Halfmoon NY US for samsung electronics co., ltd., KANG-ILL SEO of Springfield VA US for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L27/092
CPC Code(s): H01L23/5286
Abstract: cmos devices are provided. a cmos device includes a pmos transistor and an nmos transistor. moreover, the cmos device includes a dual power rail having a front-side power rail and a back-side power rail that are both coupled to one of the pmos transistor or the nmos transistor. the pmos transistor and the nmos transistor are in a vertical transistor stack, or are side-by-side.
20250132257. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyo Jin KIM of Suwon-si KR for samsung electronics co., ltd., Dong Hoon HWANG of Suwon-si KR for samsung electronics co., ltd., Min Chan GWAK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/535, H01L23/528, H01L23/532, H01L29/06, H01L29/417, H01L29/423, H01L29/775
CPC Code(s): H01L23/535
Abstract: a semiconductor device may include a via pattern connected to a conductive pattern on a substrate, the via pattern including a lower via pattern and an upper via pattern stacked on the lower via pattern, and a wiring line connected to the upper via pattern and extending in a second direction. the wiring line may include a same metal as the upper via pattern. a bottom width of the wiring line may be greater than a top width of the wiring line. a widths of an upper face of the lower via pattern may be equal to width of the bottom face of the upper via pattern.
Inventor(s): Hae-Jung YU of Seoul KR for samsung electronics co., ltd., Kyung Suk OH of Seongnam-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L21/48, H01L21/683, H01L23/00, H01L23/13, H01L23/31, H01L25/00, H01L25/065
CPC Code(s): H01L23/5386
Abstract: a semiconductor package includes a redistribution layer having a first surface and a second surface opposite to each other, the redistribution layer including a plurality of first redistribution pads on the first surface, a semiconductor chip on the second surface of the redistribution layer, an active surface of the semiconductor chip facing the redistribution layer, a plurality of conductive structures on the second surface of the redistribution layer, the plurality of conductive structures being spaced apart from the semiconductor chip, and a plurality of external connection terminals on and coupled to the conductive structures, the plurality of first redistribution pads have a pitch smaller than a pitch of the plurality of external connection terminals.
20250132271. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyojin Hwang of Suwon-si KR for samsung electronics co., ltd., Junso Pak of Suwon-si KR for samsung electronics co., ltd., Heeseok Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/64, H01L23/498, H01L25/16, H05K1/11, H05K1/18
CPC Code(s): H01L23/642
Abstract: a semiconductor package includes a printed circuit board including a circuit pattern and a silicon capacitor connected to the circuit pattern, a semiconductor chip mounted on the printed circuit board, and an external connection terminal attached below the printed circuit board, wherein the silicon capacitor is a stacked structure of a plurality of substrate structures, each of the plurality of substrate structures includes a silicon substrate, a capacitor structure, a via electrode penetrating through the silicon substrate around the capacitor structure, an upper bump pad disposed on top of the via electrode, and a lower bump pad disposed below the via electrode, and, in the plurality of substrate structures, neighboring silicon substrates are bonded to each other through the upper bump pad and the lower bump pad facing each other.
Inventor(s): HANSUNG RYU of Suwon-si KR for samsung electronics co., ltd., JONGBEOM PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/48, H01L23/522, H01L25/065, H10B80/00
CPC Code(s): H01L24/05
Abstract: a semiconductor chip includes a substrate; a front wiring structure on a front surface of the substrate and that includes a first insulation layer, a second insulation layer on the first insulation layer, a wiring pad, a first connection pad, and a plurality of first vias that electrically connect the wiring pad and the first connection pad; a rear wiring structure on a rear surface of the substrate and that includes a second connection pad; and a through via that penetrates the substrate and the first insulation layer and electrically connects the front wiring structure and the rear wiring structure. a dielectric constant of the first insulation layer is lower than a dielectric constant of the second insulation layer, the wiring pad is located at an interface of the first insulation layer and the second insulation layer, and the first connection pad is embedded in the second insulation layer.
20250132275. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangho Cha of Suwon-si KR for samsung electronics co., ltd., Yunrae Cho of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065, H10B80/00
CPC Code(s): H01L24/05
Abstract: a semiconductor package includes a semiconductor substrate, connection pads on a bottom surface of the semiconductor substrate, and connection bumps respectively on the connection pads, wherein the connection bumps include an extension bump and a non-extension bump, wherein the extension bump includes an extension seed layer on a respective one of the connection pads and a first conductive pillar on the extension seed layer, and wherein the extension seed layer longitudinally extends in a first extension direction.
20250132277. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seokbeom Yong of Suwon-si KR for samsung electronics co., ltd., Jaesun Kim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/498, H01L23/538, H01L25/10
CPC Code(s): H01L24/14
Abstract: a semiconductor package includes a lower redistribution structure, a lower semiconductor chip on the lower redistribution structure, and an upper redistribution structure t on the lower semiconductor chip and including a signal pad, a power pad, a grounding plane, and an upper insulation layer, where the signal pad, the power pad, and the grounding plane are in the upper insulation layer, where a distance between the signal pad and the lower redistribution structure in a vertical direction is less than a distance between the power pad and the lower redistribution structure in the vertical direction, and where the vertical direction is perpendicular to an upper surface of the lower redistribution structure.
Inventor(s): Hansol Yoo of Suwon-si KR for samsung electronics co., ltd., Myoungchul Eum of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L21/56, H01L25/18, H10B80/00
CPC Code(s): H01L24/29
Abstract: a chip attach film includes an adhesive layer, and a filler dispersed in the adhesive layer and including an organic material, wherein a thickness of the adhesive layer is about 0.5 �m to about 3 �m, and wherein an average particle diameter of the filler is equal to or greater than about 0.8 times the thickness of the adhesive layer, and less than about 1 times the thickness of the adhesive layer.
Inventor(s): Jungi JEONG of Suwon-si KR for samsung electronics co., ltd., Jungsuek OH of Suwon-si KR for samsung electronics co., ltd., Jaehoon KIM of Suwon-si KR for samsung electronics co., ltd., Seungwoo BANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01Q9/44, H01Q1/38
CPC Code(s): H01Q9/44
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). a spatial filter is provided. the spatial filter includes a first substrate having a first parasitic element configured to provide a filtering function and disposed on the spatial filter device, a second substrate having a second parasitic element configured to provide a filtering function and disposed under the spatial filter device, and a dipole antenna configured to transmit and receive radio waves in free space, coupled to each of the first parasitic element and the second parasitic element so as not to be aligned therewith, and disposed between the first substrate and the second substrate.
Inventor(s): Kyunghwan LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H02J7/00, H01M50/519
CPC Code(s): H02J7/00714
Abstract: an electronic device includes: first and second batteries; a charging circuit to supply power to the first battery through a first path and supply power to the second battery through a second path; and a processor to control the charging circuit to generate a current corresponding to a sum of a first threshold current of the first battery and a second threshold current of the second battery based on power received from a power transmitter, control the charging circuit to supply a first current to the first battery through the first path and supply a second current to the second battery through the second path based on the current, identify the second current supplied to the second battery, and control the charging circuit such that the magnitude of the second current supplied to the second battery is reduced based on the second current exceeding the second threshold current.
Inventor(s): Sangwoo KANG of Suwon-si KR for samsung electronics co., ltd., Kyunghwan LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H02J7/00
CPC Code(s): H02J7/007182
Abstract: an electronic device according to various embodiments of the disclosure may include a first charging circuit connected to a first node and a second node, a second charging circuit connected to the first node and a third node, a switch connected to the second node and the third node, a battery connected to the second node, a system circuit connected to the third node, and a processor. in addition, various embodiments may be possible.
Inventor(s): Jonggun KIM of Suwon-si KR for samsung electronics co., ltd., Incheol HWANG of Suwon-si KR for samsung electronics co., ltd., Jungwoo PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H02K1/28, F25B31/02, H02K1/2791
CPC Code(s): H02K1/28
Abstract: an outer rotor for a compressor is provided. the outer rotor includes a core formed in a hollow cylindrical shape, a plurality of permanent magnets disposed on an inner circumferential surface of the core, a roof disposed to cover one end of the core and including a bush hole formed at a center of the roof, and a bush disposed in the bush hole of the roof, wherein the core and the bush are made of a metal material, and the roof is made of a resin material, and wherein the roof includes at least one inner notch formed on an inner circumferential surface of the bush hole and at least one outer notch formed on an outer circumferential surface of the roof.
