US Patent Application 17828803. POWER CONVERTER MODULE simplified abstract
Contents
POWER CONVERTER MODULE
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
WOOCHAN Kim of SAN JOSE CA (US)
Vivek Kishorechand Arora of San Jose CA (US)
Ninad Shahane of San Francisco CA (US)
Makoto Shibuya of Beppu City (JP)
POWER CONVERTER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17828803 titled 'POWER CONVERTER MODULE
Simplified Explanation
The patent application describes a power converter module that includes a substrate with two opposing surfaces.
- The module includes a thick printed copper (TPC) substrate on the first surface of the substrate.
- The TPC substrate consists of three layers: the first layer has TPC patterned on the first surface of the substrate, the second layer has dielectric patterned on the first layer, and the third layer has TPC patterned on the second layer.
- Power transistors are mounted on the TPC substrate, and a control integrated circuit (IC) chip is also mounted on the TPC substrate.
Original Abstract Submitted
A power converter module includes a substrate having a first surface and a second surface that opposes the first surface. The power converter module includes a thick printed copper (TPC) substrate on the first surface of the substrate. The TPC substrate includes a first layer having TPC patterned on the first surface of the substrate and a second layer with dielectric patterned on the first layer. The TPC substrate includes a third layer having TPC patterned on the second layer. The power converter module includes power transistors mounted on the TPC substrate and a control integrated circuit (IC) chip mounted on the TPC substrate.
