Murata Manufacturing Co., Ltd. patent applications on May 8th, 2025
Patent Applications by Murata Manufacturing Co., Ltd. on May 8th, 2025
Murata Manufacturing Co., Ltd.: 29 patent applications
Murata Manufacturing Co., Ltd. has applied for patents in the areas of H03H9/02 (4), H03H9/25 (3), H01G4/30 (3), H01G4/232 (3), H10N30/87 (2) H03H9/14541 (2), A61B5/02007 (1), H01L23/66 (1), H10N30/8542 (1), H03H9/6496 (1)
With keywords such as: layer, electrode, surface, direction, substrate, component, main, portion, region, and piezoelectric in patent application abstracts.
Patent Applications by Murata Manufacturing Co., Ltd.
Inventor(s): Toru SHIMUTA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): A61B5/02, A61B5/00, A61B5/021, G16H50/30
CPC Code(s): A61B5/02007
Abstract: a pulse wave measurement unit is provided that generates a pulse wave signal based on a measurement result from a pulse wave sensor attached to a site farther from the heart than a pressurization site that is pressurized for vascular occlusion. a peripheral blood pressure index calculation unit calculates a peripheral blood pressure index related to steepness of a rise per beat of the pulse wave signal generated by the pulse wave measurement unit. a vascular endothelial function evaluation unit evaluates vascular endothelial function, based on a calculated value of the peripheral blood pressure index from a time point of vascular occlusion release until an evaluation duration elapses.
Inventor(s): Sadaaki SAKAMOTO of Nagaokakyo-shi JP for murata manufacturing co., ltd., Yasutaka SUGIMOTO of Nagaokakyo-shi JP for murata manufacturing co., ltd., Satoru ADACHI of Nagaokakyo-Shi JP for murata manufacturing co., ltd.
IPC Code(s): C03C14/00
CPC Code(s): C03C14/006
Abstract: a low-temperature fired ceramic containing: a fired glass component that contains bo, sio, and an alkaline earth metal oxide and excluding lio, and a percentage of the alkaline earth metal oxide in the fired glass component is 10 mol % or less; and one or more oxides of ceramic crystalline components.
20250146894. OPTICAL SENSOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hiroshi WATANABE of Nagaokakyo-shi JP for murata manufacturing co., ltd., Koichi INOUE of Nagaokakyo-shi JP for murata manufacturing co., ltd., Takatoshi KATO of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): G01L5/105, G01S7/48, G01S7/481, G01S17/48
CPC Code(s): G01L5/105
Abstract: an optical sensor includes two light emitters with the same or substantially the same temperature dependence of luminous intensity of light. a reflector reflects and diffuses light emitted by the light emitters such that a portion of the reflected light is incident on a light receiver. an elastic support supports the reflector, and deforms and changes a relative position of the reflector and the light emitters and the light receiver. a processor calculates a physical quantity depending on an amount of deformation of the elastic support based a ratio between two amounts of light received by the light receiver when respective light emitters emit light at different timings. the light emitters and the light receiver are fixed relative to each other, and a distance from one of the light emitters to the light receiver is different from a distance from another of the light emitters to the light receiver.
Inventor(s): Masaki NAGATA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Yasuhiro SHIMIZU of Nagaokakyo-shi JP for murata manufacturing co., ltd., Yuji MIURA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Kazuki NAGASHIMA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Tatsuya TOMIMURA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Naoya MORI of Nagaokakyo-shi JP for murata manufacturing co., ltd., Yutaka SENSHU of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): G02B6/42
CPC Code(s): G02B6/4214
Abstract: a method of manufacturing an optical coupler that includes: preparing a light-transmitting substrate having a first main surface and a second main surface aligned in a first direction; applying a first photosensitive glass paste containing a first filler to the first main surface; arranging a grayscale mask formed in a binary pattern on the second main surface; emitting an ultraviolet ray to the second main surface to expose the first photosensitive glass paste; removing the grayscale mask from the second main surface and developing the first photosensitive glass paste; and removing the light-transmitting substrate from the first photosensitive glass paste developed and curing the first photosensitive glass paste, wherein a longest length of the first filler is larger than a wavelength of the ultraviolet ray.
