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18999881. SLURRY, SCREENING METHOD, AND POLISHING METHOD (RESONAC CORPORATION)

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SLURRY, SCREENING METHOD, AND POLISHING METHOD

Organization Name

RESONAC CORPORATION

Inventor(s)

Satoyuki Nomura of Tokyo JP

Tomohiro Iwano of Tokyo JP

Takaaki Matsumoto of Tokyo JP

Tomoyasu Hasegawa of Tokyo JP

Tomomi Kukita of Tokyo JP

SLURRY, SCREENING METHOD, AND POLISHING METHOD

This abstract first appeared for US patent application 18999881 titled 'SLURRY, SCREENING METHOD, AND POLISHING METHOD

Original Abstract Submitted

A slurry containing abrasive grains and a liquid medium, in which the abrasive grains contain at least one metal compound selected from the group consisting of a metal oxide and a metal hydroxide, the metal compound contains a metal capable of taking a plurality of valences, and when the slurry is brought into contact with a surface to be polished to bring the abrasive grains into contact with the surface to be polished, the slurry yields 0.13 or more in X-ray photoelectron spectroscopy as a ratio of the lowest valence among the plurality of valences of the metal.

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