US Patent Application 18447560. PACKAGED DEVICE WITH OPTICAL PATHWAY simplified abstract

PACKAGED DEVICE WITH OPTICAL PATHWAY

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Hsien-Wei Chen of Hsinchu (TW)

Ming-Fa Chen of Taichung City (TW)

PACKAGED DEVICE WITH OPTICAL PATHWAY - A simplified explanation of the abstract

This abstract first appeared for US patent application 18447560 titled 'PACKAGED DEVICE WITH OPTICAL PATHWAY

Simplified Explanation

The patent application describes a packaged device that includes an optical integrated circuit (IC) with an optical feature.

• The device also includes an interconnect structure with conductive features embedded in layers of dielectric materials that cover the optical feature.
• The interconnect structure is patterned to remove it from over the optical feature.
• A dielectric material with optically neutral properties is then formed over the optical feature.
• One or more electronic ICs can be bonded to the optical IC to create an integrated package.

Original Abstract Submitted

A packaged device includes an optical IC having an optical feature therein. An interconnect structure including layers of conductive features embedded within respective layers of dielectric materials overlie the optical feature. The interconnect structure is patterned to remove the interconnect structure from over the optical feature and a dielectric material having optically neutral properties, relative to a desired light wavelength(s) is formed over the optical feature. One or more electronic ICs may be bonded to the optical IC to form an integrated package.