Inventor(s): Hansik OH of Suwon-si KR for samsung electronics co., ltd., Seungwon PARK of Suwon-si KR for samsung electronics co., ltd., Sunggi YANG of Suwon-si KR for samsung electronics co., ltd., Jooseok LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H03F1/02, H03F1/56, H03F3/24, H03F3/45, H03F3/60
CPC Code(s): H03F1/0288
Abstract: in various embodiments, circuitry is provided. the circuitry may comprise: driver amplification circuitry, phase offset circuitry, balun circuitry, carrier amplifier circuitry, and peaking amplifier circuitry. the phase offset circuitry may comprise a first line connected to the driver amplification circuitry and configured to provide a first single-ended signal having a first phase delay. the phase offset circuitry may comprise a second line connected to the driver amplification circuitry and configured to provide a second single-ended signal having a second phase delay different from the first phase delay of the first single-ended signal of the first line. the balun circuitry may comprise first balun circuitry connected between the first line and the carrier amplifier circuitry, and second balun circuitry connected between the second line and the peaking amplifier circuitry.
Inventor(s): Pillseong KANG of Suwon-si KR for samsung electronics co., ltd., Chulho KIM of Suwon-si KR for samsung electronics co., ltd., Sangmin YOO of Suwon-si KR for samsung electronics co., ltd., Sangho LEE of Suwon-si KR for samsung electronics co., ltd., Joonhee LEE of Suwon-si KR for samsung electronics co., ltd., Ikkyun JO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H03L7/099, H03B5/12
CPC Code(s): H03L7/099
Abstract: a phase-locked loop (pll) circuit comprising an oscillator including a first and a second capacitor cell array, each including a plurality of capacitor cells, and a control logic circuit connected to the oscillator. the control logic circuit configured to generate control code configured to control the oscillator such that the oscillator is configured to output a signal with a target frequency, the control code generated based on a first frequency of a first signal output from the oscillator and the target frequency, control at least some of capacitor cells included in the first capacitor cell array based on a first partial code generated based on a specified number of bits of the control code, and control at least some of capacitor cells included in the second capacitor cell array based on a second partial code generated based on bits other than the specified number of bits of the control code.
Inventor(s): Sangwook HAN of Suwon-si KR for samsung electronics co., ltd., Kyoungmin LEE of Suwon-si KR for samsung electronics co., ltd., Kyungsoo LEE of Suwon-si KR for samsung electronics co., ltd., Junho HUH of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04B1/00, H03F3/19
CPC Code(s): H04B1/005
Abstract: a radio frequency integrated circuit (rfic) includes a first receive chain configured to receive a first high-frequency input signal, generate a first baseband signal based on the first high-frequency input signal by using a first downward frequency signal, and output the first baseband signal to a first output port, a first local oscillator configured to generate a first oscillation clock signal, a second local oscillator configured to generate a second oscillation clock signal, a first multiplexer configured to output one among the first and oscillation clock signals to a second output port based on an oscillation clock output selection signal, a first input port configured to receive a third oscillation clock signal from an external source, and a second multiplexer configured to output one among the first through third oscillation signals to the first receive chain as the first downward frequency signal based on a first downward frequency selection signal.
Inventor(s): Alexei Vladimirovich DAVYDOV of Saratov RU for samsung electronics co., ltd., Gregory Vladimirovich MOROZOV of Saratov RU for samsung electronics co., ltd., Denis Viktorovich ESIUNIN of Saratov RU for samsung electronics co., ltd., Dmitry Sergeyevich DIKAREV of Saratov RU for samsung electronics co., ltd., Gregory Aleksandrovich ERMOLAEV of Saratov RU for samsung electronics co., ltd., Maksim Viktorovich ESIUNIN of Saratov RU for samsung electronics co., ltd., Vladimir Alexandrovich PESTRETSOV of Saratov RU for samsung electronics co., ltd.
IPC Code(s): H04B7/0417, H04B7/0456, H04B7/06
CPC Code(s): H04B7/0417
Abstract: a method of beamforming for downlink (dl) transmission in a wireless communication system is provided. the method includes generating, by a base station of the wireless communication system, configuration information required to signal channel state information (csi) to the bs, wherein the configuration information includes parameters of a code book, wherein the code book defines an overall set of spatial beams in which data streams can be transmitted from the bs, wherein each spatial beam is represented by a discrete fourier transform (dft) vector in the code book, and a parameter (n) indicative of a maximum number of dft vectors with one signal polarization in a precoding matrix, transmitting, by the bs, the configuration information from the base station to a user device (ue), based on csi reference signals (csi-rss) received from the bs, choosing, by the ue, a number (l) of multiple input-multiple output (mimo) layers.
20250132792. CSI REPORTING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gilwon Lee of McKinney TX US for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX US for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX US for samsung electronics co., ltd.
IPC Code(s): H04B7/0456, H04W24/10
CPC Code(s): H04B7/0456
Abstract: apparatuses and methods for channel state information (csi) reporting. a method performed by a user equipment (ue) includes receiving information about a channel state information (csi) report, the information indicating an antenna port group, and determining, based on the information, a spatial domain (sd) basis vector bfor each layer l=1, 2 . . . , v. the method further includes determining, based on the information, an inter-polarization coefficient value cfor each layer l=1, 2 . . . , v, where v is a rank value, and transmitting the csi report including a precoding matrix indicator (pmi). the pmi indicates the sd basis vector and the inter-polarization coefficient value.
Inventor(s): Hamid SABER of San Diego CA US for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA US for samsung electronics co., ltd.
IPC Code(s): H04B17/373, H04L5/00, H04W24/10
CPC Code(s): H04B17/373
Abstract: a system and a method are disclosed for artificial intelligence (ai) and machine learning (ml) based channel state information (csi) prediction. the method includes receiving, by a user equipment (ue), a csi reference signal (rs) from a base station; storing, by the ue, a series of csi measurements corresponding to the received csi-rs; receiving, by the ue, a csi report configuration including an indication that artificial intelligence machine learning (aiml) csi prediction is applied; in response to receiving the indication that aiml csi prediction is applied, generating, by the ue, a predicted csi based on the stored csi measurements using a trained aiml model; and transmitting, by the ue, the predicted csi to the base station.
Inventor(s): Xin ZHOU of Beijing CN for samsung electronics co., ltd., Honghong LI of Beijing CN for samsung electronics co., ltd., Junwei REN of Beijing CN for samsung electronics co., ltd., Ying ZHU of Beijing CN for samsung electronics co., ltd., Zhigang WANG of Beijing CN for samsung electronics co., ltd., Nan CAO of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04L1/1867, H04L1/1812, H04L41/16, H04W24/10
CPC Code(s): H04L1/1887
Abstract: embodiments of the present disclosure provide a communication method, a network node, a storage medium and a program product, and relate to fields such as communication and artificial intelligence. in an example method, a first network node determines a first retransmission ue, determines an mu pairing recommendation result using a first ai network based on the first retransmission ue, and transmits the mu pairing recommendation result to a second network node, so that the computation of mu scheduling of the second network node can be assisted, and the computation complexity of mu scheduling of the second network node can be reduced. optionally, the method performed by a network node can be performed by an artificial intelligence mode
Inventor(s): Tianyu WANG of San Jose CA US for samsung electronics co., ltd.
IPC Code(s): H04L7/00, H04L7/033
CPC Code(s): H04L7/0054
Abstract: a method and an apparatus are provided in which at least one data slicer of a receiver samples a signal based on a clock sampling position to obtain a first data sample and a second data sample. an integrator of the receiver integrates the signal from the first data sample to the second data sample to generate an integrated voltage. a first data slicer of the receiver samples the integrated voltage at a time of the second data sample to obtain an integrated sample. a phase detector of the receiver determines whether the clock sampling position requires adjustment based on a sign of the integrated sample.
Inventor(s): Jungha PAIK of Suwon-si KR for samsung electronics co., ltd., Dongmin KIM of Suwon-si KR for samsung electronics co., ltd., Bumhan KIM of Suwon-si KR for samsung electronics co., ltd., Hyeongseok KIM of Suwon-si KR for samsung electronics co., ltd., Dongwook SHIM of Suwon-si KR for samsung electronics co., ltd., Dasom LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L9/32, G06N3/098, H04L9/14
CPC Code(s): H04L9/3263
Abstract: a server intermediating federated learning, a user device, and a system including the server and the user device are disclosed. an intermediate server receives a global model from a central server to transmit the global model to a plurality of user devices. the intermediate server updates the global model based on a plurality of local models received respectively from the plurality of user devices in response to the transmission of the global model. one or more of the plurality of user devices includes a machine learning core to generate a local model by training the global model. the global model and individual data of a user device input into the machine learning core are encrypted or decrypted based on whether a key manager is comprised in the machine learning core.
Inventor(s): Mojtaba RAHMATI of San Diego CA US for samsung electronics co., ltd., Hyukjoon KWON of San Diego CA US for samsung electronics co., ltd., Dongwoon BAI of San Diego CA US for samsung electronics co., ltd.
IPC Code(s): H04L25/02, H04L25/03
CPC Code(s): H04L25/0258
Abstract: a system and a method are disclosed for noise power estimation in wireless communications. in some embodiments, the method includes: receiving a reference signal; generating a first channel estimate, based on the reference signal; calculating a first noise power estimate; calculating a corrected noise power estimate by applying a multiplicative correction based on a linear minimum mean square error filter weight to the first noise power estimate; receiving a transmission; and decoding the transmission, based on the corrected noise power estimate.