Inventor(s): Mitsuru NAKANO of Nagaokakyo-shi JP for murata manufacturing co., ltd., Hiroshi SHIRAKI of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01C1/034, H01C1/14, H01C7/04, H01C17/02
CPC Code(s): H01C1/034
Abstract: an electronic component includes a base body and an alumina film covering an outer surface of the base body. the alumina film includes a film-shaped part made of alumina and in contact with the outer surface of the base body, and a particle layer located on the outer surface side of the film-shaped part. the particle layer includes a plurality of alumina particles bonded to the outer surface of the film-shaped part. the average value of the thicknesses of the alumina film including the film-shaped part and the particle layer is 0.05 �m or more and 2.0 �m or less. the interval between the particles is 1.3 �m or less.
Inventor(s): Kano HYOUI of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01F1/44, C08G18/48, C08G18/76, C08K3/08, C08K5/12
CPC Code(s): H01F1/447
Abstract: a magnetorheological elastomer composition that includes: a resin (a); a magnetic powder (b); and a plasticizer (c). the resin (a) contains a urethane resin (a1) having an average inter-crosslinking point molecular weight of 9,500 to 27,000, and the urethane resin (a1) contains a reaction product of a polyol (x) and a polyisocyanate (y). the polyol (x) contains a triol (x1) having a number-average molecular weight of 4,000 or more.
20250149218. INDUCTOR COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Tetsurou KAWAKAMI of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01F5/04, H01F5/06, H01F17/02
CPC Code(s): H01F5/04
Abstract: an inductor component includes an insulating body, and a coil inside the body and wound around an axis. the coil includes a first coil wiring layer that extends in a direction intersecting with a first direction parallel to the axis, and a second coil wiring layer that is away from the first coil wiring layer in an axis direction and extends in a direction intersecting with the axis direction. the first and second coil wiring layers configure a facing portion in which they face each other with an interlayer insulating portion, which is part of the body, between them. in a cross section, of the facing portion, orthogonal to an extending direction of the first coil wiring layer, the first coil wiring layer has a first upper surface that is on an interlayer insulating portion side.
Inventor(s): Eiji TERAOKA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Hirokazu TAKASHIMA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01G4/12, H01G4/012, H01G4/228, H01G4/30
CPC Code(s): H01G4/12
Abstract: an electronic component includes a laminate in which first internal electrodes and second internal electrodes are alternately laminated in a lamination direction with dielectric layers interposed therebetween, the laminate including a first main surface and a second main surface opposite to each other in the lamination direction, a first side surface and a second side surface opposite to each other in a width direction, and a first end surface and a second end surface opposite to each other in a length direction, a first external electrode provided on a surface of the laminate and electrically connected to the first internal electrodes, a second external electrode provided on a surface of the laminate and electrically connected to the second internal electrodes, and side margin portions each including a dielectric including ca, zr, and ti.
Inventor(s): Noriyuki OOKAWA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Toshihiko KOBAYASHI of Nagaokakyo-shi JP for murata manufacturing co., ltd., Tomochika MIYAZAKI of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01G4/232, H01G4/30
CPC Code(s): H01G4/2325
Abstract: an electronic component includes a base body, and a first internal electrode and a second internal electrode located inside the base body. in addition, the electronic component includes a first external electrode and a second external electrode that cover a part of the outer surface of the base body and do not contain a silver component. the first external electrode includes a first electrode covering a part of the outer surface of the base body and connected to the first internal electrode, and a second electrode covering the outer surface of the first electrode. the second electrode contains copper particles and a silicone resin as a synthetic resin. when viewed in a specific section including the first electrode and the second electrode, the copper particles of the second electrode are in line contact with the outer surface of the first electrode.
Inventor(s): Noriyuki OOKAWA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01G4/30, H01G4/012, H01G4/232
CPC Code(s): H01G4/30
Abstract: an electronic component includes a base body, a first internal electrode, and a first external electrode. the first internal electrode is located inside the base body. the first external electrode covers a part of the outer surface of the base body. the first external electrode includes a first electrode covering a part of the outer surface of the base body and connected to the first internal electrode, and a second electrode covering the outer surface of the first electrode. the second electrode has spherical copper particles and silicon. an average size of the spherical copper particles is different in a first part of the second electrode than in a second part of the spherical electrode.
