US Patent Application 17881128. SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF simplified abstract

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SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Sung-Yueh Wu of Hsinchu (TW)

Jen-Chun Liao of Taipei (TW)

Mao-Yen Chang of Kaohsiung (TW)

Yu-Chia Lai of Zhunan Township (TW)

Chien Ling Hwang of Hsinchu (TW)

Ching-Hua Hsieh of Hsinchu (TW)

SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17881128 titled 'SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF

Simplified Explanation

The abstract describes a semiconductor package that includes an integrated circuit die, an encapsulant surrounding the die, and a fan-out structure that is electrically connected to the die. The fan-out structure has a first opening that extends through it and partially through the encapsulant. The encapsulant completely surrounds the first opening when viewed from the top. The package also includes a package substrate that is bonded to the first package component.

  • The semiconductor package includes an integrated circuit die.
  • The die is surrounded by an encapsulant.
  • The package has a fan-out structure that is electrically connected to the die.
  • The fan-out structure has a first opening that extends through it.
  • The first opening also partially extends through the encapsulant.
  • The encapsulant completely surrounds the first opening when viewed from the top.
  • The package substrate is bonded to the first package component.


Original Abstract Submitted

A semiconductor package includes a first package component comprising: an integrated circuit die; an encapsulant surrounding the integrated circuit die; and a fan-out structure electrically connected to the integrated circuit die, wherein a first opening extends completely through the fan-out structure and at least partially through the encapsulant in a cross-sectional view, and wherein the encapsulant at least completely surrounds the first opening in a top-down view. The semiconductor package further includes a package substrate bonded to the first package component.

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