Samsung electronics co., ltd. (20240429039). METHOD OF DEPOSITING FILM
METHOD OF DEPOSITING FILM
Organization Name
Inventor(s)
Byungkeun Hwang of Suwon-si (KR)
Younghun Sung of Suwon-si (KR)
Younjoung Cho of Suwon-si (KR)
METHOD OF DEPOSITING FILM
This abstract first appeared for US patent application 20240429039 titled 'METHOD OF DEPOSITING FILM
Original Abstract Submitted
methods of depositing a film are provided. the methods may include providing a substrate that includes a first surface and a second surface adjacent to the first surface; forming a polymer sacrificial layer on the first surface by using a molecular layer deposition (mld) process; forming a first film on the second surface; and removing the polymer sacrificial layer formed on the first surface. a functional group density of the first surface may be higher than a functional group density of the second surface, and the polymer sacrificial layer may include a thermally decomposable polymer.
- Samsung electronics co., ltd.
- Eun Hyea Ko of Suwon-si (KR)
- Soyoung Lee of Suwon-si (KR)
- Hoon Han of Suwon-si (KR)
- Byungkeun Hwang of Suwon-si (KR)
- Jaewoon Kim of Suwon-si (KR)
- Younghun Sung of Suwon-si (KR)
- Younjoung Cho of Suwon-si (KR)
- H01L21/02
- C09D5/00
- C09D5/26
- C09D175/02
- C23C16/56
- H01L21/285
- H01L21/3105
- CPC H01L21/02118