Inventor(s): Toshimitsu MITA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01G9/15, H01G9/00, H01G9/26
CPC Code(s): H01G9/15
Abstract: a solid electrolytic capacitor element that includes: a valve acting metal substrate including a metal substrate layer and a porous layer on the metal substrate layer and having an anode terminal region and a cathode formation region; a dielectric layer on a surface of the porous layer in the cathode formation region; a solid electrolyte layer on the dielectric layer in the cathode formation region; a conductive layer on the solid electrolyte layer; and a mask having: a first portion dividing the valve acting metal substrate into the anode terminal region and the cathode formation region and in direct contact with the porous layer or in indirect contact with the porous layer via the dielectric layer, a second portion covering the solid electrolyte layer on the porous layer, and the mask does not cover the conductive layer.
Inventor(s): Katsuhiko TOKUDA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Takeshi FURUKAWA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01G9/26, H01G9/15
CPC Code(s): H01G9/26
Abstract: a solid electrolytic capacitor that includes: an anode plate including a porous layer at least on at least one a main surface thereof; a dielectric layer on a surface of the porous layer; a solid electrolyte layer on a surface of the dielectric layer; a conductor layer on a surface of the solid electrolyte layer; and an insulating layer on the surface of the dielectric layer, wherein the insulating layer covers at least a part of an end portion of the solid electrolyte layer in a region surrounding the solid electrolyte layer.
Inventor(s): Tatsuya FUNAKI of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01L23/498, H01L21/304, H01L21/683, H01L21/768, H01L23/48
CPC Code(s): H01L23/49822
Abstract: a composite component device including two or more composite component layers having an electronic component layer and a rewiring layer on the electronic component layer. the two or more composite component layers are laminated in a thickness direction such that the electronic component layer and the rewiring layer are alternately disposed, and the electronic component layer has one or more electronic components having an electronic component main body having a first surface perpendicular to the thickness direction and a second surface opposed to the first surface; and component electrodes on the first surface. the component electrode of the one or more electronic components is electrically connected to the rewiring layer, and an electronic component layer in a composite component layer adjacent to the rewiring layer of two or more composite component layers has an electronic component layer through-via electrically connected to the rewiring layer of another composite component layer.
20250149472. HIGH-FREQUENCY CIRCUIT COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hisatoshi KAWABATA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Mari SAJI of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01L23/66, H01L23/32, H01L23/528, H01L23/552, H01L25/16
CPC Code(s): H01L23/66
Abstract: a first chip includes a first insulating layer, a first device layer laminated on the first insulating layer, a first multilayer wiring layer laminated on the first device layer, and a first anchor. a high-frequency circuit is in the first chip. a second chip includes a substrate, a second multilayer wiring layer on the substrate, and a second anchor. a control circuit that controls the high-frequency circuit is in the second chip. the first anchor is embedded in the first device layer and the first insulating layer, and exposed from a surface of the first insulating layer. the second anchor is embedded in the second multilayer wiring layer, and exposed from a surface of the second multilayer wiring layer. the first and second anchors are formed from an identical metal material.
20250149659. SOLID-STATE BATTERY MODULE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Tomohiro KATO of Nagaokayo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01M10/42, H01M10/615, H02J50/12
CPC Code(s): H01M10/425
Abstract: a solid-state battery module including a substrate; a solid-state battery on the substrate; and a wireless power supply circuit including a capacitor, in which at least the capacitor and the solid-state battery are on a same main surface side of the substrate.
20250149689. PACKAGED SOLID-STATE BATTERY_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Takayuki NAGANO of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01M50/11, H01M10/0585, H01M50/119, H01M50/121, H01M50/124
CPC Code(s): H01M50/11
Abstract: a packaged solid-state battery including: a substrate; a solid-state battery with an end surface electrode on the substrate; and an exterior portion covering the solid-state battery so as to define a gap portion between the end surface electrode and the exterior portion. the exterior portion contains a resin.
