Murata manufacturing co., ltd. (20250149472). HIGH-FREQUENCY CIRCUIT COMPONENT
HIGH-FREQUENCY CIRCUIT COMPONENT
Organization Name
murata manufacturing co., ltd.
Inventor(s)
Hisatoshi Kawabata of Nagaokakyo-shi JP
Mari Saji of Nagaokakyo-shi JP
HIGH-FREQUENCY CIRCUIT COMPONENT
This abstract first appeared for US patent application 20250149472 titled 'HIGH-FREQUENCY CIRCUIT COMPONENT
Original Abstract Submitted
a first chip includes a first insulating layer, a first device layer laminated on the first insulating layer, a first multilayer wiring layer laminated on the first device layer, and a first anchor. a high-frequency circuit is in the first chip. a second chip includes a substrate, a second multilayer wiring layer on the substrate, and a second anchor. a control circuit that controls the high-frequency circuit is in the second chip. the first anchor is embedded in the first device layer and the first insulating layer, and exposed from a surface of the first insulating layer. the second anchor is embedded in the second multilayer wiring layer, and exposed from a surface of the second multilayer wiring layer. the first and second anchors are formed from an identical metal material.