18921192. HIGH-FREQUENCY CIRCUIT COMPONENT (Murata Manufacturing Co., Ltd.)
HIGH-FREQUENCY CIRCUIT COMPONENT
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Hisatoshi Kawabata of Nagaokakyo-shi JP
Mari Saji of Nagaokakyo-shi JP
HIGH-FREQUENCY CIRCUIT COMPONENT
This abstract first appeared for US patent application 18921192 titled 'HIGH-FREQUENCY CIRCUIT COMPONENT
Original Abstract Submitted
A first chip includes a first insulating layer, a first device layer laminated on the first insulating layer, a first multilayer wiring layer laminated on the first device layer, and a first anchor. A high-frequency circuit is in the first chip. A second chip includes a substrate, a second multilayer wiring layer on the substrate, and a second anchor. A control circuit that controls the high-frequency circuit is in the second chip. The first anchor is embedded in the first device layer and the first insulating layer, and exposed from a surface of the first insulating layer. The second anchor is embedded in the second multilayer wiring layer, and exposed from a surface of the second multilayer wiring layer. The first and second anchors are formed from an identical metal material.