Inventor(s): Takashi KASASHIMA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01M50/533, H01M10/058, H01M50/46
CPC Code(s): H01M50/533
Abstract: a solid-state battery that includes: a plurality of solid-state battery elements in which a positive electrode layer, a negative electrode layer, and a solid-state electrolyte layer interposed therebetween are stacked; and an interlayer conductive layer sandwiched between the positive or the negative electrode layer of a first solid-state battery element and the positive or the negative electrode layer of a second solid-state battery element of the plurality of solid-state battery elements, wherein the positive or the negative electrode layer sandwiching the interlayer conductive layer contains a solid-state electrolyte, a solid-state electrolyte ratio of the positive or the negative electrode layer sandwiching the interlayer conductive layer is 40 wt % to 60 wt % based on an entirety of the positive or the negative electrode layer, and a solid-state electrolyte ratio of the interlayer conductive layer is 10 wt % to 35 wt % based on an entirety of the interlayer conductive layer.
Inventor(s): Kaoru SUDO of Nagaokakyo-shi JP for murata manufacturing co., ltd., Jumpei TAKABAYASHI of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H01Q5/20, H01Q1/27, H01Q1/48, H01Q5/10, H01Q9/04
CPC Code(s): H01Q5/20
Abstract: an antenna module includes a ground electrode disposed in a dielectric substrate (and radiating elements and feed wiring lines. the radiating elements are disposed to face the ground electrode. the feed wiring lines transmit radio frequency signals to the radiating elements. the radiating element is disposed between the radiating element and the ground electrode. the radiating element is disposed between the radiating element and the ground electrode. the radiating element is larger in size than the radiating element, and the radiating element is larger in size than the radiating element. in plan view in a direction normal to the dielectric substrate, the radiating elements are disposed to overlap with each other. the feed wiring line transmits a radio frequency signal to the radiating element. the feed wiring line transmits a radio frequency signal to the radiating elements.
Inventor(s): David GIULIANO of Bedford NH US for murata manufacturing co., ltd., Kazunori TSUDA of Cambridge MA US for murata manufacturing co., ltd.
IPC Code(s): H02M1/00, H02M1/14, H02M3/07, H02M3/158
CPC Code(s): H02M1/0095
Abstract: disclosed embodiments include a hybrid power converter including a switched capacitor converter and a buck converter in parallel where the buck converter is operated in an open loop and non-regulated mode; the switched capacitor converter and the buck converter are connected to an input terminal, where the switched capacitor converter operates in an open loop and non-regulated mode and provides power to a load based on an input voltage, the buck converter operates in an open loop mode and provides power to the load based on the voltage of the input terminal, and the controller enables the buck converter to provide power to the load based on at least one of a voltage of the load or a current of the load.
20250150043. POWER AMPLIFIER CIRCUIT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Makoto TABEI of Kyoto JP for murata manufacturing co., ltd.
IPC Code(s): H03F3/21
CPC Code(s): H03F3/21
Abstract: a power amplifier circuit includes: a first switch circuit that switches conduction and non-conduction between a node between the drive stage amplifier and the power stage amplifier and an output terminal, and a second switch circuit that switches conduction and non-conduction between the power stage amplifier and the output terminal. the power amplifier circuit has a first mode in which the first switch circuit is made conductive and the second switch circuit is made non-conductive, and a second mode in which the first switch circuit is made non-conductive and the second switch circuit is made conductive. the power amplifier circuit makes, when shifting from the first mode to the second mode, the first switch circuit non-conductive after making the second switch circuit conductive, and makes, when shifting from the second mode to the first mode, the second switch circuit non-conductive after making the first switch circuit conductive.
20250150050. ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Takaaki MIZUNO of Nagaokakyo-shi JP for murata manufacturing co., ltd., Toshiyuki NAKAISO of Nagaokakyo-shi JP for murata manufacturing co., ltd., Kenji TOYOSHIMA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Yoshimasa YOSHIOKA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H03H1/00, H03H11/04, H03H11/28
CPC Code(s): H03H1/00
Abstract: an electronic component is provided that includes a substrate, an insulator layer expanding over a surface of the substrate, a planar conductor on the substrate or in the insulator layer and expanding in a plane parallel to the surface of the substrate, and an inductor conductor pattern on the insulator layer or in the insulator layer. when viewed in a direction perpendicular to the surface of the substrate, a length in a longitudinal direction of a region in which a region with the inductor conductor pattern overlapping the planar conductor is represented by ls, and a distance between the inductor conductor pattern and the planar conductor is represented by d, such that ls/d is 1 or more and 60 or less.
