18347634. METHOD OF PREVENTING PATTERN COLLAPSE (Tokyo Electron Limited)
METHOD OF PREVENTING PATTERN COLLAPSE
Organization Name
Inventor(s)
Eric Chih-Fang Liu of Niskayuna NY (US)
METHOD OF PREVENTING PATTERN COLLAPSE
This abstract first appeared for US patent application 18347634 titled 'METHOD OF PREVENTING PATTERN COLLAPSE
Original Abstract Submitted
A method of microfabrication includes forming a sacrificial layer over a film. A resist layer is formed over the sacrificial layer. The resist layer includes an extreme ultraviolet (EUV) resist. A pattern is formed in the resist layer by an EUV exposure and a wet etch followed by rinsing and drying, resulting in uncovered portions of the sacrificial layer. The uncovered portions of the sacrificial layer are treated. The pattern is transferred from the resist layer to the film by performing an etch process.