Category:Hong Li of Boise ID US
Hong Li
Hong Li from Boise ID US has applied for patents in technology areas such as H10D30/63, H01L21/02, H01L21/308 with micron technology, inc..
Patents
Pages in category "Hong Li of Boise ID US"
The following 4 pages are in this category, out of 4 total.
1
- 19011229. Assemblies Having Conductive Structures Along Pillars of Semiconductor Material, and Methods of Forming Integrated Circuitry (Micron Technology, Inc.)
- 19013180. Methods of Forming Integrated Assemblies Having Conductive Material Along Sidewall Surfaces of Semiconductor Pillars (Micron Technology, Inc.)
M
- Micron technology, inc. (20250142875). Assemblies Having Conductive Structures Along Pillars of Semiconductor Material, and Methods of Forming Integrated Circuitry
- Micron technology, inc. (20250151264). Methods of Forming Integrated Assemblies Having Conductive Material Along Sidewall Surfaces of Semiconductor Pillars