Inventor(s): Gregory L. HEY-SHIPTON of Santa Barbara CA US for murata manufacturing co., ltd., Neal FENZI of Santa Barbara CA US for murata manufacturing co., ltd., Mike EDDY of Santa Barbara CA US for murata manufacturing co., ltd., Ventsislav YANTCHEV of Sofia BG for murata manufacturing co., ltd.
IPC Code(s): H03H9/02, H03H3/02, H03H9/13, H03H9/17, H03H9/56
CPC Code(s): H03H9/02228
Abstract: resonator devices and filter devices are disclosed. a radio frequency filter includes substrate; a piezoelectric layer; a conductor pattern comprising a plurality of interdigital transducers (idts) on the piezoelectric layer; and an acoustic bragg reflector between the substrate and the piezoelectric layer. the plurality of idts comprises a first idt of first acoustic resonator and a second idt of a second acoustic resonator. moreover, a first thickness of the piezoelectric layer under the first idt is greater than a second thickness of piezoelectric layer under the second idt.
20250150056. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yasumasa TANIGUCHI of Nagaokakyo-shi JP for murata manufacturing co., ltd., Haruki KYOUYA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Daisuke TAMAZAKI of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H03H9/145, C22C21/12, H03H9/02, H03H9/25
CPC Code(s): H03H9/14541
Abstract: an acoustic wave device includes a piezoelectric substrate and an interdigital transducer electrode on the piezoelectric substrate. the interdigital transducer electrode includes a close-contact layer on the piezoelectric substrate, a cuâal alloy layer on the close-contact layer, and an al electrode layer on the cuâal alloy layer and having a weight-percentage concentration, in % by weight, of al of greater than about 50% by weight. the cuâal alloy layer and the al electrode layer are epitaxial layers. a thickness of the cuâal alloy layer is about 40% or less of a total thickness of the cuâal alloy layer and the al electrode layer.
20250150057. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hiromu OKUNAGA of Nagaokakyo-shi JP for murata manufacturing co., ltd., Hideki IWAMOTO of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H03H9/145, H03H9/02, H03H9/25
CPC Code(s): H03H9/14541
Abstract: an acoustic wave device includes a support board, an intermediate layer on the support board, a piezoelectric layer on the intermediate layer, and including first and second main surfaces, a first idt electrode at the first main surface, and embedded in the intermediate layer, and a second idt electrode at the second main surface. the first idt electrode includes electrode fingers each including first and second surfaces opposed to each other in a thickness direction of the electrode fingers, and a side surface connected to the first and second surfaces. the side surface of each of the electrode fingers includes first and second portions, and in at least one of the electrode fingers, the first and second portions have different angles of inclination with respect to the thickness direction.
Inventor(s): Hidetaro NAKAZAWA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H03H9/64, H03H9/02, H03H9/25
CPC Code(s): H03H9/6496
Abstract: an acoustic wave element includes a first idt electrode and first reflectors on a first main surface of a piezoelectric layer and a second idt electrode and second reflectors on a second main surface of the piezoelectric layer. when a region between the first reflectors in a first direction is a first region, a region between the second reflectors in the first direction is a second region, and a minimum region including the first and second regions as viewed in a third direction orthogonal or substantially orthogonal to the first and second directions is an inter-reflector region, in an end region of the inter-reflector region in the first direction, a region is provided in which none of the first and second electrode fingers face each other in the third direction.
