US Patent Application 18446146. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
Contents
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chih-Hua Chen of Zhubei City (TW)
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18446146 titled 'PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Simplified Explanation
The abstract describes a method for forming package structures, specifically for placing a first package within a recess of a first substrate and attaching a first sensor to the first package and substrate.
- The method involves placing a first package containing a first die into a recess of a first substrate.
- A first sensor is then attached to both the first package and the first substrate.
- The first sensor is electrically connected to both the first package and the first substrate.
Original Abstract Submitted
Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
