US Patent Application 18447769. DUAL-SIDED ROUTING IN 3D SIP STRUCTURE simplified abstract
Contents
DUAL-SIDED ROUTING IN 3D SIP STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Po-Hao Tsai of Zhongli City (TW)
Meng-Liang Lin of Hsinchu (TW)
Techi Wong of Zhubei City (TW)
DUAL-SIDED ROUTING IN 3D SIP STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18447769 titled 'DUAL-SIDED ROUTING IN 3D SIP STRUCTURE
Simplified Explanation
A semiconductor package is created by connecting two components together.
- The first component is made by creating a redistribution structure on a substrate.
- A through via is made on the redistribution structure, and a die is attached to it.
- The second component has its own redistribution structure, which is connected to the through via.
- A molding compound is added between the two redistribution structures and around the sides of the second component.
Original Abstract Submitted
A semiconductor package is fabricated by attaching a first component to a second component. The first component is assembled by forming a first redistribution structure over a substrate. A through via is then formed over the first redistribution structure, and a die is attached to the first redistribution structure active-side down. The second component includes a second redistribution structure, which is then attached to the through via. A molding compound is deposited between the first redistribution structure and the second redistribution structure and further around the sides of the second component.