Inventor(s): Hiroyuki HAYASHI of Nagaokakyo-shi JP for murata manufacturing co., ltd., Souta ONO of Nagaokakyo-shi JP for murata manufacturing co., ltd., Yasunari MIWA of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H10N30/853, C04B35/495, C04B35/64, C04B37/00, C04B41/00, C04B41/45, C04B41/51, C04B41/88, H10N30/053, H10N30/50, H10N30/87
CPC Code(s): H10N30/8542
Abstract: a piezoelectric element that includes a piezoelectric ceramic layer made of a ceramic sintered body having a main phase containing k, na, nb, and mn, and a first secondary phase containing mn and nb. the piezoelectric element may further include an internal electrode layer containing ni as a main component thereof on at least one main surface of the piezoelectric ceramic layer, and the ceramic sintered body may further have a second secondary phase containing mn and ni.
Inventor(s): Kenichi MORI of Nagaokakyo-shi JP for murata manufacturing co., ltd., Hiroyuki KUBO of Nagaokakyo-shi JP for murata manufacturing co., ltd.
IPC Code(s): H10N30/87, G01B7/16, H10N30/30, H10N30/857
CPC Code(s): H10N30/875
Abstract: a sensor includes a piezoelectric film having a first and second main surfaces facing each other in a first direction, a first electrode on the first main surface, a second electrode on the second main surface, and a wiring portion. the first electrode and the second electrode overlap each other in the first direction and include a first portion overlapping the piezoelectric film and a second portion that does not overlap the piezoelectric film, the first portion and the second portion are arranged in a second direction orthogonal to the first direction, and the wiring portion includes a wiring substrate overlapping the second portion in the first direction and having a third and a fourth main surface, a first conductor on the third main surface and electrically connected to the first electrode, and a second conductor on the fourth main surface and electrically connected to the second electrode.
Murata Manufacturing Co., Ltd. patent applications on May 8th, 2025
- Murata Manufacturing Co., Ltd.
- A61B5/02
- A61B5/00
- A61B5/021
- G16H50/30
- CPC A61B5/02007
- Murata manufacturing co., ltd.
- C03C14/00
- CPC C03C14/006
- G01L5/105
- G01S7/48
- G01S7/481
- G01S17/48
- CPC G01L5/105
- G02B6/42
- CPC G02B6/4214
- H01C1/034
- H01C1/14
- H01C7/04
- H01C17/02
- CPC H01C1/034
- H01F1/44
- C08G18/48
- C08G18/76
- C08K3/08
- C08K5/12
- CPC H01F1/447
- H01F5/04
- H01F5/06
- H01F17/02
- CPC H01F5/04
- H01G4/12
- H01G4/012
- H01G4/228
- H01G4/30
- CPC H01G4/12
- H01G4/232
- CPC H01G4/2325
- CPC H01G4/30
- H01G9/15
- H01G9/00
- H01G9/26
- CPC H01G9/15
- CPC H01G9/26
- H01L23/498
- H01L21/304
- H01L21/683
- H01L21/768
- H01L23/48
- CPC H01L23/49822
- H01L23/66
- H01L23/32
- H01L23/528
- H01L23/552
- H01L25/16
- CPC H01L23/66
- H01M10/42
- H01M10/615
- H02J50/12
- CPC H01M10/425
- H01M50/11
- H01M10/0585
- H01M50/119
- H01M50/121
- H01M50/124
- CPC H01M50/11
- H01M50/533
- H01M10/058
- H01M50/46
- CPC H01M50/533
- H01Q5/20
- H01Q1/27
- H01Q1/48
- H01Q5/10
- H01Q9/04
- CPC H01Q5/20
- H02M1/00
- H02M1/14
- H02M3/07
- H02M3/158
- CPC H02M1/0095
- H03F3/21
- CPC H03F3/21
- H03H1/00
- H03H11/04
- H03H11/28
- CPC H03H1/00
- H03H9/02
- H03H3/02
- H03H9/13
- H03H9/17
- H03H9/56
- CPC H03H9/02228
- H03H9/145
- C22C21/12
- H03H9/25
- CPC H03H9/14541
- H03H9/64
- CPC H03H9/6496
- H10N30/853
- C04B35/495
- C04B35/64
- C04B37/00
- C04B41/00
- C04B41/45
- C04B41/51
- C04B41/88
- H10N30/053
- H10N30/50
- H10N30/87
- CPC H10N30/8542
- G01B7/16
- H10N30/30
- H10N30/857
- CPC H10N30/875