Inventor(s): Gaurav MALHOTRA of Cupertino CA US for samsung electronics co., ltd.
IPC Code(s): H04L25/06, H03M1/12
CPC Code(s): H04L25/061
Abstract: a method and an apparatus are provided in which an analog signal may be sampled by an analog-to-digital converter (adc) to generate digital signal samples affected by baseline wander. digital signal processing (dsp) may be performed on the digital signal samples to generate a recovered signal with corrected baseline wander. the dsp is performed using a first adaptable coefficient for a current digital signal sample and a second adaptable coefficient for a previous digital signal sample.
Inventor(s): Hyesung KIM of Suwon-si KR for samsung electronics co., ltd., Cheolung LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L67/148, H04L67/10, H04L67/51, H04L67/62
CPC Code(s): H04L67/148
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher data transmission rates. in a wireless communication system, a method performed by an edge enabler server (ees) comprises the steps of: receiving, from an edge enabler client (eec), a request message including information related to a predicted movement path of a terminal including the eec; and determining an application context storage time on the basis of information related to the predicted movement path of the terminal.
Inventor(s): Jaewoong CHUNG of Suwon-si KR for samsung electronics co., ltd., Junghyuck IM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H05K1/02, H05K5/02
CPC Code(s): H04M1/0268
Abstract: an electronic device is disclosed. the electronic device includes: a first housing, a second housing configured to be movably coupled to the first housing, a flexible display configured to change a visible area according to the movement of the second housing, and an external frame connected to the portion of the first housing and configured to protect the bending portion of the flexible display from external impact.
Inventor(s): Youngtae Kim of Suwon-si KR for samsung electronics co., ltd., Bonseuk Goo of Suwon-si KR for samsung electronics co., ltd., Byungseok Soh of Suwon-si KR for samsung electronics co., ltd., Taegyoung Ahn of Suwon-si KR for samsung electronics co., ltd., Sangki Yoon of Suwon-si KR for samsung electronics co., ltd., Youngchol Lee of Suwon-si KR for samsung electronics co., ltd., Weonhee Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N5/74, G03B21/14, G06F3/14, G06T7/10, G09G5/02, G09G5/10
CPC Code(s): H04N5/74
Abstract: a first electronic device provides a first part of an input image in conjunction with a second electronic device projecting a second part of the input image. the first electronic device is configured to: obtain information about a projection surface to which the second electronic device projects the second part of the input image, segment an input image into the first part corresponding to a first area and the second part corresponding to a second area based on the information about the projection surface and information about the first electronic device, and display the first part of the input image based on information about the first area, and control the communication interface to transmit information about the second part corresponding to the second area to the second electronic device.
Inventor(s): Eunjoo CHO of Suwon-si KR for samsung electronics co., ltd., Yuri MIN of Suwon-si KR for samsung electronics co., ltd., Youngah LEE of Suwon-si KR for samsung electronics co., ltd., Kyunghwa JUNG of Suwon-si KR for samsung electronics co., ltd., Donghun SHIN of Suwon-si KR for samsung electronics co., ltd., Woonghee LEE of Suwon-si KR for samsung electronics co., ltd., Junpyo HONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N21/422, H04N21/431
CPC Code(s): H04N21/42226
Abstract: provided are an electronic device and a method for controlling the same. the electronic device includes a display, a memory configured to store at least one instruction, and a processor configured to, by executing the at least one instruction, acquire, while pairing the electronic device with an external input device is performed, information about the external input device from the external input device, acquire button mapping information between an existing input device of the electronic device and the external input device based on the information about the external input device, control the display to display an image corresponding to the external input device acquired based on the information about the external input device, and control the display to display the button mapping information using the image corresponding to the external input device displayed on the display.
Inventor(s): Yunhui KIM of Suwon-si KR for samsung electronics co., ltd., Seungjoon LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N23/63, G06V40/20, H04N23/611
CPC Code(s): H04N23/632
Abstract: a method for photographing by an electronic device, the method including: recognizing, as a target object, an object corresponding to a hand gesture among at least one object included in a first preview image; and displaying a photographing screen including the target object photographed based on a first viewing angle and the first preview image.
Inventor(s): Sungwook YOUN of Suwon-si KR for samsung electronics co., ltd., Seoyoung LEE of Suwon-si KR for samsung electronics co., ltd., Sehoon KIM of Suwon-si KR for samsung electronics co., ltd., Daiwoong CHOI of Suwon-si KR for samsung electronics co., ltd., Byungjun SON of Suwon-si KR for samsung electronics co., ltd., Sungjoo AHN of Suwon-si KR for samsung electronics co., ltd., Yanggeun OH of Suwon-si KR for samsung electronics co., ltd., Taehwa HONG of Suwon-si KR for samsung electronics co., ltd., Jiyoon PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N23/60, H04N23/63
CPC Code(s): H04N23/64
Abstract: an electronic device according to various embodiments may include: a display; an image sensor; and a processor configured to be operatively connected to the display and the image sensor. the processor may be configured to: display a first indicator at a specified position within a preview screen of the image sensor displayed on the display; identify a target on the preview screen; identify a target region corresponding to the identified target among a plurality of candidate target regions including the identified target on the basis of aesthetic scores assigned to the plurality of candidate target regions; display a second indicator corresponding to the identified target region on the preview screen; and when the second indicator is moved to the specified position, generate a photographic image corresponding to the preview screen at a specified time.
Inventor(s): Kinam KWON of Suwon-si KR for samsung electronics co., ltd., Seo hee SO of Suwon-si KR for samsung electronics co., ltd., Hyochul KIM of Suwon-si KR for samsung electronics co., ltd., Sungmo AHN of Suwon-si KR for samsung electronics co., ltd., Hyong Euk LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N23/80, H04N23/11, H04N23/13
CPC Code(s): H04N23/80
Abstract: a machine-perspective signal processing method and apparatus are provided. the machine-perspective signal processing method includes selecting a first sensor from among a plurality of sensors, processing output data of the first sensor using first sensor-specific signal processing having a first individual setting specialized for the first sensor and sensor-agnostic signal processing having a common setting of the plurality of sensors, and performing a first task based on the processed output data.
Inventor(s): Dochang AHN of Suwon-si KR for samsung electronics co., ltd., Seongwook Song of Suwon-si KR for samsung electronics co., ltd., Jeongguk Lee of Suwon-si KR for samsung electronics co., ltd., Taeshick Wang of Suwon-si KR for samsung electronics co., ltd., Jaeseong Yu of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N23/84
CPC Code(s): H04N23/843
Abstract: an image sensor is provided. the image sensor includes: pixel groups; a readout circuit configured to output full pixel values respectively corresponding to the pixel groups and sub pixel values respectively corresponding to the pixel groups, wherein a full pixel value is generated based on pixel signals of all pixels in a first pixel group, and a sub pixel value is generated based on some of the pixel signals in the first pixel group; and an image signal processor configured to: generate, based on the full pixel value indicating the first pixel group is a saturation pixel group, a color ratio of the saturation pixel group by using a target sub pixel value corresponding to the saturation pixel group; and compensate for the full pixel value of the saturation pixel group based on the color ratio of the saturation pixel group.
Inventor(s): Jungwoo KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N25/773, G06T7/11, G06T7/80, G06V10/60
CPC Code(s): H04N25/773
Abstract: a method of obtaining an image includes: determining a parameter for splitting a frame into a plurality of subframes; obtaining an image signal during at least one subframe period corresponding to the determined parameter, by using a counted number of a counter provided in a pixel of a photon counting image sensor; and estimating image information of the frame based on the obtained image signal. the parameter includes a frame period, a subframe period, and a threshold value of the counter.
Inventor(s): Hwa-Sung KIM of Yongin-si KR for samsung electronics co., ltd., Dong Hyun SOHN of Hwaseong-si KR for samsung electronics co., ltd., Ji-Eun LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04R1/04, G10L15/26, G10L15/28, H01L25/075, H04R1/02, H10H20/856, H10H20/857
CPC Code(s): H04R1/04
Abstract: a home appliance includes an electrical equipment compartment disposed in an upper portion of the home appliance, and including an upper side that is open, an electrical equipment compartment cover to cover the open upper side of the electrical equipment compartment, and including a speaker hole, a microphone accommodating portion which protrudes upward from an upper side of the electrical equipment compartment cover and including an accommodating space and a front portion that includes microphone holes laterally spaced apart from each other and which face toward a front of the home appliance, a microphone unit including a printed circuit board (pcb) disposed in the accommodation space behind the microphone holes and including microphone chips mounted on the pcb, and a speaker unit disposed in the electrical equipment compartment to correspond to the speaker hole.
Inventor(s): Swetal Patel of Monroe Township NJ US for samsung electronics co., ltd., Rajeshkumar Somasekhar of Skillman NJ US for samsung electronics co., ltd.
