Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
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This category has only the following subcategory.
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Pages in category "H01L23/00"
The following 101 pages are in this category, out of 2,965 total.
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- US Patent Application 17804658. BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE simplified abstract
- US Patent Application 17819341. Semiconductor Package Including Step Seal Ring and Methods Forming Same simplified abstract
- US Patent Application 17819678. INTERCONNECT STRUCTURE PATTERN simplified abstract
- US Patent Application 17824330. SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE DEVICE HAVING OPPOSED SOLDER BUMPS simplified abstract
- US Patent Application 17824353. SEMICONDUCTOR PACKAGE CROSSTALK REDUCTION simplified abstract
- US Patent Application 17825336. VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS simplified abstract
- US Patent Application 17825340. INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING INTEGRATED CIRCUIT DEVICES THEREIN simplified abstract
- US Patent Application 17825345. INTERCONNECT STRUCTURE INCLUDING CHARGED DIELECTRIC LAYERS simplified abstract
- US Patent Application 17825350. INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING RETICLE BOUNDARY / DICING STREETS OF MONOLITHIC STRUCTURES THEREIN simplified abstract
- US Patent Application 17826764. LASER ABLATION FOR DIE SEPARATION TO REDUCE LASER SPLASH AND ELECTRONIC DEVICE simplified abstract
- US Patent Application 17828691. Package and Method for Forming the Same simplified abstract
- US Patent Application 17828803. POWER CONVERTER MODULE simplified abstract
- US Patent Application 17828947. DIE ATTACH FILM DIE PAD ISOLATION FOR SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 17881128. SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF simplified abstract
- US Patent Application 17896840. Integrated Circuit Packages and Methods of Forming the Same simplified abstract
- US Patent Application 17898834. INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 17978645. SEMICONDUCTOR WAFER INCLUDING CHIP GUARD simplified abstract
- US Patent Application 17983469. NON-VOLATILE MEMORY DEVICE simplified abstract
- US Patent Application 18057305. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
- US Patent Application 18067060. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- US Patent Application 18069318. SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18096531. DISPLAY DEVICE simplified abstract
- US Patent Application 18098972. SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18103704. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- US Patent Application 18118697. SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18120866. SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18125649. Sensor Module Having an Intermediate Pedestal on Which One or More Die Are Mounted simplified abstract
- US Patent Application 18140985. SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18143983. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- US Patent Application 18153686. Trench Isolation Connectors for Stacked Structures simplified abstract
- US Patent Application 18169839. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- US Patent Application 18181293. REDISTRIBUTION LAYER METALLIC STRUCTURE AND METHOD simplified abstract
- US Patent Application 18196436. SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18200814. DISPLAY APPARATUS simplified abstract
- US Patent Application 18205312. DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES simplified abstract
- US Patent Application 18208034. DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME simplified abstract
- US Patent Application 18227162. DISPLAY MODULE, DISPLAY APPARATUS AND METHOD FOR MANUFACTURING SAME simplified abstract
- US Patent Application 18230546. SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME simplified abstract
- US Patent Application 18230829. Method of Forming Semiconductor Packages Having Through Package Vias simplified abstract
- US Patent Application 18230999. SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME simplified abstract
- US Patent Application 18231254. METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE WITH BONDING STRUCTURE simplified abstract
- US Patent Application 18232520. SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE simplified abstract
- US Patent Application 18232523. SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH simplified abstract
- US Patent Application 18232713. Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via simplified abstract
- US Patent Application 18232978. SEMICONDUCTOR MODULE simplified abstract
- US Patent Application 18233697. THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A METAL OXIDE ETCH STOP LAYER AND METHODS FOR FORMING THE SAME simplified abstract
- US Patent Application 18303693. SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18303929. DISPLAY WITH EMBEDDED PIXEL DRIVER CHIPS simplified abstract
- US Patent Application 18316962. Embedded Packaging Concepts for Integration of ASICs and Optical Components simplified abstract
- US Patent Application 18320668. LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME simplified abstract
- US Patent Application 18324897. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18338107. Multi-Level Stacking of Wafers and Chips simplified abstract
- US Patent Application 18346319. Integrated Circuit Package and Method Forming Same simplified abstract
- US Patent Application 18347188. Optical Transceiver and Manufacturing Method Thereof simplified abstract
- US Patent Application 18358491. SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE simplified abstract
- US Patent Application 18358714. CHIP PACKAGE STRUCTURE simplified abstract
- US Patent Application 18358904. METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR simplified abstract
- US Patent Application 18358959. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract
- US Patent Application 18359578. Stacked Semiconductor Device and Method simplified abstract
- US Patent Application 18360484. HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS simplified abstract
- US Patent Application 18360656. PACKAGE WITH FAN-OUT STRUCTURES simplified abstract
- US Patent Application 18361300. PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT simplified abstract
- US Patent Application 18361332. Package Structure and Method and Equipment for Forming the Same simplified abstract
- US Patent Application 18361480. CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR simplified abstract
- US Patent Application 18361933. METALLIZATION STRUCTURE simplified abstract
- US Patent Application 18361953. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18362083. Method of Fabricating Redistribution Circuit Structure simplified abstract
- US Patent Application 18362649. System Formed Through Package-In-Package Formation simplified abstract
- US Patent Application 18363458. Semiconductor Package and Methods of Forming the Same simplified abstract
- US Patent Application 18363692. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 18363698. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- US Patent Application 18363742. MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18363769. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18365009. CAPACITOR BETWEEN TWO PASSIVATION LAYERS WITH DIFFERENT ETCHING RATES simplified abstract
- US Patent Application 18365063. PACKAGE COMPRISING AN INTEGRATED DEVICE CONFIGURED FOR SHAREABLE POWER RESOURCE simplified abstract
- US Patent Application 18365362. INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract
- US Patent Application 18366282. Antenna Apparatus and Method simplified abstract
- US Patent Application 18446014. MULTI-TIM PACKAGES AND METHOD FORMING SAME simplified abstract
- US Patent Application 18446028. BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING THE SAME simplified abstract
- US Patent Application 18446076. STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE simplified abstract
- US Patent Application 18446146. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- US Patent Application 18446554. DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING simplified abstract
- US Patent Application 18446562. Polymer Layer in Semiconductor Device and Method of Manufacture simplified abstract
- US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract
- US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract
- US Patent Application 18446834. POLYIMIDE PROFILE CONTROL simplified abstract
- US Patent Application 18447409. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- US Patent Application 18447416. SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME simplified abstract
- US Patent Application 18447428. Semiconductor Package and Method of Forming Thereof simplified abstract
- US Patent Application 18447460. STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME simplified abstract
- US Patent Application 18447560. PACKAGED DEVICE WITH OPTICAL PATHWAY simplified abstract
- US Patent Application 18447769. DUAL-SIDED ROUTING IN 3D SIP STRUCTURE simplified abstract
- US Patent Application 18447832. SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18447968. Storage Layers For Wafer Bonding simplified abstract
- US Patent Application 18448284. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- US Patent Application 18448869. APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICATING DISPLAY DEVICE simplified abstract
- US Patent Application 18449360. SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE DESIGN METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
- US Patent Application 18450216. SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- US Patent Application 18450241. Non-Volatile Memory Device and Method of Operating the Same simplified abstract