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Category:H01L23/552
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Pages in category "H01L23/552"
The following 200 pages are in this category, out of 210 total.
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- 17847434. PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17848059. INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE simplified abstract (Intel Corporation)
- 17848639. SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE simplified abstract (Intel Corporation)
- 17872473. CHIP PACKAGE ASSEMBLY, ELECTRONIC DEVICE, AND PREPARATION METHOD OF CHIP PACKAGE ASSEMBLY simplified abstract (Huawei Technologies Co., Ltd.)
- 17874404. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17888324. SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.)
- 17914235. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17914235. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (Chengdu BOE Optoelectronics Technology Co., Ltd.)
- 17924814. Electronic Device and Chip Packaging Method simplified abstract (Honor Device Co., Ltd.)
- 17929159. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17932209. DIE PACKAGE WITH SEALED DIE ENCLOSURES simplified abstract (QUALCOMM Incorporated)
- 17932788. ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION simplified abstract (QUALCOMM Incorporated)
- 17981176. DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 18048495. ON-CHIP SHIELDED DEVICE simplified abstract (NXP B.V.)
- 18054211. PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS simplified abstract (Intel Corporation)
- 18059703. SLOTTED ABSORBER simplified abstract (Cisco Technology, Inc.)
- 18061763. Semiconductor package with an antenna substrate simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18067565. THROUGH MOLDING CONTACT ENABLED EMI SHIELDING simplified abstract (QUALCOMM Incorporated)
- 18070708. ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCONNECT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18071972. MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18090608. MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18114085. ISOLATOR simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18119784. SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18124653. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18155672. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18169662. Electromagnetic Interference Shield with Thermal Conductivity simplified abstract (Apple Inc.)
- 18189110. INTEGRATED DEVICE COMPRISING AN INDUCTOR AND A PATTERNED SHIELD STRUCTURE simplified abstract (QUALCOMM Incorporated)
- 18244474. ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18244556. ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18284068. POWER SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18295518. MAGNETIC SHIELDING FOR MAGNETO RESISTIVE MEMORY simplified abstract (Honeywell International Inc.)
- 18301450. SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18303659. SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18342182. SOLID STATE DRIVE APPARATUS AND DATA STORAGE APPARATUS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18361099. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18376467. CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18394974. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation)
- 18401815. Conductive Traces in Semiconductor Devices and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18426153. SHIELDED RADIO-FREQUENCY DEVICES simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18429039. FABRICATION METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18435107. ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL HAVING PHASE CHANGE MATERIAL simplified abstract (Samsung Electronics Co., Ltd.)
- 18466844. Package Substrates with Stiffener Interposers (Intel Corporation)
- 18475926. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18479820. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18484311. DEVICES AND METHODS RELATED TO STACK ASSEMBLY simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18485523. WIRE BOND ELECTROMAGNETIC INTERFERENCE (EMI) CAGE TO BLOCK TRANSMISSION AND RECEIPT OF EMI AT AN OPTICAL EMISSIONS COMPONENT (STMicroelectronics International N.V.)
- 18498188. PASSIVE COMPONENT MODULE simplified abstract (Texas Instruments Incorporated)
- 18505135. RADIO FREQUENCY DEVICE (UNITED MICROELECTRONICS CORP.)
- 18513376. PACKAGED MODULE WITH ANTENNA AND FRONT END INTEGRATED CIRCUIT simplified abstract (Skyworks Solutions, Inc.)
- 18559516. HIGH-FREQUENCY SEMICONDUCTOR PACKAGE simplified abstract (Mitsubishi Electric Corporation)
- 18583425. SEMICONDUCTOR PACKAGE INCLUDING SHIELD LAYER AND METHOD OF MANUFACTURING THE SAME simplified abstract (SK hynix Inc.)
- 18583970. RADIO FREQUENCY MODULE, COMMUNICATION DEVICE, AND METHOD OF MANUFACTURING RADIO FREQUENCY MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18590718. SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18595729. POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18595905. SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS simplified abstract (Texas Instruments Incorporated)
- 18596488. ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract (Intel Corporation)
- 18603174. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18616674. SEMICONDUCTOR DEVICE AND METHODS OF FORMATION (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18616704. SEMICONDUCTOR STRUCTURE WITH ELECTROMAGNETIC INTERFERENCE IMMUNITY (Apple Inc.)
- 18641782. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18671764. CIRCUIT SYSTEMS simplified abstract (Snap Inc.)
- 18673328. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18734122. CHIP SYSTEM AND COMMUNICATION DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18754738. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18760146. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD (Samsung Electronics Co., Ltd.)
- 18802281. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (Realtek Semiconductor Corp.)
- 18894714. SEMICONDUCTOR PACKAGES (SK hynix Inc.)
- 18906004. SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18920479. SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES, AND METHODS FOR MAKING THE SAME (Micron Technology, Inc.)
- 18921192. HIGH-FREQUENCY CIRCUIT COMPONENT (Murata Manufacturing Co., Ltd.)
- 18943337. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18947350. RADIO FREQUENCY MODULE (Murata Manufacturing Co., Ltd.)
- 18958845. SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING AND METHOD OF MANUFACTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 19007957. ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE POSTS (SILICONWARE PRECISION INDUSTRIES CO., LTD.)
- 19018452. Transient Stabilized SOI FETs (pSemi Corporation)
- 19020580. SYSTEM AND METHOD FOR GROUND FENCING (Apple Inc.)