IPC Code(s): H04W8/18, G06K19/06, H04L67/55
CPC Code(s): H04W8/18
Abstract: a method includes obtaining, using at least one processing device of an electronic device, input identifying a specified service offered by a mobile network operator that is not currently part of a service plan associated with the electronic device. the method also includes generating, using the at least one processing device, a subscription message for the mobile network operator, where the subscription message requests the specified service from the mobile network operator. the method further includes initiating, using the at least one processing device, transmission of the subscription message to the mobile network operator. in addition, the method includes obtaining, using the at least one processing device, a response to the subscription message, where the response indicates that the electronic device has been subscribed to the specified service.
Inventor(s): Hyewon LEE of Suwon-si KR for samsung electronics co., ltd., Kangjin YOON of Suwon-si KR for samsung electronics co., ltd., Duckey LEE of Suwon-si KR for samsung electronics co., ltd., Jonghoe KOO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W12/06, H04L9/32, H04W4/50, H04W8/18, H04W8/20, H04W12/04, H04W12/08, H04W12/30
CPC Code(s): H04W12/06
Abstract: a method, performed by a user equipment (ue), of managing secondary platform bundles (spbs), includes receiving an end user selection for managing a state of at least one spb among spbs installed in a smart secure platform (ssp) module; checking bundle management information required to manage the state of the at least one spb based on the end user selection; determining whether end user intent confirmation is required to manage the state of the at least one spb according to the end user selection based on the bundle management information; and managing the state of the at least one spb based on a result of the determining.
Inventor(s): Minsuk CHOI of Suwon-si KR for samsung electronics co., ltd., Kyungrae KIM of Suwon-si KR for samsung electronics co., ltd., Hyokyung WOO of Suwon-si KR for samsung electronics co., ltd., Seowoo JANG of Suwon-si KR for samsung electronics co., ltd., Hongjun JANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W16/22, G06N3/092, G06N20/00, H04B17/11, H04B17/21, H04B17/391, H04L41/14, H04L41/16, H04W24/02, H04W24/08, H04W28/08, H04W52/02, H04W84/02, H04W88/08, H04W88/12, H04W92/02, H04W92/12
CPC Code(s): H04W16/22
Abstract: an electronic device is provided. the electronic device includes a communication circuit, a memory configured to store a learning model, and at least one processor, wherein the at least one processor is configured to obtain data related to a network situation of a base station from the communication circuit, calculate a performance indicator value related to network performance according to a performance indicator, based on the data related to the network situation, train the model, based on the performance indicator value calculated according to the performance indicator, determine an off threshold of traffic for turning off a cell, based on the trained model, and transmit the determined off threshold to the base station via the communication circuit.
Inventor(s): Jicheol LEE of Suwon-si KR for samsung electronics co., ltd., Sunghoon KIM of Suwon-si KR for samsung electronics co., ltd., Hyesung KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04L12/14, H04L41/0813, H04L67/14
CPC Code(s): H04W28/0236
Abstract: the present disclosure relates to a 5generation (5g) or pre-5g communication system for supporting a data transmission rate higher than that of a 4generation (4g) communication system such as long-term evolution (lte). according to various embodiments of the present disclosure, provided is a method for operating a network node such as an application function (af) node in a wireless communication system, the method comprising the steps of: generating an af request including information related to one or more data path latencies; and transmitting the information related to the one or more data path latencies to a session management function (smf) node through a network exposure function (nef) node.
Inventor(s): Dibyajyoti PATI of Bangalore IN for samsung electronics co., ltd., Jajohn MATHEW MATTAM of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): H04W36/00
CPC Code(s): H04W36/00838
Abstract: a method of managing inter radio access technology (rat) handover of a user equipment (ue) in a wireless communication system, includes: detecting, by the ue, a communication session established via a higher priority rat managed by a network; determining, by the ue, whether measurements related to a lower priority rat is configured in the ue by the network; detecting, by the ue, a temperature of the ue, the temperature being reaching each of a plurality of pre-defined temperature levels, wherein the plurality of pre-defined temperature levels are lesser than a pre-defined maximum temperature level; and transmitting, by the ue, one or more requests to the network for performing inter rat handover from the higher priority rat to the lower priority rat, based on the determined measurements and the detected communication session.
Inventor(s): Fuyuan LI of Beijing CN for samsung electronics co., ltd., Bin WANG of Beijing CN for samsung electronics co., ltd., Hong WANG of Beijing CN for samsung electronics co., ltd., Lixiang XU of Beijing CN for samsung electronics co., ltd., Weiwei WANG of Beijing CN for samsung electronics co., ltd., Donmyoung LEE of Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H04W36/36, H04W36/00, H04W76/20
CPC Code(s): H04W36/362
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure provides a method performed by a user equipment (ue) in a wireless communication system. the method includes: receiving a message including a first indication, wherein the first indication is used to indicate keeping resources of candidate cells; and determining a target cell from the candidate cells and performing cell access.
Inventor(s): Jan KIENIG of Warsaw PL for samsung electronics co., ltd., Pawel SLOWIKOWSKI of Warsaw PL for samsung electronics co., ltd., Gracjan KWIATKOWSKI of Warsaw PL for samsung electronics co., ltd.
IPC Code(s): H04W48/16, H04W48/04
CPC Code(s): H04W48/16
Abstract: a first network entity performing communication in a wireless communication system supporting a network slice, includes: memory storing instructions; and at least one processor, wherein the at least one processor is configured to execute the instructions to cause the first network entity to: receive, from a second network entity, a request to activate or deactivate a network slice instance (nsi) for a geographical coverage area; search for a list comprising at least one of: at least one network slice subnet instance (nssi), or at least one network slice subnet management entity function (nssmf); and send a request to a third network entity to activate or deactivate an nssi, and wherein the at least one nssi and the at least one nssmf each support at least one of: the geographical coverage area, or an area code list mapped to the geographical coverage area.
Inventor(s): Seunghoon CHOI of Gyeonggi-do KR for samsung electronics co., ltd., Hyewon YANG of Gyeonggi-do KR for samsung electronics co., ltd., Jaewon LEE of Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W76/28
CPC Code(s): H04W52/0229
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method performed by a ue includes receiving, from a bs, configuration information associated with a wus, monitoring the wus based on the configuration information, in case that the wus is received from the bs, determining whether the detected wus triggers activation of an mr, and determining whether to transmit an uplink signal based on whether the detected wus triggers the activation of the mr.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore IN for samsung electronics co., ltd., Avijit MANNA of Bangalore IN for samsung electronics co., ltd., Kalyan DHULIPUDI of Bangalore IN for samsung electronics co., ltd., Ankit DHABRIYA of Bangalore IN for samsung electronics co., ltd., Ankit SRIVASTAV of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W36/30, H04W36/32
CPC Code(s): H04W52/0232
Abstract: the present subject matter describes performing radio resource management (rrm) measurements by a wtru in a 3gpp networks. the method comprise defining at-least one of: a) a channel condition threshold, b) a wtru mobility threshold, and c) a measurement-reliability threshold. a first sub-set of reference-signal samples are measured out of a set of reference-signal samples based on sensing at least one of current channel conditions and mobility-conditions. a reliability-parameter associated with the first sub-set of measured samples is checked. finally, network-measurement operation is concluded in case of the reliability-parameter being in accordance with the pre-defined reliability-thresholds:
Inventor(s): He WANG of Beijing CN for samsung electronics co., ltd., Xutao ZHOU of Beijing CN for samsung electronics co., ltd., Yankun LI of Beijing CN for samsung electronics co., ltd., Yunchuan YANG of Beijing CN for samsung electronics co., ltd., Chanho AN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W56/00
CPC Code(s): H04W56/0045
Abstract: the present disclosure discloses a method and device in a wireless communication system. a method performed by a user equipment (ue) in a wireless communication system, comprising: receiving, by the ue, uplink timing advance (ta) related information from a network-side entity; determining uplink timing advance (ta), by the ue, based on the received uplink timing advance (ta) related information, and downlink timing related information, wherein the downlink timing related information comprises a current downlink timing tof the ue and a downlink timing tobtained by the ue based on a received specific downlink reference signal; and transmitting an uplink signal to the network-side entity based on the determined ta.
Inventor(s): Yue YUAN of Beijing CN for samsung electronics co., ltd., Mingli WANG of Beijing CN for samsung electronics co., ltd., Nan CAO of Beijing CN for samsung electronics co., ltd., Fang XIE of Beijing CN for samsung electronics co., ltd., Mei LIU of Beijing CN for samsung electronics co., ltd., Jiankang WANG of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04W72/0446
CPC Code(s): H04W72/0446
Abstract: the disclosure relates to a method performed by a network node in a communication system and the network node, which relates to a field of artificial intelligence. the method comprises: determining a first resource allocation pattern corresponding to at least one cell; obtaining a second resource allocation pattern corresponding to the at least one cell, by adjusting the first resource allocation pattern of the at least one cell based on information related to interference between cells. the method may be performed by an electronic apparatus and may be performed using an artificial intelligence model.
