US Patent Application 17804658. BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE simplified abstract

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

Organization Name

QUALCOMM Incorporated==Inventor(s)==

[[Category:Yangyang Sun of San Diego CA (US)]]

[[Category:Amer Christophe Gaetan Cassier of La Jolla CA (US)]]

[[Category:Stanley Seungchul Song of San Diego CA (US)]]

[[Category:Lily Zhao of San Diego CA (US)]]

[[Category:Dongming He of San Diego CA (US)]]

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17804658 titled 'BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

Simplified Explanation

The patent application describes integrated circuit structures with small interconnects called micro-bumps.

• Micro-bumps are becoming smaller in size as their pitches decrease, making it difficult to verify their operations.
• To enable probing, larger test pads are provided, which are usually made of metal.
• The test pads may be protected with solder caps to ensure their functionality.

Original Abstract Submitted

Disclosed are integrated circuit structures with interconnects of small size, also referred to micro-bumps. As pitches of micro-bumps become smaller, their sizes also become small. This makes it difficult to probe the integrated circuit structure to verify their operations. To enable probing, test pads of larger pitches are provided. The test pads, usually formed of metal, may be protected with solder caps.