US Patent Application 18098972. SEMICONDUCTOR PACKAGE simplified abstract

SEMICONDUCTOR PACKAGE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.==Inventor(s)==

[[Category:SEONGHO Shin of Suwon-si (KR)]]

[[Category:Jonghyeon Kim of Suwon-si (KR)]]

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18098972 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The patent application describes a semiconductor package design.

• The package includes a solder ball, a printed circuit board, a bump, and a semiconductor chip.
• The printed circuit board has multiple layers, including a base substrate and a low-k dielectric layer that goes through the base substrate.
• There is a connection conductive structure on the printed circuit board that is electrically connected to the bump and surrounded by the low-k dielectric layer.
• A lower conductive structure is also present on the printed circuit board, which is electrically connected to the solder ball and the connection conductive structure.
• The lower conductive structure's top surface is in contact with the bottom surface of the low-k dielectric layer.
• The design aims to provide improved electrical connections and protection for the semiconductor chip.

Original Abstract Submitted

Disclosed is a semiconductor package comprising a solder ball, a printed circuit board on the solder ball, a bump on the printed circuit board, and a semiconductor chip on the bump. The printed circuit board includes a base substrate, a low-k dielectric layer that penetrates the base substrate, a connection conductive structure electrically connected to the bump and surrounded by the low-k dielectric layer, and a lower conductive structure electrically connected to the solder ball and the connection conductive structure. A top surface of the lower conductive structure is in contact with a first bottom surface of the low-k dielectric layer.