2
A
- Apple inc. (20240243113). THIN SYSTEM-IN-PACKAGE WITH SHIELDED STEPPED MOLD simplified abstract
- Apple inc. (20250112172). SEMICONDUCTOR STRUCTURE WITH ELECTROMAGNETIC INTERFERENCE IMMUNITY
- Apple inc. (20250149782). SYSTEM AND METHOD FOR GROUND FENCING
- Apple Inc. patent applications on April 3rd, 2025
- Apple Inc. patent applications on February 29th, 2024
- Apple Inc. patent applications on July 18th, 2024
- Apple Inc. patent applications on May 8th, 2025
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H
I
- Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract
- Intel corporation (20240162191). PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS simplified abstract
- Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract
- Intel corporation (20240266745). MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract
- Intel corporation (20240355778). EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESSORS FOR DIE TO PLATFORM AND DIE-DIE RF NOISE SUPPRESSION simplified abstract
- Intel corporation (20240413066). EMBEDDED SEMICONDUCTOR DEVICE
- Intel corporation (20240429117). DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC CONSTANTS COUPLED TO A DIE THAT INCLUDES INTEGRATED CIRCUITRY
- Intel corporation (20250096154). Package Substrates with Stiffener Interposers
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on August 8th, 2024
- Intel Corporation patent applications on December 12th, 2024
- Intel Corporation patent applications on December 26th, 2024
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on March 20th, 2025
- Intel Corporation patent applications on May 16th, 2024
- Intel Corporation patent applications on October 24th, 2024
L
M
- Micron technology, inc. (20250149416). SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES, AND METHODS FOR MAKING THE SAME
- Micron Technology, Inc. patent applications on February 15th, 2024
- Micron Technology, Inc. patent applications on May 8th, 2025
- Mitsubishi electric corporation (20240234338). HIGH-FREQUENCY SEMICONDUCTOR PACKAGE simplified abstract
- Mitsubishi electric corporation (20240266715). ANTENNA simplified abstract
- Mitsubishi Electric Corporation patent applications on August 8th, 2024
- Mitsubishi Electric Corporation patent applications on July 11th, 2024
- Murata manufacturing co., ltd. (20240250013). RADIO FREQUENCY MODULE, COMMUNICATION DEVICE, AND METHOD OF MANUFACTURING RADIO FREQUENCY MODULE simplified abstract
- Murata manufacturing co., ltd. (20240266240). MODULE simplified abstract
- Murata manufacturing co., ltd. (20250070037). RADIO FREQUENCY MODULE
- Murata manufacturing co., ltd. (20250149472). HIGH-FREQUENCY CIRCUIT COMPONENT
- Murata Manufacturing Co., Ltd. patent applications on August 8th, 2024
- Murata Manufacturing Co., Ltd. patent applications on February 27th, 2025
- Murata Manufacturing Co., Ltd. patent applications on January 18th, 2024
- Murata Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Murata Manufacturing Co., Ltd. patent applications on May 8th, 2025
Q
- Qualcomm incorporated (20240096817). ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION simplified abstract
- Qualcomm incorporated (20240203895). THROUGH MOLDING CONTACT ENABLED EMI SHIELDING simplified abstract
- Qualcomm incorporated (20240321936). INTEGRATED DEVICE COMPRISING AN INDUCTOR AND A PATTERNED SHIELD STRUCTURE simplified abstract
- QUALCOMM Incorporated patent applications on January 18th, 2024
- QUALCOMM Incorporated patent applications on June 20th, 2024
- QUALCOMM Incorporated patent applications on March 14th, 2024
- QUALCOMM Incorporated patent applications on March 21st, 2024
- QUALCOMM Incorporated patent applications on September 26th, 2024
S
- Samsung display co., ltd. (20240215420). ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung Display Co., LTD. patent applications on June 27th, 2024
- Samsung electronics co., ltd. (20240162213). CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240194614). SOLID STATE DRIVE APPARATUS AND DATA STORAGE APPARATUS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240203903). SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240213177). FABRICATION METHOD OF SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240304557). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240304564). ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Samsung electronics co., ltd. (20240304565). ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL HAVING PHASE CHANGE MATERIAL simplified abstract
- Samsung electronics co., ltd. (20250069979). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250079279). ELECTRONIC DEVICE INCLUDING A SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
- Samsung electronics co., ltd. (20250079425). Semiconductor Package
- Samsung electronics co., ltd. (20250087596). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250096179). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250118681). SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
- Samsung electronics co., ltd. (20250125280). SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Samsung Electronics Co., Ltd. patent applications on April 10th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 10th, 2025
- Samsung Electronics Co., Ltd. patent applications on April 17th, 2025
- Samsung Electronics Co., Ltd. patent applications on February 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 23rd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 23rd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 30th, 2025
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 13th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 12th, 2024
- Sk hynix inc. (20240321770). SEMICONDUCTOR PACKAGE INCLUDING SHIELD LAYER AND METHOD OF MANUFACTURING THE SAME simplified abstract
- SK hynix Inc. patent applications on September 26th, 2024
- Snap inc. (20240312927). CIRCUIT SYSTEMS simplified abstract
- Snap Inc. patent applications on September 19th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240222291). SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312930). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250087598). SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING AND METHOD OF MANUFACTURE
- Taiwan semiconductor manufacturing co., ltd. (20250118710). SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 10th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 30th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240136280). Conductive Traces in Semiconductor Devices and Methods of Forming Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258287). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Taiwan semiconductor manufacturing company, ltd. (20240258287). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347576). SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379475). PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379581). ELECTROMAGNETIC SHIELDING STRUCTURE FOR A SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- Texas instruments incorporated (20240178154). ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCONNECT simplified abstract
- Texas instruments incorporated (20240178155). MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD simplified abstract
- Texas instruments incorporated (20240258245). MOLDED MODULE PACKAGE WITH AN EMI SHIELDING BARRIER simplified abstract