US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract

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System and Method for Bonding Semiconductor Devices

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Kai-Tai Chang of Kaohsiung City (TW)

Tung Ying Lee of Hsinchu (TW)

System and Method for Bonding Semiconductor Devices - A simplified explanation of the abstract

This abstract first appeared for US patent application 18359416 titled 'System and Method for Bonding Semiconductor Devices

Simplified Explanation

The patent application describes a method for aligning and bonding two wafers in semiconductor manufacturing. Here are the key points:

  • The method involves aligning alignment marks on two sides of a first wafer and a second wafer.
  • The first offset between the alignment marks on the first wafer is determined.
  • The first alignment mark of the first wafer is aligned to a third alignment mark on the first side of the second wafer.
  • The location of the second alignment mark of the first wafer is detected to determine the location of the first alignment mark.
  • The first wafer is repositioned based on the determined location of the first alignment mark to align it with the third alignment mark.
  • Finally, the first side of the first wafer is bonded to the first side of the second wafer to create a bonded structure.


Original Abstract Submitted

A method includes determining a first offset between a first alignment mark on a first side of a first wafer and a second alignment mark on a second side of the first wafer; aligning the first alignment mark of the first wafer to a third alignment mark on a first side of a second wafer, which includes detecting a location of the second alignment mark of the first wafer; determining a location of the first alignment mark of the first wafer based on the first offset and the location of the second alignment mark of the first wafer; and, based on the determined location of the first alignment mark, repositioning the first wafer to align the first alignment mark to the third alignment mark; and bonding the first side of the first wafer to the first side of the second wafer to form a bonded structure.

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