Inventor(s): Kyungjun CHOI of Suwon-si KR for samsung electronics co., ltd., Seongmok LIM of Suwon-si KR for samsung electronics co., ltd., Youngrok JANG of Suwon-si KR for samsung electronics co., ltd., Hyoungju JI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04L5/00
CPC Code(s): H04W72/1268
Abstract: the disclosure relates to a 5g or 6g communication system for supporting higher data transmission rates. in addition, the disclosure relates to operations of a ue and base station in a wireless communication system. specifically, the disclosure relates to a method for transmitting an ul control signal by a ue and an apparatus capable of performing the same. the disclosure provides a subband-based transmission method in a wireless communication system.
Inventor(s): Dalin Zhu of Allen TX US for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ US for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX US for samsung electronics co., ltd.
IPC Code(s): H04W72/232, H04L5/00
CPC Code(s): H04W72/232
Abstract: methods and apparatus for beam activation, indication, and application. a method includes receiving, in a tci state activation/deactivation mac ce command, l activated tci codepoints and receiving a dci with a tci field having s tci codepoints. each of the l activated tci codepoints is mapped to a first or second tci state. the method further includes identifying, the l activated tci codepoints that are mapped to the s tci codepoints, applying the first tci state and the second tci state for transmission and reception, receiving, in a first dci and a second dci, a first indication of the first tci state and a second indication of the first tci state, respectively, and identifying, based on a time of reception of the first and second dcis, the first or second indication of the first tci state to use to update the first tci state after a beam application time.
Inventor(s): Hong WANG of Beijing CN for samsung electronics co., ltd., Lixiang XU of Beijing CN for samsung electronics co., ltd., Weiwei WANG of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04W72/30, H04L12/18, H04W4/06, H04W76/10, H04W76/40
CPC Code(s): H04W72/30
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. embodiments of the present disclosure provides a method for establish a channel, a base station, and a multi-cell multicast coordination entity (mce), the method being applied in the base station and including: a point-to-point establishment request transmitted by a multi-cell multicast coordination entity (mce) is received, the point-to-point establishment request being used to indicate establishment of a point-to-point channel for transmission of a multimedia broadcast multicast service mbms, and the point-to-point establishment request including at least one of an mbms service identifier and an identifier of a protocol data unit session (pdu session), and a bearer establishment request is transmitted to a core network in accordance with the point-to-point establishment request, for determining that the point-to-point channel is successfully established and converting the point-to-multipoint channel to a point-to-point channel. the method provided by the present disclosure implements establishment of the point-to-point channel to a point-to-multipoint channel. the embodiments of the present application provide a multimedia broadcast and multicast service (mbms) transmission method and device. the method is applied to a du, comprising: receiving a first notification message transmitted by a cu; transmitting a first message to the cu; transmitting the mbms notification message to the ue according to the first notification message, wherein the mbms notification message is used to notify the ue to receive a message transmitted on a mbms control channel; receiving an mbms service start request message transmitted by the cu; transmitting a mbms message to the ue, used for establishing an mbms bearer and transmitting mbms data. the method provided in the present application realizes the successful establishment of a mbms bearer and the effective transmission of mbms data under a separated architecture.
20250133671. DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jangho KIM of Suwon-si KR for samsung electronics co., ltd., Sanghyeon NA of Suwon-si KR for samsung electronics co., ltd., Jaeneung LEE of Suwon-si KR for samsung electronics co., ltd., Sangyoung LEE of Suwon-si KR for samsung electronics co., ltd., Kihong KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05K5/02, G02B7/182
CPC Code(s): H05K5/0234
Abstract: a display apparatus including a stand configured to support a display, the stand including a stand base configured to be supported on a support surface, the stand base including an inclined portion configured to be inclined at a predetermined angle with respect to the support surface when the stand base is supported on the support surface, and a stand neck configured to connect a rear surface of the display and the stand base to support the display on the stand, the stand neck including a reflective portion that is connected to the inclined portion so that the reflective portion is perpendicular to the inclined portion, wherein the reflective portion is configured to reflect the inclined portion.
Inventor(s): Eui-Hyuk Kim of Suwon-si KR for samsung electronics co., ltd., Ji Yeon Chang of Suwon-si KR for samsung electronics co., ltd., Hyeon Song Cha of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor memory device includes a storage pad on a substrate, a lower electrode on the storage pad and including a trench defined by a bottom and sidewalls of the lower electrode, a lower support pattern including a first portion in the trench and a second portion on an upper surface of the lower electrode, an upper support pattern on an upper surface of the lower support pattern, a capacitor dielectric film on the lower electrode, the lower support pattern, and the upper support pattern, and an upper electrode on the capacitor dielectric film.
20250133728. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Iljae Shin of Suwon-si KR for samsung electronics co., ltd., Jinwoo Han of Suwon-si KR for samsung electronics co., ltd., Seokhan Park of Suwon-si KR for samsung electronics co., ltd., Sungmin Park of Suwon-si KR for samsung electronics co., ltd., Gyuhwan Oh of Suwon-si KR for samsung electronics co., ltd., Kiseok Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/45
CPC Code(s): H10B12/482
Abstract: a semiconductor device includes a bit line, a channel, a word line and a capacitor. the bit line is disposed on a substrate, and extends in a first direction substantially perpendicular to an upper surface of the substrate. the channel at least partially surrounds a sidewall of the bit line. the word line is disposed on the substrate, and at least a portion of the word line overlaps the channel in a horizontal direction substantially parallel to the upper surface of the substrate. the capacitor is electrically connected to the channel, and at least a portion of the capacitor overlaps the channel and the word line in the horizontal direction.
20250133729. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taejin Park of Suwon-si KR for samsung electronics co., ltd., Kyusul Park of Suwon-si KR for samsung electronics co., ltd., Sungsoo Yim of Suwon-si KR for samsung electronics co., ltd., Taeha Suh of Suwon-si KR for samsung electronics co., ltd., Hyeonkyu Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/485
Abstract: a semiconductor memory device includes a conductive line extending in a first direction, channel regions spaced apart from each other in the first direction over the conductive line and each electrically connected to the conductive line, a back gate electrode spaced apart from the conductive line in a third direction and extending in a second direction between first and second channel regions selected from the channel regions, a pair of word lines spaced apart from each other in the first direction and between the second and third channel regions selected from the channel regions, and epitaxial direct contact plugs extending in the third direction between the channel regions and the conductive line and each including a contact surface contacting one of the channel regions, a protruding contact portion at least partially surrounded by the conductive line, and a vertical contact portion between the contact surface and the protruding contact portion.
Inventor(s): JOONGWON SHIN of Suwon-si KR for samsung electronics co., ltd., SEHYUN HWANG of Suwon-si KR for samsung electronics co., ltd., JONG-MIN LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L23/00, H01L25/065, H01L25/18, H10B80/00
CPC Code(s): H10B12/50
Abstract: a semiconductor device includes a first interlayer insulating layer on a substrate and including an upper surface at a first level, a second interlayer insulating layer on the first interlayer insulating layer, and including a material with less density than that of the first interlayer insulating layer, a first contact in the first interlayer insulating layer and having an upper surface at a second level higher than the first level, a through via in the first interlayer insulating layer and substrate, and having an upper surface at a third level higher than the second level, a first wiring in the second interlayer insulating layer, in contact with the first contact, and having a lower surface at a fourth level lower than the first level, and a second wiring in the second interlayer insulating layer, in contact with the through via, and having a fifth level lower than the fourth level.
20250133732. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeon Song CHA of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: a semiconductor memory device comprising a substrate including a cell area and a peripheral area; a peripheral gate structure disposed on the substrate and in the peripheral area thereof; a peripheral wiring line connected to the substrate disposed on the peripheral gate structure and connected to the substrate; a peripheral etch stop film disposed on the peripheral wiring line; an element isolation film defining an active area in the cell area disposed in the substrate and in the cell area thereof to define an active area in the cell area; a storage pad connected to the active area defined in the cell area; a cell etch stop film disposed on the storage pad; and a capacitor structure extending through the cell etch stop film to contact the storage pad, wherein the peripheral etch stop film and the cell etch stop film respectively include materials different from each other.
Inventor(s): Hyesung PARK of Suwon-si KR for samsung electronics co., ltd., Jonghyuk PARK of Suwon-si KR for samsung electronics co., ltd., Seungji KANG of Suwon-si KR for samsung electronics co., ltd., Seongeun KIM of Suwon-si KR for samsung electronics co., ltd., Jinwoo BAE of Suwon-si KR for samsung electronics co., ltd., Dongwon LEE of Suwon-si KR for samsung electronics co., ltd., Juyeon HAN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: a semiconductor device may include a substrate with a memory cell area including a first active area and a peripheral circuit area including a second active area, a capacitor structure including a first electrode connected to the first active area in the memory cell area, a second electrode including a silicon containing layer surrounding the first electrode on the memory cell area and a metal plate layer on the silicon containing layer, an interlayer insulating layer on the peripheral circuit area, and a capping insulating layer covering the capacitor structure on the memory cell area and covering the interlayer insulating layer on the peripheral circuit area. the capacitor structure may include a capacitor dielectric layer between the first and second electrode. the metal plate layer may be on an upper surface of the silicon containing layer and may not be on a side surface of the silicon containing layer.
