Micron technology, inc. (20250133786). ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY
ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY
Organization Name
Inventor(s)
Kunal R. Parekh of Boise ID US
ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY
This abstract first appeared for US patent application 20250133786 titled 'ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY
Original Abstract Submitted
a method for modifying a geometry of a wafer comprises measuring a local geometry for each of a plurality edge locations of the wafer, determining, based on the measured local geometry, an amount of additional material for each of the plurality of locations of the wafer calculated to provide a desired wafer-level geometry for the wafer, and dispensing, from a printing nozzle, the determined amount of additional material at each of the plurality of locations of the wafer to provide the wafer with the desired wafer-level geometry.