US Patent Application 18361332. Package Structure and Method and Equipment for Forming the Same simplified abstract

Package Structure and Method and Equipment for Forming the Same

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Wensen Hung of Zhubei City (TW)

Tsung-Yu Chen of Hsinchu (TW)

Tsung-Shu Lin of New Taipei City (TW)

Chen-Hsiang Lao of New Taipei City (TW)

Wen-Hsin Wei of Hsinchu (TW)

Hsien-Pin Hu of Zhubei City (TW)

Package Structure and Method and Equipment for Forming the Same - A simplified explanation of the abstract

This abstract first appeared for US patent application 18361332 titled 'Package Structure and Method and Equipment for Forming the Same

Simplified Explanation

The patent application describes an apparatus for manufacturing packaged semiconductor devices.

• The apparatus includes a lower plate with package platforms and clamp guide pins to align an upper plate with the lower plate.
• A boat tray is included in the apparatus, which has windows designed to receive package devices.
• Multiple upper plates are configured to align with the windows and package platforms.
• Fasteners are used to apply clamping force by generating a downward force on the upper plate.
• The clamping force is measured by load cells to allow for adjustments.
• The innovation aims to improve the manufacturing process of packaged semiconductor devices by providing a reliable and adjustable clamping mechanism.

Original Abstract Submitted

An apparatus for manufacturing packaged semiconductor devices includes a lower plate having package platforms and clamp guide pins to align an upper plate with the lower plate, and a boat tray having windows configured to receive package devices, and a plurality of upper plates configured to be aligned to respective windows and respective package platforms. Clamping force can be applied by fasteners configured to generate a downward force upon the upper plate. Package devices on the platforms are thus subjected to a clamping force. Load cells measure the clamping force so adjustments can be made.