Inventor(s): Chulmin Choi of Suwon-si KR for samsung electronics co., ltd., Changhee Lee of Suwon-si KR for samsung electronics co., ltd., Dajin Kim of Suwon-si KR for samsung electronics co., ltd., Jiwoong Kim of Suwon-si KR for samsung electronics co., ltd., Tae Hun Kim of Suwon-si KR for samsung electronics co., ltd., Sang-Yong Park of Suwon-si KR for samsung electronics co., ltd., Seung Jae Baik of Suwon-si KR for samsung electronics co., ltd., Gun-Wook Yoon of Suwon-si KR for samsung electronics co., ltd., Jaeduk Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/41, H10B43/10, H10B43/35, H10B43/40, H10B80/00
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes a gate stack with alternating conductive patterns and insulating patterns. the device also includes a first memory channel structure including a first channel layer enclosed by the gate stack and a first memory layer enclosing the first channel layer. the device also includes a source structure electrically connected to the first channel layer. the source structure includes several source layers stacked atop one another. the first channel layer is in physical contact with the second source layer but apart from the other source layers. the first source layer contains impurities of a first conductivity type. the second source layer is formed of an impurity-free material. the third source layer contains impurities of a second conductivity type different from the first conductivity type.
Inventor(s): Younghwan Son of Hwaseong-si KR for samsung electronics co., ltd., Jeehoon Han of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B41/20, H10B43/20, H10B43/30, H10B51/20, H10D30/69, H10D64/23, H10K19/00
CPC Code(s): H10B43/27
Abstract: three-dimensional (3d) semiconductor memory devices are provided. a 3d semiconductor memory device includes an electrode structure on a substrate. the electrode structure includes gate electrodes stacked on the substrate. the gate electrodes include electrode pad regions. the 3d semiconductor memory device includes a dummy vertical structure penetrating one of the electrode pad regions. the dummy vertical structure includes a dummy vertical semiconductor pattern and a contact pattern extending from a portion of the dummy vertical semiconductor pattern toward the substrate.
Inventor(s): Suseong Noh of Suwon-si KR for samsung electronics co., ltd., Ilho Myeong of Suwon-si KR for samsung electronics co., ltd., Kwang-Soo Kim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B51/20, H10B51/30
CPC Code(s): H10B51/20
Abstract: a semiconductor device includes: a substrate, a gate stacking structure that includes a plurality of interlayer insulating layers and a plurality of gate electrodes that are alternately stacked on the substrate, a channel layer that extends in a first direction and into the gate stacking structure, where the channel layer is electrically connected to the substrate, a channel insulating layer that at least partially surrounds the channel layer, and a plurality of dielectric layers that are between the channel insulating layer and the plurality of gate electrodes, extend along a circumference of the channel layer, and are spaced apart from each other in the first direction, where each of the plurality of dielectric layers includes: a ferroelectric pattern that at least partially surrounds the channel insulating layer, and an anti-ferroelectric pattern that at least partially surrounds the ferroelectric pattern.
20250133746. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minho SONG of Suwon-si KR for samsung electronics co., ltd., Sunmin MOON of Suwon-si KR for samsung electronics co., ltd., Jaewan CHANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B53/30
CPC Code(s): H10B53/30
Abstract: a semiconductor device includes a capacitor structure including a bottom electrode, a first dielectric layer on the bottom electrode, a second dielectric layer on the first dielectric layer, a third dielectric layer on the second dielectric layer, and a top electrode on the third dielectric layer, where each of the first dielectric layer and the third dielectric layer includes zirconium oxide, the second dielectric layer includes hafnium-zirconium oxide, and each of the first dielectric layer, the second dielectric layer, and the third dielectric layer includes a first crystal phase and a second crystal phase.
20250133787. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ju Hun PARK of Seoul KR for samsung electronics co., ltd., Won Cheol JEONG of Seongnam-si KR for samsung electronics co., ltd., Jin Wook KIM of Hwaseong-si KR for samsung electronics co., ltd., Deok Han BAE of Suwon-si KR for samsung electronics co., ltd., Myung Yoon UM of Seoul KR for samsung electronics co., ltd., In Yeal LEE of Seongnam-si KR for samsung electronics co., ltd., Yoon Young JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10D62/10, H10D64/01
CPC Code(s): H10D62/118
Abstract: a semiconductor device includes an active pattern extending in a first direction on a substrate, a gate structure on the active pattern and having a gate electrode extending in a second direction intersecting the active pattern, and a gate capping pattern on the gate electrode, the gate capping pattern including a gate capping liner defining a gate capping recess, the gate capping liner having a horizontal portion along an upper surface of the gate electrode, and a vertical portion extending from the horizontal portion in a third direction intersecting the first and second directions, and a gate capping filling film on the gate capping liner and filling the gate capping recess, an epitaxial pattern on the active pattern and adjacent the gate structure, a gate contact on and connected to the gate electrode, and an active contact on and connected to the epitaxial pattern.
20250133791. INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chaeho Na of Suwon-si KR for samsung electronics co., ltd., Sangkoo Kang of Suwon-si KR for samsung electronics co., ltd., Sunki Min of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L27/092, H01L29/06, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H10D62/151
Abstract: an integrated circuit device includes a first fin-type active region and a second fin-type active region, each extending on a substrate in a first horizontal direction, a plurality of gate lines on the first fin-type active region and second fin-type active region, the plurality of gate lines extending in a second horizontal direction that crosses the first horizontal direction, a first source/drain region and a second source/drain region respectively in the first fin-type active region and second fin-type active region, wherein each of the first source/drain region and the second source/drain region is disposed between the plurality of gate lines, a spacer structure disposed on the plurality of gate lines, the first source/drain region and the second source/drain region, and a protective insulating film disposed on the second source/drain region and exposing the first source/drain region.
Inventor(s): Jongryeol YOO of Suwon-si KR for samsung electronics co., ltd., Jaejun KIM of Suwon-si KR for samsung electronics co., ltd., Ingyu JANG of Suwon-si KR for samsung electronics co., ltd., Gwangjun KIM of Suwon-si KR for samsung electronics co., ltd., Sunghwan KIM of Suwon-si KR for samsung electronics co., ltd., Jiwon JEONG of Suwon-si KR for samsung electronics co., ltd., Jeongsang PYO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/36, H01L29/167
CPC Code(s): H10D62/60
Abstract: a semiconductor device includes a substrate; an active pattern extending on the substrate in a first direction; a plurality of channel layers on the active pattern and spaced apart from each other in a vertical direction; a gate structure crossing the active pattern, the gate structure surrounding the plurality of channel layers and extending in a second direction orthogonal to the first direction; and source/drain patterns on a region of the active pattern on both sides of the gate structure, and having a semiconductor liner layer connected to each of side surfaces of the plurality of channel layers, and a semiconductor filling layer on the semiconductor liner layer. the semiconductor liner layer includes silicon-germanium (sige) doped with a first conductivity-type impurity. the semiconductor filling layer includes an epitaxial layer having a germanium (ge) concentration higher than that of the semiconductor liner layer, and the epitaxial layer is doped with ga.
Inventor(s): MYUNG YANG of Niskayuna NY US for samsung electronics co., ltd., SEUNG MIN SONG of Clifton Park NY US for samsung electronics co., ltd., KANG-ILL SEO of Springfield VA US for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L27/092, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H10D64/021
Abstract: transistor devices are provided. a transistor device includes a substrate and a transistor stack including first and second transistors on the substrate. the first transistor or the second transistor includes a plurality of semiconductor channel layers, a gate on the plurality of semiconductor channel layers, and an insulating spacer that is on a sidewall of the gate and between the plurality of semiconductor channel layers. moreover, the insulating spacer includes: a first portion on a sidewall of the gate; and a second portion that is spaced apart from the sidewall of the gate by the first portion, and that has a lower dielectric constant than the first portion. related methods of forming transistor devices are also provided.
Inventor(s): Jaehoon Shin of Suwon-si KR for samsung electronics co., ltd., Bongseok Suh of Seoul KR for samsung electronics co., ltd., Daewon Kim of Hwaseong-si KR for samsung electronics co., ltd., Sukhyung Park of Seoul KR for samsung electronics co., ltd., Junggun You of Ansan-si KR for samsung electronics co., ltd., Jaeyun Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10D84/85, H01L21/02, H01L21/28, H10D30/01, H10D30/67, H10D62/10, H10D64/01, H10D64/23, H10D64/27, H10D64/66, H10D84/01, H10D84/03
CPC Code(s): H10D84/85
Abstract: a semiconductor device may include a substrate including first and second active regions and a field region therebetween, first and second active patterns respectively provided on the first and second active regions, first and second source/drain patterns respectively provided on the first and second active patterns, a first channel pattern between the first source/drain patterns and a second channel pattern between the second source/drain patterns, and a gate electrode extended from the first channel pattern to the second channel pattern to cross the field region. each of the first and second channel patterns may include semiconductor patterns, which are stacked to be spaced apart from each other. a width of a lower portion of the gate electrode on the field region may decrease with decreasing distance from a top surface of the substrate.
