US Patent Application 17898834. INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract

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INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE AND METHODS OF FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company Limited

Inventor(s)

Wensen Hung of Zhubei City (TW)

Tsung-Yu Chen of Hsinchu City (TW)

Hsuan-Ning Shih of Taoyuan City (TW)

Wen-Hsin Wei of Hsinchu City (TW)

INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17898834 titled 'INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE AND METHODS OF FORMING THE SAME

Simplified Explanation

The abstract describes a chip package structure that includes an interposer, semiconductor dies, a packaging substrate, and a lid structure.

  • The chip package structure consists of an assembly containing an interposer and semiconductor dies.
  • A packaging substrate is attached to the assembly using solder material portions.
  • A lid structure is attached to the packaging substrate.
  • The lid structure includes a first plate portion with a certain thickness located in an interposer-projection region that overlaps with the interposer.
  • The lid structure also includes a second plate portion with a smaller thickness surrounding and connected to the first plate portion, but located outside the interposer-projection region.
  • Additionally, the lid structure has multiple foot portions connected to the second plate portion, spaced apart from the first plate portion, and attached to the top surface segment of the packaging substrate using adhesive portions.


Original Abstract Submitted

A chip package structure includes an assembly containing an interposer and semiconductor dies; a packaging substrate attached to the assembly through solder material portions; and a lid structure attached to the packaging substrate. The lid structure includes: a first plate portion having a first thickness and located in an interposer-projection region having an areal overlap with the interposer in a plan view; a second plate portion having a second thickness that is less than the first thickness, laterally surrounding, and adjoined to, the first plate portion, and located outside the interposer-projection region; and a plurality of foot portions adjoined to the second plate portion, laterally spaced from the first plate portion, and attached to a respective top surface segment of the packaging substrate through a respective adhesive portion.

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