US Patent Application 18303693. SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Yi-Lin Tsai of Hsinchu City (TW)
Wen-Sung Hsu of Hsinchu City (TW)
Nai-Wei Liu of Hsinchu City (TW)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18303693 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a semiconductor package that includes multiple semiconductor structures on an interposer over a substrate.
- The package includes interconnect traces, a redistribution structure, and three semiconductor structures.
- The first semiconductor structure consists of a semiconductor die and an encapsulant that surrounds it.
- The second semiconductor structure also consists of a semiconductor die and an encapsulant.
- The third semiconductor structure is located near a corner or edge of the substrate and includes a semiconductor die and an encapsulant.
- The third semiconductor structure is electrically insulated from the substrate and the other semiconductor structures.
Original Abstract Submitted
A semiconductor package includes an interposer over a substrate that includes interconnect traces, a redistribution structure on the interposer, a first semiconductor structure, a second semiconductor structure and a third semiconductor structure on the redistribution structure. The first semiconductor structure includes a first semiconductor die and a first encapsulant that encapsulates the first semiconductor die. The second semiconductor structure includes a second semiconductor die and a second encapsulant that encapsulates the second semiconductor die. The third semiconductor structure is disposed adjacent to a corner or an edge of the substrate in a top plan view of the substrate. The third semiconductor structure includes a third semiconductor die and a third encapsulant that encapsulates the third semiconductor die. The third semiconductor structure is electrically insulated from the substrate, the first semiconductor structure and the second semiconductor structure.