Inventor(s): Juntaek Lee of Suwon-si, Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H10F39/182
Abstract: an image sensor includes a plurality of pixels, wherein each of the plurality of pixels includes a first epitaxial layer disposed on a first surface of a semiconductor substrate and formed to have a first conductive type by an epitaxial growth process, a photoelectric conversion device disposed on the first epitaxial layer, the photoelectric conversion device having a second conductive type which differs from the first conductive type and a second epitaxial layer disposed between the photoelectric conversion device and a second surface of the semiconductor substrate and formed to have the second conductive type through the epitaxial growth process, wherein the photoelectric conversion device is an epitaxial layer of the second conductive type formed by the epitaxial growth process.
Inventor(s): MASATO FUJITA of Suwon-si KR for samsung electronics co., ltd., Seungki Jung of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H10F39/802
Abstract: an image sensor is provided. the image sensor includes: a substrate that includes a plurality of pixels, each of which includes a left sub-pixel and a right sub-pixel; a well region in the substrate on each of the plurality of pixels, the well region connecting the left sub-pixel and the right sub-pixel to each other; a pixel separation part that separates the plurality of pixels from each other and extends in the substrate between the left sub-pixel and the right sub-pixel; a left transfer transistor and a first logic transistor on the left sub-pixel; a right transfer transistor and a second logic transistor on the right sub-pixel; and a ground region in the substrate on one of the left sub-pixel and the right sub-pixel, and in contact with the well region. the ground region is adjacent to a corner of each of the plurality of pixels.
Inventor(s): Jung Wook LIM of Suwon-si KR for samsung electronics co., ltd., Sung Hyuck CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H10F39/8027
Abstract: an image sensor includes a pixel array including a plurality of unit pixels and a driving circuitry provided around the pixel array and driving the plurality of unit pixels. each of the plurality of unit pixels includes a first region ad a second region. the first region includes a first photodiode, a first transfer transistor connected to the first photodiode, a first floating diffusion node connected to the first transfer transistor, and a (1-1)-th contact connected to a second floating diffusion node, and the second region includes a second photodiode, a second transfer transistor connected to the second photodiode, a (1-2)-th contact electrically connected to the (1-1)-th contact through connection metal wiring, and a second contact provided to a third floating diffusion node connected to the second transfer transistor.
20250133850. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sanguk KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H10F39/8053
Abstract: a semiconductor package includes a package substrate, an image sensor including a body portion on the package substrate, color filters on the body portion, microlenses respectively on the color filters, a light blocking filter pattern peripheral to the microlenses in a horizontal direction, a capping layer covering at least a portion of the light blocking filter pattern, an upper thin film covering at least a portion of the capping layer, and connection pads peripheral to the light blocking filter pattern in the horizontal direction, a glass cover on the image sensor, and an adhesive structure on the body portion spaced apart from the capping layer and the light blocking filter pattern in the horizontal direction, the adhesive structure covering at least a portion of the connection pads, between the image sensor and the glass cover.
20250133853. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongwoo HONG of Suwon-si KR for samsung electronics co., ltd., Seokjin KWON of Suwon-si KR for samsung electronics co., ltd., Beomsuk LEE of Suwon-si KR for samsung electronics co., ltd., In Sung JOE of Suwon-si KR for samsung electronics co., ltd., Inyong PARK of Suwon-si KR for samsung electronics co., ltd., Yangjae YUN of Suwon-si KR for samsung electronics co., ltd., Sungeun LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146, G02B3/02
CPC Code(s): H10F39/8063
Abstract: disclosed is an image sensor which includes a pixel array including a plurality of unit pixels having photoelectric conversion elements arranged in a matrix form on a semiconductor substrate in a first direction and a second direction crossing the first direction, color filters corresponding to the unit pixels and having at least two different colors, and meta-microlenses on the color filters and configured to condense light incident to the unit pixels.
Inventor(s): Sungjun KOH of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L33/50, H01L33/00
CPC Code(s): H10H20/8515
Abstract: provided is a display module and a method of manufacturing same. the method includes: forming a color layer on a base substrate; and adhering a light source substrate to the color layer, wherein an inorganic light-emitting device is positioned on the light source substrate, and the inorganic light-emitting device faces the color layer, and wherein the forming the color layer includes: positioning a color filter on the base substrate; positioning a low refractive layer on the color filter; imprinting the low refractive layer; and positioning a color conversion material on the imprinted low refractive layer.
Inventor(s): Joonyong PARK of Suwon-si KR for samsung electronics co., ltd., Dongho KIM of Seoul KR for samsung electronics co., ltd., Hyunjoon KIM of Seoul KR for samsung electronics co., ltd., Seogwoo HONG of Yongin-si KR for samsung electronics co., ltd., Kyungwook HWANG of Seoul KR for samsung electronics co., ltd., Junsik HWANG of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): H10H29/14, B82Y20/00, H10H20/01, H10H20/851, H10H20/855
CPC Code(s): H10H29/142
Abstract: a display apparatus includes a driving substrate including a plurality of grooves, micro light-emitting devices provided in the plurality of grooves and configured to emit light of a first color, and a color conversion layer provided on the micro light-emitting devices and configured to convert the light of the first color into light of at least one second color, wherein the color conversion layer includes light blocking patterns spaced apart from the micro light-emitting devices and spaced apart from each other on a same plane, a nano-porous layer provided between adjacent ones of the light blocking patterns, spaced apart from the micro light-emitting devices, and including a plurality of nano-pores, and quantum dots impregnated in the nano-porous layer and configured to convert the light of the first color into the light of the at least one second color.
Inventor(s): Hyochul KIM of Suwon-si KR for samsung electronics co., ltd., Younggeun Roh of Suwon-si KR for samsung electronics co., ltd., Kyungbae Park of Suwon-si KR for samsung electronics co., ltd., Younhee Lim of Suwon-si KR for samsung electronics co., ltd., Sungyoung Yun of Suwon-si KR for samsung electronics co., ltd., Sungmo Ahn of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10K39/32
CPC Code(s): H10K39/32
Abstract: am image sensor including a semiconductor substrate into which a plurality of photosensitive devices are integrated; a band filter array including a plurality of band filters, wherein each band filter of the plurality of band filters is configured to resonate light included in a specific wavelength band from among incident light, and to output the resonated light toward the semiconductor substrate; an active layer between the semiconductor substrate and the band filter array, and configured to generate excitons using the resonated light received from the band filter array; and an intermediate layer between the active layer and the semiconductor substrate, and configured to transmit at least one of the resonated light or the excitons to the semiconductor substrate
Inventor(s): Minwoo CHOI of Suwon-si KR for samsung electronics co., ltd., Hajun SUNG of Suwon-si KR for samsung electronics co., ltd., Bonwon KOO of Suwon-si KR for samsung electronics co., ltd., Kiyeon YANG of Suwon-si KR for samsung electronics co., ltd., Changseung LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10N70/00, G11C13/00, H10B63/00
CPC Code(s): H10N70/882
Abstract: provided are a chalcogenide-based memory device capable of implementing multi-level memory and an electronic apparatus including the chalcogenide-based memory device. the memory device includes a first electrode and a second electrode arranged to be spaced apart from each other, and a memory layer provided between the first electrode and the second electrode and including a plurality of memory material layers having different threshold voltages from each other. each of the plurality of memory material layers includes a chalcogenide-based material, has an ovonic threshold switching (ots) characteristic, and is configured to have a threshold voltage varying depending on a polarity and intensity of an applied voltage.
Samsung Electronics Co., Ltd. patent applications on April 24th, 2025
- Samsung Electronics Co., Ltd.
- A47L11/40
- F04B43/12
- CPC A47L11/4088
- Samsung electronics co., ltd.
- A47L9/00
- B08B13/00
- CPC A47L11/4091
- A47L15/42
- A47L15/50
- CPC A47L15/4263
- A61B5/0205
- A61B5/00
- A61B5/024
- A61B5/026
- A61B5/11
- CPC A61B5/02055
- B01F25/314
- B01F23/10
- B01F25/31
- B01F101/58
- CPC B01F25/31434
- B60W40/114
- B60W10/20
- B60W50/00
- B60W50/02
- B60W50/14
- CPC B60W40/114
- C08G61/12
- H10K10/46
- CPC C08G61/126
- C09G1/02
- H01L21/321
- CPC C09G1/02
- C09K13/06
- H01L21/3213
- CPC C09K13/06
- C12P1/04
- B01D53/56
- C12N1/20
- C12N9/06
- C12N15/70
- CPC C12P1/04
- D06F33/48
- D06F34/16
- D06F103/26
- D06F105/60
- CPC D06F33/48
- G01J5/20
- H10N15/10
- CPC G01J5/20
- G01R31/26
- H01L21/66
- CPC G01R31/2601
- G01S13/56
- H04W84/12
- CPC G01S13/56
- G02B13/00
- G02B9/34
- CPC G02B13/004
- G04G17/06
- G04G17/04
- G06F1/16
- H05K1/02
- CPC G04G17/06
- G06F3/01
- G16Y40/10
- G16Y40/30
- CPC G06F3/011
- G06F3/0482
- G06F3/04842
- CPC G06F3/013
- G06T7/73
- H04N23/71
- G06F3/041
- G06F3/044
- G09G3/20
- CPC G06F3/04184
- G06F3/0481
- CPC G06F3/0481
- G06F3/04817
- G06F3/0488
- H04M1/02
- H04M1/72448
- H04M1/72469
- CPC G06F3/04817
- G06F3/04845
- G06T15/50
- CPC G06F3/04845
- G06F9/30
- CPC G06F9/3001
- G06F11/10
- CPC G06F11/1044
- G06F11/30
- G06F3/06
- G06F11/07
- CPC G06F11/3034
- G06F12/0862
- CPC G06F12/0862
- G06F21/62
- CPC G06F21/6254
- G06F40/40
- G06F16/9535
- G06F40/30
- CPC G06F40/40
- G06K19/07
- G06K19/077
- G06V40/13
- CPC G06K19/0718
- G06N3/045
- G06F12/02
- CPC G06N3/045
- G06N3/0895
- CPC G06N3/0895
- G06T5/50
- G06T7/13
- G06T7/30
- G06T7/90
- G06V10/56
- G06V10/60
- H04N23/11
- CPC G06T5/50
- G06T3/4015
- G06T3/4053
- G06T7/11
- G06V10/44
- H04N1/60
- G06T5/60
- G06T5/70
- G06T7/00
- G06V10/82
- G06V20/40
- CPC G06T5/60
- G06T7/12
- G06T7/50
- G06V10/74
- CPC G06T7/12
- G06T11/00
- G06V10/764
- G06V20/20
- G06V20/50
- CPC G06T11/00
- G06T11/60
- G06T11/20
- CPC G06T11/60
- G06T19/00
- CPC G06T19/00
- G06V10/94
- G06V10/774
- G06V20/58
- G06V20/70
- CPC G06V10/95
- G06V10/77
- CPC G06V20/58
- G06V40/12
- G06V10/26
- CPC G06V40/1347
- G06V40/20
- G06T7/20
- G06V10/25
- G06V10/40
- CPC G06V40/20
- G09G3/3225
- CPC G09G3/3225
- H01J37/32
- H01J37/08
- CPC H01J37/32422
- H01L21/67
- H01L21/683
- CPC H01J37/3244
- C25B1/04
- C25B15/08
- CPC H01J37/32844
- CPC H01L21/67046
- CPC H01L21/6833
- H01L21/768
- H01L21/3105
- CPC H01L21/76831
- CPC H01L21/76879
- H01L21/311
- CPC H01L21/76885
- H01L23/367
- H01L23/00
- H01L23/31
- H01L23/373
- H01L25/00
- H01L25/18
- CPC H01L23/367
- H01L23/473
- H10B80/00
- CPC H01L23/473
- H01L23/48
- H01L23/522
- CPC H01L23/481
- H01L23/528
- H01L23/498
- H01L21/48
- H01L23/538
- H01L23/544
- CPC H01L23/49827
- CPC H01L23/49894
- H01L23/532
- CPC H01L23/5228
- H10B12/00
- CPC H01L23/5283
- H01L27/092
- CPC H01L23/5286
- H01L23/535
- H01L29/06
- H01L29/417
- H01L29/423
- H01L29/775
- CPC H01L23/535
- H01L23/13
- H01L25/065
- CPC H01L23/5386
- H01L23/64
- H01L25/16
- H05K1/11
- H05K1/18
- CPC H01L23/642
- CPC H01L24/05
- H01L25/10
- CPC H01L24/14
- H01L21/56
- CPC H01L24/29
- H01Q9/44
- H01Q1/38
- CPC H01Q9/44
- H02J7/00
- H01M50/519
- CPC H02J7/00714
- CPC H02J7/007182
- H02K1/28
- F25B31/02
- H02K1/2791
- CPC H02K1/28
- H03F1/02
- H03F1/56
- H03F3/24
- H03F3/45
- H03F3/60
- CPC H03F1/0288
- H03L7/099
- H03B5/12
- CPC H03L7/099
- H04B1/00
- H03F3/19
- CPC H04B1/005
- H04B7/0417
- H04B7/0456
- H04B7/06
- CPC H04B7/0417
- H04W24/10
- CPC H04B7/0456
- H04B17/373
- H04L5/00
- CPC H04B17/373
- H04L1/1867
- H04L1/1812
- H04L41/16
- CPC H04L1/1887
- H04L7/00
- H04L7/033
- CPC H04L7/0054
- H04L9/32
- G06N3/098
- H04L9/14
- CPC H04L9/3263
- H04L25/02
- H04L25/03
- CPC H04L25/0258
- H04L25/06
- H03M1/12
- CPC H04L25/061
- H04L67/148
- H04L67/10
- H04L67/51
- H04L67/62
- CPC H04L67/148
- H05K5/02
- CPC H04M1/0268
- H04N5/74
- G03B21/14
- G06F3/14
- G06T7/10
- G09G5/02
- G09G5/10
- CPC H04N5/74
- H04N21/422
- H04N21/431
- CPC H04N21/42226
- H04N23/63
- H04N23/611
- CPC H04N23/632
- H04N23/60
- CPC H04N23/64
- H04N23/80
- H04N23/13
- CPC H04N23/80
- H04N23/84
- CPC H04N23/843
- H04N25/773
- G06T7/80
- CPC H04N25/773
- H04R1/04
- G10L15/26
- G10L15/28
- H01L25/075
- H04R1/02
- H10H20/856
- H10H20/857
- CPC H04R1/04
- H04W8/18
- G06K19/06
- H04L67/55
- CPC H04W8/18
- H04W12/06
- H04W4/50
- H04W8/20
- H04W12/04
- H04W12/08
- H04W12/30
- CPC H04W12/06
- H04W16/22
- G06N3/092
- G06N20/00
- H04B17/11
- H04B17/21
- H04B17/391
- H04L41/14
- H04W24/02
- H04W24/08
- H04W28/08
- H04W52/02
- H04W84/02
- H04W88/08
- H04W88/12
- H04W92/02
- H04W92/12
- CPC H04W16/22
- H04W28/02
- H04L12/14
- H04L41/0813
- H04L67/14
- CPC H04W28/0236
- H04W36/00
- CPC H04W36/00838
- H04W36/36
- H04W76/20
- CPC H04W36/362
- H04W48/16
- H04W48/04
- CPC H04W48/16
- H04W76/28
- CPC H04W52/0229
- H04W36/30
- H04W36/32
- CPC H04W52/0232
- H04W56/00
- CPC H04W56/0045
- H04W72/0446
- CPC H04W72/0446
- H04W72/1268
- CPC H04W72/1268
- H04W72/232
- CPC H04W72/232
- H04W72/30
- H04L12/18
- H04W4/06
- H04W76/10
- H04W76/40
- CPC H04W72/30
- G02B7/182
- CPC H05K5/0234
- CPC H10B12/315
- H01L29/45
- CPC H10B12/482
- CPC H10B12/485
- CPC H10B12/50
- H10B43/27
- H10B41/10
- H10B41/27
- H10B41/35
- H10B41/41
- H10B43/10
- H10B43/35
- H10B43/40
- CPC H10B43/27
- H10B41/20
- H10B43/20
- H10B43/30
- H10B51/20
- H10D30/69
- H10D64/23
- H10K19/00
- H10B51/30
- CPC H10B51/20
- H10B53/30
- CPC H10B53/30
- H10D62/10
- H10D64/01
- CPC H10D62/118
- H01L29/08
- H01L29/786
- CPC H10D62/151
- H01L29/36
- H01L29/167
- CPC H10D62/60
- H01L29/66
- CPC H10D64/021
- H10D84/85
- H01L21/02
- H01L21/28
- H10D30/01
- H10D30/67
- H10D64/27
- H10D64/66
- H10D84/01
- H10D84/03
- CPC H10D84/85
- H01L27/146
- CPC H10F39/182
- CPC H10F39/802
- CPC H10F39/8027
- CPC H10F39/8053
- G02B3/02
- CPC H10F39/8063
- H01L33/50
- H01L33/00
- CPC H10H20/8515
- H10H29/14
- B82Y20/00
- H10H20/01
- H10H20/851
- H10H20/855
- CPC H10H29/142
- H10K39/32
- CPC H10K39/32
- H10N70/00
- G11C13/00
- H10B63/00
- CPC H10N70/882